CSEM Scientific and Technical Report 2008

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Flip Chip Bonding on Polymers for Low-Cost Microfluidic Application M. Fretz, T. G. Harvey • , J. Zhu • , J. Auerswald, N. Schmid, C. Bosshard CSEM demonstrates a flip-chip process for small sensor dies on a PMMA platform with fluidic channels inside and metal lines on the top surface, providing electrical contact to the outside and fluid-tight sealing to the inside. The presented bonding process employs an anisotropic conductive adhesive (ACA). This report summarizes previously reported advances in flip chip bonding of small sensor elements on PMMA with anisotropic conductive adhesive (see [ 1, 2] ) with an average particle size of 7 µm. In order to test fluid tightness and electrical characteristics of the bonding process, two experiments were carried out: Fluid Tightness: PMMA dies (~5x5 mm) with two drilled vertical holes were attached with ACA to a bare silicon platform. Silicone tubes provided fluidic connection to the cavity between platform and die (see Figure 1). The connection proved to be leak tight when de-ionized water at a flow-rate of 3 ml/min was pumped through. Furthermore, the bond showed no degradation after it was subjected to 6 bar overpressure (in the cavity) for several days. 2 1 3 ACA ring Cavity 4 Figure 1: Bonding procedure: Gold studs are placed on the metal pads of the PMMA die (1) and are subsequently flattened (2). Then the flipped die is mounted on the silicon platform (3), on which a ring of ACA was dispensed. Finally, the cavity is connected to the sealing test setup (4). Electrical contact resistance: Small silicon dummy chips (1.7x1.5 mm) were attached with ACA to a PMMA substrate. Unlike the bonding procedure depicted in Figure 1, the gold studs were placed on the metal pads of the silicon chips, the ACA spread the entire contact surface between chip and substrate, and the PMMA remained undrilled. Two types of chip and substrate were available with different metal structures. Type A allowed the measurement of the contact resistance of a single contact, excluding metal tracks and probe to pad-contact. One sample exhibits 4 measurable contacts. Type B allowed the measurement of 30 contacts serially connected. This test provided information on the reliability/repeatability of the bonding procedure. Three samples of each type were manufactured on one PMMA strip providing both types of metal patterns (see Figure 2). The averaged resistance of 12 contacts from the samples of type A and the averaged serial resistance of three samples with 30 bumps (type B) are listed in Table 1. The average contact resistance is 21.5 mΩ. The resistances were measured in a four-probe-configuration. For more details, see [2] . The standard deviation is 5.2 mΩ. This large value is attributed to the inhomogeneity of particle distribution in the ACA, as well as the variation of the gold studs size. The studs provided round shaped contact surfaces just big enough to prevent drastically increased resistances. Investigations show, that diameters of the contact surfaces vary from ~40 µm up to ~80 µm. Smaller surfaces (in combination with the investigated ACA) are not recommended. All three devices of type B exhibit finite resistance values, implying that all 30 contacts were bonded. The mean value is 1397 mΩ, the standard deviation is 42 mΩ. The resistance of a single contact cannot be estimated from this measurement, since the metal lines between two adjacent contacts on chip and substrate contribute to the resistance. B6 B4 B5 Figure 2: PMMA strip with 3 samples of type A and type B. Table 1: Average resistance of a single bump and of 30 bumps daisy-chained. Average Standard Deviation Type A (single Bump) 21.5 5.2 Type B (30 Bumps) 1396.7 41.6 This work was supported by the European Commission Sixth Framework Programme (project IST-FP6-027540, INTEGRAMplus) and the MCCS Micro Center Central Switzerland. CSEM thanks them for their support. • Epigem Limited, Redcar, UK [1] M. Fretz, et al., "Flip Chip Bonding on Polymers: Die Attach and Leak-Tight Sealing”, CSEM Scientific Report 2007, page 99 [2] M. Fretz, et al., “Flip Chip Bonding of Sensor Dies on PMMA for Low-Cost Microfluidic Applications”, Proceedings of the 1st European Conference on Microfluidics, 2008, Bologna A2 A3 A1 111
Low-cost Packages for Ultrabright Light Sources G. Spinola Durante, R. Jose James, J. Pierer, S. Grossmann, A. Stump, C. Bosshard, N. Lichtenstein • , M. Krejci • , H. Moser •• Within this project a technological platform to assemble laser module stacks for ultrabright laser sources was realized. The main challenges of the laser system packaging were the study and the development of the micro-optic (MO) supports and the corresponding high-precision assembly process of the laser stack, exploiting a combination of glass soldering and adhesive fixing. The new laser system is based upon a revolutionary concept of 2D diode laser array stacks from BOOKHAM (SEAL: Single-Mode Emitter Array Laser) and dedicated micro-optics (MO) from FISBA for beam collimation and fiber coupling. Applications of the new laser system are in the field of direct use of collimated laser diodes for material processing. In the first project phase, the laser-array to fiber power coupling concept was verified experimentally by assembling MO in front of a single array of laser diodes and using offthe-shelf optical components (Figure 1). Demonstrator tests showed first-order feasibility of optical power coupling (17 W) into a 100 μm fiber. Figure 1: Power coupling to 100 μm fiber demonstrator In parallel, a compact module based on a laser diode stack consisting of 4 laser diode arrays and micro-optical lens arrays was developed for coupling up to 100 W of laser power into a multimode fiber (see Figure 2). Figure 2: 150 W CW laser stack including MO assembly To achieve this goal, the design of the laser stacks and the MO had to be combined with the design of a suitable assembly process for the MO. The alignment and assembly process development of the micro-optical lens arrays was 112 based on a novel combination of glass soldering, laser glass soldering, and adhesive fixing in order to reduce possible stresses induced by large differences in the coefficients of thermal expansion. To fabricate the prototype the fast axis collimation optics was soldered into a specially designed glass support using a vision-assisted alignment assembly setup (see Figure 3). Then, the glass support was actively aligned and fixed to the laser stack with sub-micrometer precision. Permanent attachment was achieved using a UV curable adhesive. Finally, a slow axis collimation lens was attached to the glass support using a newly developed laser soldering process for glass, again requiring a sub-micrometer alignment precision. This assembly sequence was repeated 4 times to build the compact laser module shown in Figure 2. Figure 3: Vision-assisted alignment assembly setup Conclusive tests made at FISBA with the laser stack showed a linear and stable output and a maximum rating of 150 W in CW mode, thus confirming that manufacturing & assembly is working as planned. Using the fiber coupling optical at FISBA, 100 W optical power into the multimode fiber is feasible. This work was funded by CTI. CSEM thanks them for their support. • BOOKHAM Zürich (Switzerland) AG, Zürich •• FISBA OPTIK AG, St. Gallen
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centre suisse d’électronique et
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CONTENTS PREFACE 5 RESEARCH ACTIVIT
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PREFACE Dear Reader, In this report
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TissueOptics - Portable Pulse Oxime
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PackTime - Zero-level Packaging of
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BioTool - an Integrated Parallel At
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SUMO - SUrface MOdified Vision Syst
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SixSense - Six Dimensional Micro Se
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MICROELECTRONICS Christian Enz The
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Hand Detection Using Boosted Classi
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A Low-power 32-bit Dual-MAC 120 µW
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Design of RF Passives in 65 nm CMOS
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Effect of Size on the Performance o
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Wireless Sensor Networks Built Usin
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Massively Parallel Optical Tomograp
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High-speed Imagers P. Buchschacher,
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Applications of X-ray Phase Contras
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Enhanced Visual Chemical Sensor Bas
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Integrated Organic Spectrometer on
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NANOTECHNOLOGY & LIFE SCIENCES Harr
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Polarization Imaging using Nanostru
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Plasmon Based All Optical Switch R.
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Gold Nanorings from Block Copolymer
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J-aggregates inside Mesoporous Meta
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Batch Fabrication of Ultrathin Nano
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A Liquid Delivery System for Single
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On-chip Electrical Characterization
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Surfaces that Regulate Cell Growth
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Page 64 and 65: Miniaturization of an Integrated Op
Page 66 and 67: NANOMEDICINE Peter Seitz The Europe
Page 68 and 69: High-Efficiency X-ray Microscopy an
Page 70 and 71: A Universal Protein Assembler H. Ze
Page 72 and 73: A Microfluidic Chip for Cytotoxicol
Page 74 and 75: The CSEM Electrical Impedance Tomog
Page 76: DNA-fragment Binding Studies on the
Page 79 and 80: Fall Detector in Wrist Device M. Be
Page 81 and 82: Distributed Electronics for Wearabl
Page 83 and 84: Using IEEE 802.15.4 for Athlete Con
Page 85 and 86: Compressed Sensing: Multi-user Impu
Page 87 and 88: Efficient Information Dissemination
Page 89 and 90: A Remote Reconfiguration Mechanism
Page 91 and 92: European Large Telescope M5 Field S
Page 93 and 94: Integration and Tests of the Config
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Page 103 and 104: Low Cost Micro Metrology Concept P.
Page 105 and 106: Static Micromixer with Minimized De
Page 107 and 108: A Noninvasive Sensor for Fluidic Pr
Page 109 and 110: Integrated ESR Sensors R. Jose Jame
Page 111: Laser Micromachining for Microfluid
Page 115 and 116: Small Volume Production S. Jeannere
Page 117 and 118: Engineering of Thin Film Crystallin
Page 119 and 120: New Technology Platforms Alex Domma
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Page 123 and 124: Proceedings [1] C. Arm, S. Gyger, J
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CSEM Scientific and Technical Report 2008

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