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PIC16F8X, 18-Pin FLASH/EEPROM 8-Bit MCU Data Sheet - Microchip

PIC16F8X, 18-Pin FLASH/EEPROM 8-Bit MCU Data Sheet - Microchip

PIC16F8X, 18-Pin FLASH/EEPROM 8-Bit MCU Data Sheet - Microchip

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<strong>PIC16F8X</strong> PIC16CR83/84<br />

12.2 DC CHARACTERISTICS: PIC16LCR84, PIC16LCR83 (Commercial, Industrial)<br />

DC Characteristics<br />

Power Supply <strong>Pin</strong>s<br />

D010<br />

D010A<br />

D014<br />

Standard Operating Conditions (unless otherwise stated)<br />

Operating temperature 0°C ≤ TA ≤ +70°C (commercial)<br />

-40°C ≤ TA ≤ +85°C (industrial)<br />

Parameter<br />

No.<br />

Sym Characteristic Min Typ† Max Units Conditions<br />

D001 VDD Supply Voltage 2.0 — 6.0 V XT, RC, and LP osc configuration<br />

D002 VDR RAM <strong>Data</strong> Retention<br />

Voltage (1)<br />

1.5* — — V Device in SLEEP mode<br />

D003 VPOR VDD start voltage to<br />

ensure internal<br />

Power-on Reset signal<br />

— VSS — V See section on Power-on Reset for details<br />

D004 SVDD VDD rise rate to ensure<br />

internal Power-on<br />

Reset signal<br />

0.05* — — V/ms See section on Power-on Reset for details<br />

IDD Supply Current (2)<br />

RC and XT osc configuration (4)<br />

D020<br />

D021<br />

D021A<br />

—<br />

—<br />

—<br />

IPD Power-down Current (3) —<br />

—<br />

—<br />

1<br />

7.3<br />

15<br />

3.0<br />

0.4<br />

0.4<br />

DS30430C-page 90 © 1998 <strong>Microchip</strong> Technology Inc.<br />

4<br />

10<br />

45<br />

16<br />

5.0<br />

6.0<br />

mA<br />

mA<br />

μA<br />

μA<br />

μA<br />

μA<br />

FOSC = 2.0 MHz, VDD = 5.5V<br />

FOSC = 2.0 MHz, VDD = 5.5V<br />

(During <strong>EEPROM</strong> programming)<br />

LP osc configuration<br />

FOSC = 32 kHz, VDD = 2.0V,<br />

WDT disabled<br />

VDD = 2.0V, WDT enabled, industrial<br />

VDD = 2.0V, WDT disabled, commercial<br />

VDD = 2.0V, WDT disabled, industrial<br />

* These parameters are characterized but not tested.<br />

† <strong>Data</strong> in "Typ" column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only<br />

and are not tested.<br />

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.<br />

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin<br />

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an<br />

impact on the current consumption.<br />

The test conditions for all IDD measurements in active operation mode are:<br />

OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD, T0CKI = VDD,<br />

MCLR = VDD; WDT enabled/disabled as specified.<br />

3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is<br />

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.<br />

4: For RC osc configuration, current through Rext is not included. The current through the resistor can be<br />

estimated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.

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