PIC16F8X, 18-Pin FLASH/EEPROM 8-Bit MCU Data Sheet - Microchip

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PIC16F8X PIC16F83/84 11.4 DC CHARACTERISTICS: PIC16F84, PIC16F83 (Commercial, Industrial) PIC16LF84, PIC16F83 (Commercial, Industrial) DC Characteristics All Pins Except Power Supply Pins Standard Operating Conditions (unless otherwise stated) Operating temperature 0°C ≤ TA ≤ +70°C (commercial) -40°C ≤ TA ≤ +85°C (industrial) Operating voltage VDD range as described in DC spec Section 11.1 and Section 11.2. Parameter No. Sym Characteristic Capacitive Loading Specs on Output Pins Min Typ† Max Units Conditions D100 COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1. D101 CIO All I/O pins and OSC2 (RC mode) Data EEPROM Memory — — 50 pF D120 ED Endurance 1M 10M — E/W 25°C at 5V D121 VDRW VDD for read/write VMIN — 6.0 V VMIN = Minimum operating voltage D122 TDEW Erase/Write cycle time Program Flash Memory — 10 20* ms D130 EP Endurance 100 1000 — E/W D131 VPR VDD for read VMIN — 6.0 V VMIN = Minimum operating voltage D132 VPEW VDD for erase/write 4.5 — 5.5 V D133 TPEW Erase/Write cycle time — 10 — ms * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS30430C-page 80 © 1998 Microchip Technology Inc.
TABLE 11-2 TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created following one of the following formats: FIGURE 11-1: PARAMETER MEASUREMENT INFORMATION All timings are measure between high and low measurement points as indicated in the figures below. FIGURE 11-2: LOAD CONDITIONS PIC16F83/84 PIC16F8X 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase symbols (pp) and their meanings: pp 2 to os,osc OSC1 ck CLKOUT ost oscillator start-up timer cy cycle time pwrt power-up timer io I/O port rbt RBx pins inp INT pin t0 T0CKI mc MCLR wdt watchdog timer Uppercase symbols and their meanings: S F Fall P Period H High R Rise I Invalid (Hi-impedance) V Valid L Low Z High Impedance 0.7 VDD XTAL 0.8 VDD RC (High) 0.3 VDD XTAL 0.15 VDD RC (Low) OSC1 Measurement Points I/O Port Measurement Points Load Condition 1 Load Condition 2 Pin VDD/2 VSS RL CL RL = 464Ω CL = 50 pF for all pins except OSC2. 15 pF for OSC2 output. 0.9 VDD (High) 0.1 VDD (Low) © 1998 Microchip Technology Inc. DS30430C-page 81 Pin VSS CL
Page 1 and 2:
Devices Included in this Data Sheet
Page 3 and 4:
1.0 GENERAL DESCRIPTION The PIC16F8
Page 5 and 6:
2.0 PIC16F8X DEVICE VARIETIES A var
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3.0 ARCHITECTURAL OVERVIEW The high
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TABLE 3-1 PIC16F8X PINOUT DESCRIPTI
Page 11 and 12:
4.0 MEMORY ORGANIZATION There are t
Page 13 and 14:
FIGURE 4-1: REGISTER FILE MAP - PIC
Page 15 and 16:
4.2.2.1 STATUS REGISTER The STATUS
Page 17 and 18:
4.2.2.3 INTCON REGISTER The INTCON
Page 19 and 20:
4.5 Indirect Addressing; INDF and F
Page 21 and 22:
5.0 I/O PORTS The PIC16F8X has two
Page 23 and 24:
5.2 PORTB and TRISB Registers PORTB
Page 25 and 26:
5.3 I/O Programming Considerations
Page 27 and 28:
6.0 TIMER0 MODULE AND TMR0 REGISTER
Page 29 and 30: 6.2 Using TMR0 with External Clock
Page 31 and 32: 6.3.1 SWITCHING PRESCALER ASSIGNMEN
Page 33 and 34: 7.0 DATA EEPROM MEMORY The EEPROM d
Page 35 and 36: 7.5 Write Verify Depending on the a
Page 37 and 38: 8.0 SPECIAL FEATURES OF THE CPU Wha
Page 39 and 40: FIGURE 8-2: CONFIGURATION WORD - PI
Page 41 and 42: FIGURE 8-6: EXTERNAL SERIES RESONAN
Page 43 and 44: PIC16F8X TABLE 8-3 RESET CONDITION
Page 45 and 46: PIC16F8X FIGURE 8-10: TIME-OUT SEQU
Page 47 and 48: 8.7 Time-out Sequence and Power-dow
Page 49 and 50: FIGURE 8-17: INT PIN INTERRUPT TIMI
Page 51 and 52: 8.11 Watchdog Timer (WDT) The Watch
Page 53 and 54: 8.12.3 WAKE-UP USING INTERRUPTS Whe
Page 55 and 56: 9.0 INSTRUCTION SET SUMMARY Each PI
Page 57 and 58: 9.1 Instruction Descriptions ADDLW
Page 59 and 60: BTFSS Bit Test f, Skip if Set Synta
Page 61 and 62: COMF Complement f Syntax: [ label ]
Page 63 and 64: INCFSZ Increment f, Skip if 0 Synta
Page 65 and 66: NOP No Operation Syntax: [ label ]
Page 67 and 68: RLF Rotate Left f through Carry Syn
Page 69 and 70: SUBWF Subtract W from f Syntax: [ l
Page 71 and 72: 10.0 DEVELOPMENT SUPPORT 10.1 Devel
Page 73 and 74: MPASM has the following features to
Page 75 and 76: PIC16F83/84 PIC16F8X 11.0 ELECTRICA
Page 77 and 78: PIC16F83/84 PIC16F8X 11.1 DC CHARAC
Page 79: PIC16F83/84 PIC16F8X 11.3 DC CHARAC
Page 83 and 84: FIGURE 11-4: CLKOUT AND I/O TIMING
Page 85 and 86: FIGURE 11-6: TIMER0 CLOCK TIMINGS T
Page 87 and 88: PIC16CR83/84 PIC16F8X 12.0 ELECTRIC
Page 89 and 90: PIC16CR83/84 PIC16F8X 12.1 DC CHARA
Page 91 and 92: PIC16CR83/84 PIC16F8X 12.3 DC CHARA
Page 93 and 94: TABLE 12-2 TIMING PARAMETER SYMBOLO
Page 95 and 96: FIGURE 12-4: CLKOUT AND I/O TIMING
Page 97 and 98: FIGURE 12-6: TIMER0 CLOCK TIMINGS T
Page 99 and 100: 13.0 DC & AC CHARACTERISTICS GRAPHS
Page 101 and 102: FIGURE 13-3: TYPICAL RC OSCILLATOR
Page 103 and 104: FIGURE 13-8: VTH (INPUT THRESHOLD V
Page 105 and 106: FIGURE 13-11: TYPICAL IDD vs. FREQU
Page 107 and 108: FIGURE 13-13: WDT TIMER TIME-OUT PE
Page 109 and 110: FIGURE 13-17: IOH vs. VOH, VDD = 3
Page 111 and 112: 14.0 PACKAGING INFORMATION 14.1 Pac
Page 113 and 114: Package Type: K04-051 18-Lead Plast
Page 115 and 116: APPENDIX A: FEATURE IMPROVEMENTS -
Page 117 and 118: PIC16F8X APPENDIX E: CONVERSION CON
Page 119 and 120: INDEX Numerics 8.1 Configuration Bi
Page 121 and 122: ON-LINE SUPPORT Microchip provides
Page 123 and 124: PIC16F8X PRODUCT IDENTIFICATION SYS
Page 125: M AMERICAS Corporate Office 2355 We
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PIC16F8X, 18-Pin FLASH/EEPROM 8-Bit MCU Data Sheet - Microchip

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