Navy Electricity and Electronics Training Series - Historic Naval ...

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A43. Conventional printed circuit boards, multilayer printed circuit boards and modular assemblies.A44. Clearance hole, plated-through hole, and layer build-up.A45. Difficulty of repair of internal connections.A46. Cordwood modules.A47. Procurement specifications.A48. Military Standards.A49. Equipment designers (planners).A50. Ground planes, shielding, component placement.1-56
CHAPTER 2MINIATURE/MICROMINIATURE (2M) REPAIRPROGRAM AND HIGH-RELIABILITY SOLDERINGLEARNING OBJECTIVESUpon completion of this topic, the student will be able to:1. State the purpose and need for training and certification of 2M repair technicians.2. Explain the maintenance levels at which maintenance is performed.3. Identify the specialized and general test equipment used in fault isolation.4. Recognize the specialized types of tools used and the importance of repair facilities.5. Explain the principles of high-reliability soldering.INTRODUCTIONAs mentioned in topic 1, advances in the field of microelectronics are impressive. With every stepforward in production development, a corresponding step forward must be made in maintenance andrepair techniques.This topic will teach you how the Navy is coping with the new technology and how personnel aretrained to carry out the maintenance and repair of complex equipment. The program discussed in thistopic is up to date at this time, but as industry advances, so must the capabilities of the technician.MINIATURE AND MICROMINIATURE (2M) ELECTRONIC REPAIR PROGRAMTraining requirements for miniature and microminiature repair personnel were developed underguidelines established by the Chief of Naval Operations. The Naval Sea Systems Command (NAVSEA)developed a program which provides for the proper training in miniature and microminiature repair. Thisprogram, NAVSEA Miniature/Microminiature (2M) Electronic Repair, authorizes and provides propertools and equipment and establishes a personnel certification program to maintain quality repair.The Naval Air Systems Command has developed a similar program specifically for the aviationcommunity. The two programs are patterned after the National Aeronautics and Space Administration(NASA) high-reliability soldering studies and have few differences other than the administrative chain ofcommand. For purposes of this topic, we will use the NAVSEA manual for reference.The 2M program covers all phases of miniature and microminiature repair. It establishes the trainingcurriculum for repair personnel, outlines standards of workmanship, and provides guidelines for specificrepairs to equipment, including the types of tools to use. This part of the program ensures high-reliabilityrepairs by qualified technicians.2-1
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89: Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91: other than eutectic, go through a p
Page 92 and 93: A1. Chief of Naval Operations (CNO)
Page 94 and 95: CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97: The coating material can best be id
Page 98 and 99: Figure 3-3.—Rotary tool conformal
Page 100 and 101: Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107: Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
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Figure 3-23.—Pcb conductor damage
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REPAIRING DELAMINATED CONDUCTORS.
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5. The repair is completed using th
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SAFETYSafety is a subject of utmost
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OBJECT OR PROCESSWORK SURFACESFLOOR
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8. When moving an ESDS device or as
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Power ToolsHazards associated with
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dispensers will prevent many accide
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A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
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APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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___________________________________
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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