Composite Materials Research Progress

284
S.C. Tjong
where DL is lattice self-diffusion coefficient, λ sub-grain size, E Young’s modulus and S a
numerical constant. A substructure is formed due to an increase in the dislocation density as a
consequence of the thermal mismatch between the matrix and the reinforcement. The size of
substructure is controlled by the interparticle spacing. Generally, subgrains can be generated
more easily in pure Al than in the Al solid solution alloys during creep deformation [45, 46].
Figure 8. Creep rate vs applied stress for the Al/1vol.% Si-N-C nanocomposite at 573 -673 K [41].
Figure 9. Arrhenius plot of steady creep rate against 10 3 /T for Al/1vol.%Si-N-C (25 nm)
nanocomposite [41].