Navy Electricity and Electronics Training Series - Historic Naval ...

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Q32. On DIP and flat-pack ICs viewed from the top, pin 1 is located on which side of the referencemark?Q33. DIP and flat-pack pins are numbered consecutively in what direction?Q34. DIP and flat-pack pins are numbered consecutively in what direction?Q35. Viewed from the bottom, TO-5 pins are counted in what direction?Q36. The numbers and letters on ICs and schematics serve what purpose?MICROELECTRONIC SYSTEM DESIGN CONCEPTSYou should understand the terminology used in microelectronics to become an effective andknowledgeable technician. You should be familiar with packaging concepts from a maintenancestandpoint and be able to recognize the different types of assemblies. You should also know the electricaland environmental factors that can affect microelectronic circuits. In the next section of this topic we willdefine and discuss each of these areas.TERMINOLOGYAs in any special electronics field, microelectronics terms and definitions are used to clarifycommunications. This is done so that everyone involved in microelectronics work has the sameknowledge of the field. You can imagine how much trouble you would have remembering 10 or moredifferent names and definitions for a resistor. If standardization didn't exist for the new terminology, youwould have far more trouble understanding microelectronics. To standardize terminology inmicroelectronics, the Navy has adopted several definitions with which you should become familiar. Thesedefinitions will be presented in this section.MicroelectronicsMicroelectronics is that area of electronics technology associated with electronics systems built fromextremely small electronic parts or elements. Most of today's computers, weapons systems, navigationsystems, communications systems, and radar systems make extensive use of microelectronics technology.MicrocircuitA microcircuit is not what the old-time technician would recognize as an electronic circuit. The oldtimerwould no longer see the familiar discrete parts (individual resistors, capacitors, inductors,transistors, and so forth). Microelectronic circuits, as discussed earlier, are complete circuits mounted on asubstrate (integrated circuit). The process of fabricating microelectronic circuits is essentially one ofbuilding discrete component characteristics either into or onto a single substrate. This is far different fromsoldering resistors, capacitors, transistors, inductors, and other discrete components into place with wiresand lugs. The component characteristics built into microcircuits are referred to as ELEMENTS rather thandiscrete components. Microcircuits have a high number of these elements per substrate compared to acircuit with discrete components of the same relative size. As a matter of fact, microelectronic circuitsoften contain thousands of times the number of discrete components. The term HIGH EQUIVALENTCIRCUIT DENSITY is a description of this element-to-discrete part relationship. For example, supposeyou have a circuit with 1,000 discrete components mounted on a chassis which is 8 × 10 × 2 inches. Theequivalent circuit in microelectronics might be built into or onto a single substrate which is only 3/8 × 1 ×1/4 inch. The 1,000 elements of the microcircuit would be very close to each other (high density) by1-32
comparison to the distance between discrete components mounted on the large chassis. The elementswithin the substrate are interconnected on the single substrate itself to perform an electronic function. Amicrocircuit does not have any discrete components mounted on it as do printed circuit boards, circuitcard assemblies, and modules composed exclusively of discrete component parts.Microcircuit ModuleMicrocircuits may be used in combination with discrete components. An assembly of microcircuitsor a combination of microcircuits and discrete conventional electronic components that performs one ormore distinct functions is a microcircuit module. The module is constructed as an independentlypackaged, replaceable unit. Examples of microcircuit modules are printed circuit boards and circuit cardassemblies. Figure 1-35 is a photograph of a typical microcircuit module.Miniature ElectronicsFigure 1-35.—Microcircuit module.Miniature electronics includes miniature electronic components and packages. Some examples areprinted circuit boards, printed wiring boards, circuit card assemblies, and modules composed exclusivelyof discrete electronic parts and components (excluding microelectronic packages) mounted on boards,assemblies, or modules. MOTHER BOARDS, large printed circuit boards with plug-in modules, areconsidered miniature electronics. Cordwood modules also fall into this category. Miniature motors,synchros, switches, relays, timers, and so forth, are also classified as miniature electronics.Recall that microelectronic components contain integrated circuits. Miniature electronics containdiscrete elements or parts. You will notice that printed circuit boards and circuit card assemblies arementioned in more than one definition. To identify the class (microminiature or miniature) of the unit,you must first determine the types of components used.Q37. Standardized terms improve what action between individuals?Q38. Microcircuit refers to any component containing what types of elements?Q39. Components made up exclusively of discrete elements are classified as what type of electronics?SYSTEM PACKAGINGWhen a new electronics system is developed, several areas of planning require special attention. Anarea of great concern is that of ensuring that the system performs properly. The designer must take into1-33
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45: Figure 1-34.—Manufacturer's Data
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89: Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91: other than eutectic, go through a p
Page 92 and 93: A1. Chief of Naval Operations (CNO)
Page 94 and 95: CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
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Figure 3-23.—Pcb conductor damage
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REPAIRING DELAMINATED CONDUCTORS.
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5. The repair is completed using th
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SAFETYSafety is a subject of utmost
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OBJECT OR PROCESSWORK SURFACESFLOOR
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8. When moving an ESDS device or as
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Power ToolsHazards associated with
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dispensers will prevent many accide
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A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
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APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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___________________________________
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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