Navy Electricity and Electronics Training Series - Historic Naval ...

More documents

Recommendations

Info

Figure 3-8E.—Terminals. SOLDER CUP• PIN TERMINALS AND TURRET TERMINALS [view (A)] are single-post terminals, eitherinsulated or uninsulated, solid or hollow, stud or feed-through. Stud terminals protrude from oneside of a board; feed-throughs protrude from both sides.• BIFURCATED OR FORK TERMINALS [view (B)] are solid or hollow double-post terminals.• HOOK TERMINALS [view (C)] are made of cylindrical stock formed in the shape of a hook orquestion mark.• PERFORATED OR PIERCED TERMINALS [view (D)] describe a class of terminals that uses ahole pierced in flat metal for termination (e.g., terminal lugs).• SOLDER CUP TERMINALS [view (E)] are a common type found on connectors.Turret and bifurcated terminals are used for interfacial connections on printed circuit boards,terminal points for point-to-point wiring, mounting components, and as tie points for interconnectingwiring. Hook terminals are used to provide connection points on sealed devices and terminal boards.Terminals used for wire or component lead terminations are normally made of brass with asolderable coating. Uninsulated terminals may be installed on an insulating substrate to form a terminalboard. They may also be added to a printed circuit board or installed on a metal chassis. Insulatedterminals are installed on a metal chassis.ON-THE-BOARD TERMINATION.—On-the-board termination (figure 3-9) is also called LAPFLOW termination. In a lap flow solder termination, the component lead does not pass through the circuitboard. This form of planar mounting may be used with both round and flat leads.3-14
Figure 3-9.—On-the-board termination.Q6. What term is used to identify the procedure of connecting one side of a circuit board with theother?Q7. Name two types of through-hole termination.Q8. Turret, bifurcated, and hook terminals are used for what type of termination?Q9. When a lead is soldered to a pad without passing through the board, it is known as what type oftermination?Component DesolderingMost of the damage in printed circuit board repair occurs during disassembly or component removal.More specifically, much of this damage occurs during the desoldering process. To remove componentsfor repair or replacement, the technician must first determine the type of joint that is used to connect thecomponent to the board. The technician may then determine the most effective method for desolderingthese connections.Three generally accepted methods of solder connection removal involve the use of SOLDER WICK,a MANUALLY CONTROLLED VACUUM PLUNGER, or a motorized solder extractor usingCONTINUOUS VACUUM AND/OR PRESSURE. Of all the extraction methods currently in use,continuous vacuum is the most versatile and reliable. Desoldering becomes a routine operation and thequantity and quality of desoldering work increases with the use of this technique.SOLDER WICKING.—IN this technique, finely stranded copper wire or braiding (wick) issaturated with liquid flux. Most commercial wick is impregnated with flux; the liquid flux adds to theeffectiveness of the heat transfer and should be used whenever possible. The wick is then applied to asolder joint between the solder and a heated soldering iron tip, as shown in figure 3-10. The combinationof heat, molten solder, and air spaced in the wick creates a capillary action and causes the solder to bedrawn into the wick.3-15
Page 1 and 2:
NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4:
PREFACEBy enrolling in this self-st
Page 5:
TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9:
Module 11, Microwave Principles, ex
Page 10 and 11:
INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13:
THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16:
CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18:
VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20:
SOLID-STATE DEVICESNow would be a g
Page 21 and 22:
FILM INTEGRATED CIRCUITS are broken
Page 23 and 24:
Development of a microelectronic de
Page 25 and 26:
Figure 1-9.—Crystal furnace.The c
Page 27 and 28:
Figure 1-12.—Planar-diffused tran
Page 29 and 30:
Figure 1-14.—Vacuum evaporation o
Page 31 and 32:
Figure 1-17.—Cathode-sputtering m
Page 33 and 34:
Q23. How do the two types of monoli
Page 35 and 36:
Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38:
Dual Inline PackageThe dual inline
Page 39 and 40:
wafer, as shown in figure 1-27. Thi
Page 41 and 42:
Figure 1-29.—J-K flip-flop discre
Page 43 and 44:
Figure 1-31.—Lead numbering for a
Page 45 and 46:
Figure 1-34.—Manufacturer's Data
Page 47:
comparison to the distance between
Page 50 and 51:
LEVEL III.—Drawers or pull-out ch
Page 52 and 53:
Conductors located several layers b
Page 54 and 55:
Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89: Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91: other than eutectic, go through a p
Page 92 and 93: A1. Chief of Naval Operations (CNO)
Page 94 and 95: CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97: The coating material can best be id
Page 98 and 99: Figure 3-3.—Rotary tool conformal
Page 100 and 101: Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159:
1-7. Which of the following charact
Page 160 and 161:
1-24. Vacuum evaporation and cathod
Page 162 and 163:
___________________________________
Page 164 and 165:
1-49. Ground planes and shielding a
Page 166 and 167:
1-65. Which of the following types
Page 168 and 169:
ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171:
2-20. Turret, fork, and hook termin
Page 172 and 173:
2-39. Component leads may be clippe
Page 174 and 175:
2-52. To ensure a good mechanical b
show all

Navy Electricity and Electronics Training Series - Historic Naval ...

Create successful ePaper yourself

Delete template?

Save as template?