Edwin Jan Klein - Universiteit Twente

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esonators is limited by the spacing of the fibers in the fiber array used for pigtailing rather than the size of the individual resonators. Chapter 4 “Simulation and analysis” In Chapter 4 some of the tools that were created to aid in the design and characterization of microring resonator based devices are presented. In particular the analytical and numerical methods used to fit measured resonator responses are examined in detail. Another tool that is discussed is Aurora, a tool that was created to perform simulations on complex optical circuits containing resonators. The simulations performed by Aurora are time-domain based. Although the simulation principle, based on the delayed forwarding of signals between optical components, is fairly simple, it is nonetheless very powerful and allows for a very fast simulation of highly complex optical circuits. Chapter 5 “Fabrication” In Chapter 5 three distinct fabrication processes are described. Each process was designed for a specific resonator type. The simplest process was designed for laterally coupled resonators. This process does not suffer from resonator misalignment but is critical where the resolution of the lithography is concerned. A more complex process was designed for vertically coupled resonators. The lithographic requirements of this process are less important although the process is highly susceptible to resonator misalignment. The most elaborate fabrication process is based on stepper lithography. This allows for very small feature sizes as well as a high alignment accuracy which is very important from a device yield perspective. The only downside is that the maximum size of devices is limited to 22 by 22 mm. However, devices made in a materials system with a high index contrast such as Si3N4/SiO2 will often be smaller than this. The stepper process also included chemical mechanical polishing of the separation layer between the ring resonator and the port waveguides in order to reduce the losses in the resonator caused by an abrupt “lifting” of the resonator on top of the port waveguides. Chapter 6 “Microring-resonator building blocks” In Chapter 6 the design of a basic resonator building block is given. This building block is based on a 2.0 x 0.14 µm port waveguide from where the light is coupled into a ring resonator that has waveguide dimensions of 2.5 x 0.18 µm and a radius of 50 µm. On top of the resonator a heater is placed to be able to shift its resonance wavelength. Depending on the resonator radius (25 or 50 µm) and the thickness of the cladding layer on top of the resonator (3 or 4 µm) resonance shifts between 7 pm/mW and 21 pm/mW have been observed. By using an overshoot in the electrical signal that drives the heater, thermal modulation frequencies up to 10 KHz could be observed. Also demonstrated in this chapter is a wavelength selective optical switch based on two cascaded resonators. The switch measures only 200 µm x 200 µm. The “on/off” attenuation of the switch is 12 dB. When the switch is “on” the crosstalk with the adjacent channels is ≈-20 dB (channel spacing of 0.8 nm). The on chip insertion loss of the switch is around 5 dB. A Vernier resonator based on two resonators with a radius of 46 µm and 55 µm is also demonstrated. The combined FSR is ≈28 µm. ii
Chapter 7 “Densely integrated devices for WDM-PON” In Chapter 7 the design and characterization of two different types of OADM, for use at 1310 nm or at 1550 nm, and a Router are discussed. The 1550 nm OADM could be fully tuned and could be configured to drop one or more channels. In addition system level measurements were performed in this OADM. A 40 Gbit/s could be dropped to a single channel without a significant penalty in BER. In addition multicasting was demonstrated. The same reconfigurability was also shown for the 1300 nm OADM. Finally the 1300 nm router is discussed and basic functionality of the router, dropping one, two or three channels to a single output is demonstrated. Chapter 8 “Polarization independent devices” A major problem of microring resonator based devices is that it is often very difficult to make them polarization independent. Although this can by solved by introducing polarization diversity in the devices this also doubles the number of resonators and creates a number of new problems. In Chapter 8 a method is described where a single microring resonator is used bi-directionally so that a single resonator effectively operates as if two resonators are present. The number of resonators that is required to implement polarization diversity in a device is therefore more or less the same (there is a minor overhead) as the number of resonators in an implementation that uses polarization independent resonators. Chapter 9 “Discussion and conclusions” Finally, in Chapter 9, conclusions are drawn based on the results presented in this thesis. iii
Page 1 and 2: DENSELY INTEGRATED MICRORING- RESON
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Page 5: To my parents…
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Page 14 and 15: 3.6.2 Overlap loss reduction.......
Page 17 and 18: Chapter 1 Introduction The devices
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Page 23 and 24: Figure 1.5. The technological scope
Page 25: 9 Introduction these basic paramete
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Page 32 and 33: Chapter 2 ∆ = ⎛ β r − β g
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Page 36 and 37: Chapter 2 FC 4µ 1µ 2 ⋅ χr = 2
Page 38 and 39: Chapter 2 P Through /P In (dB) 0 -1
Page 40 and 41: Chapter 2 The figure shows that it
Page 42 and 43: Chapter 2 In − jϕr1 2 Figure 2.1
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Page 46 and 47: Chapter 2 M = ⋅ FSR = N ⋅ FSR F
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Page 56 and 57: Chapter 3 3.1 Introduction The most
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Chapter 3 3.2.1 Drop port on-resona
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Chapter 3 3.2.3 Filter bandwidth In
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Chapter 3 (resulting in a higher ba
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Chapter 3 Figure 3.11. Residual cha
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Chapter 3 3.3 Geometrical design ch
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Chapter 3 resonator and the port wa
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Chapter 3 Another important fact wh
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Chapter 3 The flowchart of the desi
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Chapter 3 While the resonator in th
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Chapter 3 3.6.1 Port waveguide and
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Chapter 3 overlap losses are only 0
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Chapter 3 3.7 Component design cons
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Chapter 3 By maximizing the power t
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Chapter 3 important, due to the fac
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Chapter 4 4.1 Introduction As was s
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Chapter 4 4.2.1 Transient response
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Chapter 4 Under the condition that
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Chapter 4 Figure 4.4. Screenshot of
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Chapter 4 The equations required to
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Chapter 4 using an approach based o
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Chapter 4 4.5.1 Architecture The Au
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Chapter 4 4.5.2 Simulation method A
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Chapter 4 Figure 4.9. A Primitive w
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Chapter 4 Listing 4.3. Pseudo code
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Chapter 4 Listing 4.4. Pseudo code
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Chapter 4 simulated output spectra
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Chapter 4 Figure 4.21. The reflecto
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Chapter 4 P Drop /P In (dB) 0 -10 -
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Chapter 4 Figure 4.27a. OADM with r
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Chapter 4 will propagate through th
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Chapter 4 As demonstrated by these
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Chapter 4 What is more interesting
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Chapter 4 method it does allow time
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Chapter 4 complex than the interact
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Chapter 5 5.1 Introduction The mate
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Chapter 5 wafer is used (step 1). T
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Chapter 5 range of 0.9 to 1.1 µm.
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Chapter 5 The process flow with the
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Chapter 5 5.3.3 Mask layout The big
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Chapter 5 5.4. Fabrication and mask
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Chapter 5 1. Definition of the vert
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Chapter 5 5.4.2 Fabrication The fab
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Chapter 5 Figure 5.21. Process flow
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Chapter 5 removed using lift-off of
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Chapter 6 6.1 Introduction About ha
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Chapter 6 In early, comparatively s
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Chapter 6 that the TEOS has a very
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Chapter 6 The most important aspect
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Chapter 6 6.2.3 Chromium heater des
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Chapter 6 Therefore, even if the si
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Chapter 6 Next, the heater was heat
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Chapter 6 6.3 Characterization of s
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Chapter 6 polarization maintaining
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Chapter 6 the resonators in this gr
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Chapter 6 Although the fitted coupl
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Chapter 6 a cladding thickness of 3
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Chapter 6 6.4 A wavelength selectiv
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Chapter 6 A possible explanation fo
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Chapter 7 Densely integrated device
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Densely integrated devices for WDM-
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7.2.2 Spectral measurements Densely
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Power Densely integrated devices fo
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7.3.4 Characterization Densely inte
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Figure 7.31a. Eye pattern of the re
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Chapter 8 8.1 Introduction In most
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Chapter 8 amount of power will be d
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Chapter 8 Another problem that may
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Chapter 8 halves that are each comp
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Chapter 9 Discussion and Conclusion
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Appendix A. Mason’s rule Several
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Appendix B. Crosstalk Derivation Th
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List of Acronyms ADSL - Asymmetric
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List of Symbols Q - Quality Factor
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Bibliography [1] Dan Schiller, “E
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Regions,” IEEE Photonics Technolo
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[66] B. E. Little, S. T. Chu, J. V.
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[97] H. Haeiwa, T. Naganawa and Y.
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[135] A. Driessen, D. H. Geuzebroek
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[165] T. Barwicz, M. R. Watts, M. A
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Publication List Patents (pending)
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R. Dekker, L.T.H.Hilderink, M.B.J.
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Networks (BB Photonics),” Interna
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Dankwoord/Acknowledgements Zo, dit
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Edwin Jan Klein - Universiteit Twente

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