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Composite Materials Research Progress

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120<br />

W.H. Zhong, R.G. Maguire, S.S. Sangari et al.<br />

For aramid and UHMWPE fibers, silane coupling treatments (effective for glass fibers)<br />

and oxidation treatments (effective for carbon fibers) are not effective in improving the<br />

interfacial strength [1-6]. For UHMWPE fibers, many treatment methods including nitrogen<br />

ion implantation, nitrogen plasma, fast atom beams, laser ablation, chain disentanglement,<br />

high power ion beam treatments, and cold plasma [7-13] have been used. Such approaches<br />

show some improvement in interfacial properties, but also can degrade the mechanical<br />

properties of the fibers by damaging the chain structure of the UHMWPE fiber and result in<br />

formation of amorphous hydrogenated carbon. Recently, the effectiveness of an atmospheric<br />

plasma was demonstrated for dramatic improvement in the adhesion of polyetheretherketone<br />

(PEEK) composites to epoxy [14]. This atmospheric plasma was shown to be an important<br />

potential strategy for improving the interfacial adhesion between organic fibers and polymer<br />

resins.<br />

A nanotechnology approach was recently developed by Dr. Zhong’s group in which<br />

conventional epoxy resins are converted into reactive nano-epoxy resins. Unlike the<br />

conventional epoxy resins that require carbon fibers to be surface oxidized/treated before<br />

being impregnated, the nano-epoxy resins contain reactive graphite nanofibers which can<br />

improve the wettability and adhesion properties between UHMWPE fibers and the resin<br />

matrix [15-19].<br />

Next Generation Carbon Fibers – Continuous Nanoscale Carbon Fibers Traditional Carbon<br />

fibers have high strength, high modulus and attractively low density. The high strength-toweight<br />

ratio combined with superior stiffness has made carbon fibers the material of choice<br />

for high performance composite structures in the aerospace, defense and other industries.<br />

Polymer fibers, which leave a carbon residue and do not melt upon pyrolysis in an inert<br />

atmosphere, are generally considered candidates for carbon fiber production. It is known that<br />

the structural perfection of precursor fibers is the most crucial factors on the strength of<br />

carbon fibers. Imperfections (such as surface defects, bulk defects and others) in the precursor<br />

fibers are likely to be translated to the resulting carbon fibers, and the amounts and sizes of<br />

structural imperfections directly determine the final fiber strength. The fundamental<br />

approach/solution for improving the strength of carbon fibers is to reduce the amounts and<br />

sizes of numerous types of defects in the precursor and there has been a clear and continuing<br />

trend among commercial carbon fiber suppliers in achieving higher strengths through this<br />

approach.<br />

There is also a growing interest in having thinner plies of composite material without loss<br />

of strength or stiffness and thinner plies means thinner fibers. Historically the means of<br />

producing very small diameter (down to submicron range) has been electrospinning. Since the<br />

1930s electrospinning has been used on nylon and other polymers to achieve small fibers to<br />

provide filtering media and other applications. In the process a strong electric field acts on a<br />

polymer solution resulting in a polymer stream which solidifies through the evaporation of<br />

the solvent.<br />

This can also be applied to a polyacrylonitrile (PAN) copolymer (precursor) to produce<br />

nanofibers with diameters in the nanoscale range with the potential of ultimately producing<br />

continuous nano-scaled carbon fibers with strengths and stiffness much higher than<br />

conventional micro scale carbon fibers. Additionally, since diameters of the electrospun PAN<br />

nanofibers can be further reduced by stretching and carbonization processes, the resulting<br />

nano-scaled carbon fibers can have diameters of less than 100 nm. When incorporated into a

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