ComputerAided_Design_Engineering_amp_Manufactur.pdf
ComputerAided_Design_Engineering_amp_Manufactur.pdf
ComputerAided_Design_Engineering_amp_Manufactur.pdf
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Side Carrier<br />
In cases where a center carrying scheme cannot be used, a side carrier approach can be used. Here, the<br />
workpiece will be carried by scrap webs at one or both sides of the strip.<br />
When a side carrier scheme is used, the punch decomposition process will generate punch strips such<br />
that thin strips of web are provided at the sides of the strip to carry the workpiece. The parting punches<br />
will be selected from the scrap sections which satisfy these conditions:<br />
1. Scrap areas that connect the edge of the strip to the workpiece<br />
2. Scrap areas that are not adjacent to folded portions of the workpiece<br />
3. Scrap areas with sizes greater than a minimal value to provide sufficient strength to carry the<br />
workpieces.<br />
7.7 Spatial Planning Techniques for Staging the Die Operations<br />
The final planning task in the development of the strip layout is the staging of the die operations such<br />
that when all the st<strong>amp</strong>ing operations have been completed on the strip in the progressive die, the<br />
required part is produced in the last stage. To automate the staging process, it is necessary to estimate<br />
the amount of die area each of the st<strong>amp</strong>ing operations requires. This can be achieved by developing<br />
rules and functions to derive the envelope area required to mount the respective tools in the die. For<br />
ex<strong>amp</strong>le, the amount of die area required by a punch will depend on the following factors:<br />
1. The size and shape of the punch<br />
2. The type of mounting arrangement at the punch plate<br />
3. The minimum distance between holes on the punch plate required to maintain structural strength<br />
and also to provide room for the operator to access the punch during assembly and replace the<br />
punch during operation. This can be represented by a user-defined die area expansion factor used<br />
to expand the envelope area derived using the first two factors.<br />
The functions to calculate the envelope areas for the st<strong>amp</strong>ing operations can be stored as monitors<br />
in the object representation of the features in the knowledge base. When the staging task is performed,<br />
these monitors will be fired and the envelope areas calculated when needed.<br />
The strip layout can be derived automatically by staging the die operations in the following order:<br />
1. Piercing operations on pilot holes are staged first.<br />
2. Piercing operations on other internal holes are staged next.<br />
3. Notching operations of external profiles are staged next.<br />
4. Notching operations of external profiles used to accommodate indirect pilot holes (if any) are<br />
staged next.<br />
5. Bending operations are staged next.<br />
6. Cam operations (on precise holes on bend features of the workpiece) are staged next.<br />
7. Finally, the cut-off operations and internal holes used as semi-piloting holes (if any) are staged.<br />
During the staging process, the die operations are represented by their envelope areas and laid on<br />
the strip according to their priority. For envelope areas having the same priority, they are ordered<br />
according to their relative distance from the center of the strip. Those envelope areas further away<br />
from the center will be laid ahead of those nearer to the center. If an envelope area overlaps an existing<br />
one on the station, it will be carried to the next station. The staging process will continue until the<br />
envelope areas of all the die operations are laid on the strip. To reduce the time taken by the computer<br />
to check for the interference of envelope areas, the shapes of envelope areas are simplified to either<br />
rectangular or circular.<br />
The strip layout produced using the above heuristics will always attempt to achieve the smallest<br />
die area possible. The system can provide facilities for the user to control the final strip layout. First,<br />
the tightness of the die can be controlled by changing the die area expansion factor. If the factor is