II International Symposium on Carbon for Catalysis ABSTRACTS

PP-<strong>II</strong>-28
metallic particles and other big aggregates by ultrasound with frequency of 22 kGz during 3
minutes.
The authors of this article have created the polishing pastes and they are used in the
schemes № 3 and № 4. The detonation nanodiamonds are used for creation of the polishing
pastes with addition of the chemical components [1].
The traditional technological process of treatment of these substructures
(OST 4.054.058-84) was changed in the schemes with using of the nanodiamonds. The type
of the polishing disk, regimes and consistency of the technological operations were changed
as on the grinding as on the polishing stages. The wafer yield was increased on the 20 % and
the roughness of the substructures surface was decreased three times by these changes. Outlay
of used polishing tool on the whole was decreased by using created pastes as compared with
outlay of the suspensions. The polishing properties of these pastes were remained but
performance of the process was increased on the 30 % by adding the abrasive micropowders
with the size of 5-7 µm and the concentration about 10 % mass.
Thus the observations of the processed substructures have showed the using perspective
of the now schemes (№ 3 and № 4) for the defective substructures restoration. The polishing
pastes with nanodiamonds are very effective for polishing substructures stage. They improve
the surface microrelief and reduce the number of the defective substructures on the polishing
stage. For all that the character of the interaction of the tool with the treatment surface may be
changed by adding nanodiamonds in the grinding tool with the abrasive micropowder.
References
1 Pat. 1813301, RF, NO 121/02. The paste for the abrasive processing of the semiconductor
and glass substructures. / A. A. Zacharov, E. I. Kutshma, O. V. Semjonova,
V. A. Yusova, 1994.
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