Navy Electricity and Electronics Training Series - Historic Naval ...

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ASSIGNMENT 2Textbook assignment: Chapter 3, “Miniature and Microminiature Repair Procedures,” pages 3-1 through3-51._________________________________________________________________________________________2-1. Which of the following requirements mustbe met by a 2M technician to be authorizedto perform repairs at a particular level?1. Have knowledge of that level2. Be certified at that level3. Be experienced at that level4. Be licensed at the next higher level2-2. Protective materials applied to electronicassemblies to prevent damage caused bycorrosion, moisture, and stress are called1. conformal coatings2. isolation materials3. electrical insulation4. encapsulation coatings2-3. Before working on a pcb, the conformalcoating should be removed from what partof the board?1. The entire board2. The component side3. The area of the repair4. The side opposite the component side2-4. What are the approved methods ofconformal coating removal?1. Peeling and abrading2. Stripping and heating3. Mechanical and thermal only4. Mechanical, thermal, and chemical2-6. What is the preferred method of removingepoxy conformal coatings?1. Solvent2. Ball mill3. Hot-air jet4. Thermal parting tool2-7. A conformal coating is considered to bethin if it is less than what thickness?1. 0.025 inches2. 0.040 inches3. 0.050 inches4. 0.250 inches2-8. Of the various mechanical methods ofconformal coating removal, physicalcontact with the work piece is NOTrequired using which of the followingmethods?1. Cutting2. Grinding3. Hot-air jet4. Thermal parting2-9. Cutting and peeling is an easy method ofremoving which of the following types ofcoatings?1. Epox2. Varnish3. Parylene4. Silicone2-5. Most methods of conformal coatingremoval are variations of which of thefollowing types of removal?1. Thermal2. Chemical3. Mechanical4. Electrical12
2-10. Thin acrylic coatings are readily removedin which of the following ways?1. Routing2. Hot-air jet3. Cut and peel4. Mild solvents2-11. When applying an application ofconformal coating, which of the followingconditions is true?1. The board should be clean and moist2. The coating should be applied only tothe component replaced3. The coating should be the same type asthat used by the manufacturer4. The coating should be applied only tothe solder joints2-12. The procedure of connecting circuitry onone side of a board with the circuitry onthe other side is known as1. mounting2. termination3. hole reinforcement4. interfacial connections2-13. Reinforcement for circuit pads on bothsides of the board is provided by which ofthe following types of eyelets?1. Flat-set2. Roll-set3. Funnel-set2-14. The manner in which wires and leads areattached to an assembly is described bywhich of the following terms?1. Termination2. Solder joints3. Lead formation4. Interfacial connections2-15. Clinched leads, straight-through leads, andoffset pads are variations of what type oftermination?1. Solder cup2. On-the-board3. Above-the-board4. Through-hole2-16. What total number of degrees of bend are(a) fully clinched leads and (b)semiclinched leads?1. (a) 45 (b) 902. (a) 45 (b) 453. (a) 90 (b) 454. (a) 90 (b) 902-17. Which of the following types of terminalsare used as tie points for interconnectingwiring?1. Pins2. Hooks3. Solder cups4. Turrets2-18. During assembly, component stability isprovided by which of the following typesof lead termination?1. Hook terminal2. Clinched lead3. Turret terminal4. On-the-board (lap-flow)2-19. Which of the following types of leadterminations is the easiest to remove andrework?1. Offset-pad2. Semiclinched3. Fully clinched4. Straight-through13
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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