Edwin Jan Klein - Universiteit Twente

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Bibliography [1] Dan Schiller, “End of the telecom revolution,” Le Monde Diplomatique, August 2003. [2] Lawrence Gasman, “Who killed Telecom?,” Cato Institute, Executive Summary No. 533, February 7, 2005. [3] Paul Starr, “What Killed the Boom,” The American Prospect Online Edition, September 10 th 2001. [4] Eli M. Moam, “The Telecom bust? Get ready for the next one,” Telecom Asia, October 2003. [5] Alain Puissochet, “Do we need Fiber to the home?,” Communications & Strategies, No. 57, 1 st quarter 2005, pp. 187-194 [6] “VDSL Tutorial, Fiber – Copper access for the information highway,” http://www.dslforum.org/aboutdsl/vdsl_tutorial.html [7] Aware Inc, “ADSL2 and ADSL2+ the new ADSL standards,” http://www.dslprime.com/a/adsl21.pdf [8] “ADSL2 en ADSL2+. Wat moet je ermee?,” http://www.tekstenuitleg.net/artikelen/adsl2/1 [9] Richard Sekar, “New VDSL2 standard will bring fiber fast Broadband,” Ikanos Communications, <strong>Jan</strong>uary 2005. [10] Wikipedia, http://en.wikipedia.org/wiki/Passive_optical_network [11] Barry Kantner, “The FTTP Battlefield: Active Ethernet vs. PON,” Lightwave Online, July 6 th , 2004. [12] Meghan Fuller, “Industry mulls over WDM-PON technology,” Lightwave, August 1 st , 2006. [13] A. Driessen, “NAIS: Next-generation Active Integrated-optic Subsystems,” Project introduction, http://www.mesaplus.utwente.nl/nais. [14] H. de Waardt, “Dynamically reconfigurable broadband photonic access networks,” http://www.freeband.nl/uploadedFiles/Projectflyer%20BBPhotonics%20EN.p df. [15] E. A. J. Marcatili, “Bends in optical dielectric waveguides, ” BSTJ, Vol. 48, pp. 2103-2132, 1969. [16] K. Jackson, S. Newton, B. Moslehi, M. Tur, C. Cutler, J. Goodman and H. Shaw, “Optical Fiber Delay-Line Signal Processing,” IEE Trans. Microwave Theory Techniques, Vol. 33, No. 7, pp. 909-930, 1984. [17] N. Ngo and L. Binh, “Novel Realisation of Monotonic Butterworth Type Lowpass, Highpass, and Bandpass Optical Filters Using Phase-Modulated Fiber-Optic Interferometers and Ring Resonators,” Journal of Lightwave Technology, Vol. 12, No. 5, pp. 827-841, 1994. [18] L. Collot, V. Lefe`vre-Seguin, M. Brune, J.-M. Raimond, and S. Haroche, ‘‘Very high-Q whispering gallery modes resonances observed on fused silica microsphere,’’ Europhys. Lett., Vol. 23, 327–333, 1993. [19] M. L. Gorodetsky and V. S. Ilchenko, “Optical microsphere resonators: optimal coupling to high-Q whispering-gallery modes,” J. Opt. Soc. Am. B, Vol. 16, No. 1, pp. 147-154, <strong>Jan</strong>uary 1999. [20] H. C. Tapalian, J.-P. Laine, and P. A. Lane, “Thermooptical Switches Using Coated Microsphere Resonators,” IEEE Photonics Technology Letters, Vol. 14, No. 8, pp. 1118-1120, August 2002. 203
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DENSELY INTEGRATED MICRORING- RESON
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DENSELY INTEGRATED MICRORING- RESON
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To my parents…
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esonators is limited by the spacing
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iv Samenvatting Dit proefschrift be
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schakelaar “aan” is, dan is de
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3.6.2 Overlap loss reduction.......
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Chapter 1 Introduction The devices
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1.2 Broadband to the home 3 Introdu
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1.3 Bringing Fiber to the Home 5 In
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Figure 1.5. The technological scope
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9 Introduction these basic paramete
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Chapter 2 2.1 Introduction Integrat
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Chapter 2 light Icav2 in the cavity
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Chapter 2 ∆ = ⎛ β r − β g
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Chapter 2 2.3.3 Combined model The
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Chapter 2 FC 4µ 1µ 2 ⋅ χr = 2
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Chapter 2 P Through /P In (dB) 0 -1
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Chapter 2 The figure shows that it
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Chapter 2 In − jϕr1 2 Figure 2.1
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Chapter 2 differences between the f
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Chapter 2 M = ⋅ FSR = N ⋅ FSR F
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Chapter 2 the heat will therefore f
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Chapter 2 index. Although this can
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Chapter 2 resonators for instance h
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Chapter 2 a rather complex MEMS bas
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Chapter 3 3.1 Introduction The most
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Chapter 3 3.2.1 Drop port on-resona
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Chapter 3 3.2.3 Filter bandwidth In
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Chapter 3 (resulting in a higher ba
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Chapter 3 Figure 3.11. Residual cha
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Chapter 3 3.3 Geometrical design ch
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Chapter 3 resonator and the port wa
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Chapter 3 Another important fact wh
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Chapter 3 The flowchart of the desi
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Chapter 3 While the resonator in th
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Chapter 3 3.6.1 Port waveguide and
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Chapter 3 overlap losses are only 0
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Chapter 3 3.7 Component design cons
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Chapter 3 By maximizing the power t
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Chapter 3 important, due to the fac
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Chapter 4 4.1 Introduction As was s
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Chapter 4 4.2.1 Transient response
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Chapter 4 Under the condition that
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Chapter 4 Figure 4.4. Screenshot of
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Chapter 4 The equations required to
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Chapter 4 using an approach based o
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Chapter 4 4.5.1 Architecture The Au
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Chapter 4 4.5.2 Simulation method A
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Chapter 4 Figure 4.9. A Primitive w
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Chapter 4 Listing 4.3. Pseudo code
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Chapter 4 Listing 4.4. Pseudo code
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Chapter 4 simulated output spectra
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Chapter 4 Figure 4.21. The reflecto
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Chapter 4 P Drop /P In (dB) 0 -10 -
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Chapter 4 Figure 4.27a. OADM with r
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Chapter 4 will propagate through th
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Chapter 4 As demonstrated by these
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Chapter 4 What is more interesting
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Chapter 4 method it does allow time
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Chapter 4 complex than the interact
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Chapter 5 5.1 Introduction The mate
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Chapter 5 wafer is used (step 1). T
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Chapter 5 range of 0.9 to 1.1 µm.
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Chapter 5 The process flow with the
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Chapter 5 5.3.3 Mask layout The big
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Chapter 5 5.4. Fabrication and mask
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Chapter 5 1. Definition of the vert
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Chapter 5 5.4.2 Fabrication The fab
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Chapter 5 Figure 5.21. Process flow
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Chapter 5 removed using lift-off of
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Chapter 6 6.1 Introduction About ha
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Chapter 6 In early, comparatively s
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Chapter 6 that the TEOS has a very
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Chapter 6 The most important aspect
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Chapter 6 6.2.3 Chromium heater des
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Chapter 6 Therefore, even if the si
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Chapter 6 Next, the heater was heat
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Chapter 6 6.3 Characterization of s
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Chapter 6 polarization maintaining
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Chapter 6 the resonators in this gr
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Chapter 6 Although the fitted coupl
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Page 175 and 176: Chapter 7 Densely integrated device
Page 177 and 178: Densely integrated devices for WDM-
Page 183 and 184: 7.2.2 Spectral measurements Densely
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Page 191 and 192: 7.3.4 Characterization Densely inte
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Page 197: Densely integrated devices for WDM-
Page 200 and 201: Chapter 8 8.1 Introduction In most
Page 202 and 203: Chapter 8 amount of power will be d
Page 204 and 205: Chapter 8 Another problem that may
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Page 209 and 210: Chapter 9 Discussion and Conclusion
Page 211 and 212: Appendix A. Mason’s rule Several
Page 213 and 214: Appendix B. Crosstalk Derivation Th
Page 215 and 216: List of Acronyms ADSL - Asymmetric
Page 217: List of Symbols Q - Quality Factor
Page 221 and 222: Regions,” IEEE Photonics Technolo
Page 223 and 224: [66] B. E. Little, S. T. Chu, J. V.
Page 225 and 226: [97] H. Haeiwa, T. Naganawa and Y.
Page 227 and 228: [135] A. Driessen, D. H. Geuzebroek
Page 229 and 230: [165] T. Barwicz, M. R. Watts, M. A
Page 231 and 232: Publication List Patents (pending)
Page 233 and 234: R. Dekker, L.T.H.Hilderink, M.B.J.
Page 235 and 236: Networks (BB Photonics),” Interna
Page 237 and 238: Dankwoord/Acknowledgements Zo, dit
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Edwin Jan Klein - Universiteit Twente

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