Navy Electricity and Electronics Training Series - Historic Naval ...

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EPITAXIAL PROCESS—The depositing of a thin uniformly doped crystalline region (layer) on asubstrate.EUTECTIC ALLOY—An alloy that changes directly from a solid to a liquid with no plastic orsemiliquid state.EUTECTIC SOLDER—An alloy of 63 percent tin and 37 percent lead. Melts at 361º F.FILM ICs—Conductive or nonconductive material deposited on a glass or ceramic substrate. Used forpassive circuit components, resistors, and capacitors.FLAT PACK—IC package.FLIP CHIP—Monolithic IC packaging technique that eliminates need for bonding wires.FLUX—Removes surface oxides from metals being soldered.GENERAL PURPOSE ELECTRONIC TEST EQUIPMENT (GPETE)—Multimeters, oscilloscopes,voltmeters, signal generators, etc.GROUND PLANES—Copper planes-used to minimize interference between circuits and from externalsources.HYBRID ICs—Two or more integrated circuit types, or one or more integrated circuit types and discretecomponents on a single substrate.INTEGRATED CIRCUIT (IC)—Elements inseparably associated and formed on or within a singlesubstrate.INTERMEDIATE-LEVEL MAINTENANCE (SR&R Code I)—Direct support and technicalassistance to user organizations. Tenders and shore-based repair facilities.ISOLATION—The prevention of unwanted interaction or leakage between components.LANDS—Conductors or runs on pcbs.LARGE SCALE INTEGRATION (lsi)—An integrated circuit containing 1,000 to 2,000 logic gates orup to 64,000 bits of memory.MASK—A device used to deposit materials on a substrate in the desired pattern.MICROCIRCUIT—A small circuit having high equivalent-circuit-element density, which is consideredas a single part composed of interconnected elements on or within a single substrate to perform anelectronic-circuit function.MICROELECTRONICS—That area of electronics technology associated with electronic systems builtof extremely small electronic parts or elements.MICROCIRCUIT MODULE—An assembly of microcircuits or a combination of microcircuits anddiscrete components that perform one or more distinct functions.MODIFIED TRANSISTOR OUTLINE (TO)—IC package resembling a transistor.AI-2
MODULAR PACKAGING—Circuit assemblies or subassemblies packaged to be easily removed formaintenance or repair.MODULE—A circuit or portion of a circuit packaged as a removable unit. A separable unit in apackaging scheme displaying regularity of dimensions.MILITARY STANDARDS (MILSTD)—Standards of performance for components or equipment thatmust be met to be acceptable for military systems.MINIATURE ELECTRONICS—Modules, packages, pcbs, and so forth, composed exclusively ofdiscrete components.2M—Miniature/Microminiature repair program.MONOLITHIC IC—ICs that are formed completely within a semiconductor substrate. Silicon chips.OFF-LINE TEST EQUIPMENT—Tests andisolates faults in modules or assemblies removed fromsystems.OHMS PER SQUARE—The resistance of any square area of thin film resistive material as measuredbetween two parallel sides.ON-LINE TEST EQUIPMENT—Continuously monitors the performance of electronic systems.ORGANIZATIONAL-LEVEL MAINTENANCE (SM&R Code O)—Responsibility of the userorganization.PACKAGING LEVELS—System developed to assist maintenance personnel in isolating faults.PHOTO ETCHING—Chemical process of removing unwanted material in producing printed circuitboards.POINT-TO-POINT WIRING—Individual wires run from terminal to terminal to complete a circuit.PRINTED CIRCUIT BOARD (peb)—The general term for completely processed printed circuit orprinted wiring configurations. It includes single-layered, double-layered, and multi-layeredboards.SCREENING—Process of applying nonconductive or semiconductive materials to a substrate to formthick film components.SHIELDING—Technique designed to minimize internal and external interference.SOURCE, MAINTENANCE, AND RECOVER-ABILITY CODES (SM&R CODES)—Specifymaintenance level for repair of components or assemblies.SUBSTRATE—Mounting surface for integrated circuits. May be semiconductor or insulator materialdepending on type of IC.THICK FILM COMPONENTS—Passive circuit components (resistors and capacitors) having athickness of 0.001 centimeter.AI-3
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97: The coating material can best be id
Page 98 and 99: Figure 3-3.—Rotary tool conformal
Page 100 and 101: Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107: Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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