Edwin Jan Klein - Universiteit Twente

More documents

Recommendations

Info

Chapter 7 largely solved, however, by placing the bus and add-drop waveguides in different layers [146] The vertical distance between the add-drop and bus waveguides is 250 µm so that the device can be used in combination with standard fiber-arrays. The size of the OADM, 1.5 mm by 0.2 mm, is mainly determined by this spacing. All waveguides are horizontally tapered down to 1.5 µm at the facets. As shown in Figure 7.7 this can reduce the fiber chip-coupling losses from 6.5 to 6.0 dB for a standard (SMF, Mode Field Diameter 10.2) fiber and from 4.3 to 3.9 dB for a small-core (HI- 1060, MFD 5.6) fiber. For the resonators in the OADM the standard vertically coupled microring resonator building block described in Chapter 6 was used, following the design parameters described in Table 6.1 except for the thickness of the resonator which was set at 190 nm. Fiber chip coupling loss (dB) 7 6 5 4 3 2 0 1 2 3 4 5 6 Waveguide width (µm) 164 Overlap with SMF Overlap with smallcore Figure 7.7. Fiber-chip coupling loss with a standard or a small-core fiber as a function of the waveguide width for a Si3N4 SiO2 waveguide with a thickness of 140 nm. The OADM was fabricated using the “Vertical I” fabrication process and subsequently pigtailed and packaged so that the device could be fully characterized [147]. Figure 7.6 shows a close-up of a fabricated OADM. The four add/drop and central waveguides are clearly discernable as well as the omega shaped heater elements on top of the four micro-ring resonators. Two photographs of the pigtailed OADM chip are given in Figure 7.8 In these photographs the fiber arrays, glued to both sides of the chip, can be seen. Also discernable are the glass rails on top of the chip as well as the bond wires. The chip measures 10 mm by 9 mm. Although the actual OADM measures only 10 mm by 1.5 mm, the width of 9 mm is required to provide the fiber arrays with enough space to be glued onto. The chip that is shown therefore actually contains 4 OADMs.
Densely integrated devices for WDM-PON a) b) Figure 7.8. Side a) and top view b) of a pigtailed OADM. 7.2.1 Spectral measurements The pigtailed OADM was measured using an EDFA ASE broadband source and an OSA with a resolution of 0.1 nm. For the responses shown in Figure 7.9 the EDFA ASE was connected to the IIn port of the OADM. The OSA was connected to the IOut port. In this configuration the OADM acts as a de-multiplexer by dropping the channels present on IIn to the drop ports IDrop1-IDrop4. These dropped channels are visible as dips in the IOut port. The two different responses that are shown in the figure were created by tuning the resonators so that 1) they either all had the same resonance wavelength, or 2) that the resonance wavelengths of the individual resonators were all different. Normalized power (dB) 0 -5 -10 -15 -20 -25 -30 -35 1546 1548 1550 1552 1554 1556 Wavelength (nm) 165 λ−resonances spaced 0.8 nm All λ−resonances equal Figure 7.9. OADM through responses measured at IOut for two different OADM configurations, set by the thermal tuning of the resonance wavelength of the MRs
Page 1 and 2:
DENSELY INTEGRATED MICRORING- RESON
Page 3 and 4:
DENSELY INTEGRATED MICRORING- RESON
Page 5:
To my parents…
Page 8 and 9:
esonators is limited by the spacing
Page 10 and 11:
iv Samenvatting Dit proefschrift be
Page 12 and 13:
schakelaar “aan” is, dan is de
Page 14 and 15:
3.6.2 Overlap loss reduction.......
Page 17 and 18:
Chapter 1 Introduction The devices
Page 19 and 20:
1.2 Broadband to the home 3 Introdu
Page 21 and 22:
1.3 Bringing Fiber to the Home 5 In
Page 23 and 24:
Figure 1.5. The technological scope
Page 25:
9 Introduction these basic paramete
Page 28 and 29:
Chapter 2 2.1 Introduction Integrat
Page 30 and 31:
Chapter 2 light Icav2 in the cavity
Page 32 and 33:
Chapter 2 ∆ = ⎛ β r − β g
Page 34 and 35:
Chapter 2 2.3.3 Combined model The
Page 36 and 37:
Chapter 2 FC 4µ 1µ 2 ⋅ χr = 2
Page 38 and 39:
Chapter 2 P Through /P In (dB) 0 -1
Page 40 and 41:
Chapter 2 The figure shows that it
Page 42 and 43:
Chapter 2 In − jϕr1 2 Figure 2.1
Page 44 and 45:
Chapter 2 differences between the f
Page 46 and 47:
Chapter 2 M = ⋅ FSR = N ⋅ FSR F
Page 48 and 49:
Chapter 2 the heat will therefore f
Page 50 and 51:
Chapter 2 index. Although this can
Page 52 and 53:
Chapter 2 resonators for instance h
Page 54 and 55:
Chapter 2 a rather complex MEMS bas
Page 56 and 57:
Chapter 3 3.1 Introduction The most
Page 58 and 59:
Chapter 3 3.2.1 Drop port on-resona
Page 60 and 61:
Chapter 3 3.2.3 Filter bandwidth In
Page 62 and 63:
Chapter 3 (resulting in a higher ba
Page 64 and 65:
Chapter 3 Figure 3.11. Residual cha
Page 66 and 67:
Chapter 3 3.3 Geometrical design ch
Page 68 and 69:
Chapter 3 resonator and the port wa
Page 70 and 71:
Chapter 3 Another important fact wh
Page 72 and 73:
Chapter 3 The flowchart of the desi
Page 74 and 75:
Chapter 3 While the resonator in th
Page 76 and 77:
Chapter 3 3.6.1 Port waveguide and
Page 78 and 79:
Chapter 3 overlap losses are only 0
Page 80 and 81:
Chapter 3 3.7 Component design cons
Page 82 and 83:
Chapter 3 By maximizing the power t
Page 84 and 85:
Chapter 3 important, due to the fac
Page 86 and 87:
Chapter 4 4.1 Introduction As was s
Page 88 and 89:
Chapter 4 4.2.1 Transient response
Page 90 and 91:
Chapter 4 Under the condition that
Page 92 and 93:
Chapter 4 Figure 4.4. Screenshot of
Page 94 and 95:
Chapter 4 The equations required to
Page 96 and 97:
Chapter 4 using an approach based o
Page 98 and 99:
Chapter 4 4.5.1 Architecture The Au
Page 100 and 101:
Chapter 4 4.5.2 Simulation method A
Page 102 and 103:
Chapter 4 Figure 4.9. A Primitive w
Page 104 and 105:
Chapter 4 Listing 4.3. Pseudo code
Page 106 and 107:
Chapter 4 Listing 4.4. Pseudo code
Page 108 and 109:
Chapter 4 simulated output spectra
Page 110 and 111:
Chapter 4 Figure 4.21. The reflecto
Page 112 and 113:
Chapter 4 P Drop /P In (dB) 0 -10 -
Page 114 and 115:
Chapter 4 Figure 4.27a. OADM with r
Page 116 and 117:
Chapter 4 will propagate through th
Page 118 and 119:
Chapter 4 As demonstrated by these
Page 120 and 121:
Chapter 4 What is more interesting
Page 122 and 123:
Chapter 4 method it does allow time
Page 124 and 125:
Chapter 4 complex than the interact
Page 126 and 127:
Chapter 5 5.1 Introduction The mate
Page 128 and 129:
Chapter 5 wafer is used (step 1). T
Page 130 and 131: Chapter 5 range of 0.9 to 1.1 µm.
Page 132 and 133: Chapter 5 The process flow with the
Page 134 and 135: Chapter 5 5.3.3 Mask layout The big
Page 136 and 137: Chapter 5 5.4. Fabrication and mask
Page 138 and 139: Chapter 5 1. Definition of the vert
Page 140 and 141: Chapter 5 5.4.2 Fabrication The fab
Page 142 and 143: Chapter 5 Figure 5.21. Process flow
Page 144 and 145: Chapter 5 removed using lift-off of
Page 146 and 147: Chapter 6 6.1 Introduction About ha
Page 148 and 149: Chapter 6 In early, comparatively s
Page 150 and 151: Chapter 6 that the TEOS has a very
Page 152 and 153: Chapter 6 The most important aspect
Page 154 and 155: Chapter 6 6.2.3 Chromium heater des
Page 156 and 157: Chapter 6 Therefore, even if the si
Page 158 and 159: Chapter 6 Next, the heater was heat
Page 160 and 161: Chapter 6 6.3 Characterization of s
Page 162 and 163: Chapter 6 polarization maintaining
Page 164 and 165: Chapter 6 the resonators in this gr
Page 166 and 167: Chapter 6 Although the fitted coupl
Page 168 and 169: Chapter 6 a cladding thickness of 3
Page 170 and 171: Chapter 6 6.4 A wavelength selectiv
Page 172 and 173: Chapter 6 A possible explanation fo
Page 175 and 176: Chapter 7 Densely integrated device
Page 177 and 178: Densely integrated devices for WDM-
Page 179: Densely integrated devices for WDM-
Page 183 and 184: 7.2.2 Spectral measurements Densely
Page 189 and 190: Power Densely integrated devices fo
Page 191 and 192: 7.3.4 Characterization Densely inte
Page 195 and 196: Figure 7.31a. Eye pattern of the re
Page 197: Densely integrated devices for WDM-
Page 200 and 201: Chapter 8 8.1 Introduction In most
Page 202 and 203: Chapter 8 amount of power will be d
Page 204 and 205: Chapter 8 Another problem that may
Page 206 and 207: Chapter 8 halves that are each comp
Page 209 and 210: Chapter 9 Discussion and Conclusion
Page 211 and 212: Appendix A. Mason’s rule Several
Page 213 and 214: Appendix B. Crosstalk Derivation Th
Page 215 and 216: List of Acronyms ADSL - Asymmetric
Page 217 and 218: List of Symbols Q - Quality Factor
Page 219 and 220: Bibliography [1] Dan Schiller, “E
Page 221 and 222: Regions,” IEEE Photonics Technolo
Page 223 and 224: [66] B. E. Little, S. T. Chu, J. V.
Page 225 and 226: [97] H. Haeiwa, T. Naganawa and Y.
Page 227 and 228: [135] A. Driessen, D. H. Geuzebroek
Page 229 and 230: [165] T. Barwicz, M. R. Watts, M. A
Page 231 and 232:
Publication List Patents (pending)
Page 233 and 234:
R. Dekker, L.T.H.Hilderink, M.B.J.
Page 235 and 236:
Networks (BB Photonics),” Interna
Page 237 and 238:
Dankwoord/Acknowledgements Zo, dit
Page 239:
223
show all

Edwin Jan Klein - Universiteit Twente

Create successful ePaper yourself

Delete template?

Save as template?