Navy Electricity and Electronics Training Series - Historic Naval ...

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Figure 3-16.—Thermal shunt.APPLICATION OF SOLDER AND SOLDERING IRON TIP.—Before solder is applied to thejoint, the surface temperature of the parts being soldered is increased above the solder melting point. Ingeneral, the soldering iron is applied to the point of greatest mass at the connection. This increases theheat in the parts to be soldered. Solder is then applied to a clean, fluxed, and properly heated surface.When properly applied, the solder melts and flows without direct contact with the heat source andprovides a smooth, even surface that feathers to a thin edge.Molten solder forms between the tip and the joint, creating a heat bridge or thermal linkage. Thisheat bridge causes the tip to become part of the joint and allows rapid heat transfer. A solder (heat) bridgeis formed by melting a small amount of solder at the junction of the tip and the mass being soldered as theiron is applied. After the tip makes contact with the lead and the pad and after the heat bridge isestablished, the solder is applied with a wiping motion to form the solder bond. The completed solderjoint should be bright and shiny in appearance. It should have no cracks or pits, and the solder shouldcover the pad. Examples of preferred solder joints are shown in figure 3-17. They are referred to as fullfillet joints.3-24
Figure 3-17.—Preferred solder joint.When a solder joint is completed, solvent must be used to remove all flux residue. The two mosthighly recommended solvents, in the order of their effectiveness, are 99.5 percent pure ethyl alcohol and99.5 percent pure isopropyl alcohol.Q19. What is solderability?Q20. What is the most common source of heat in electronic soldering?Q21. What determines the shape and size of a soldering iron tip?Q22. What term describes a device used to conduct heat away from a component?Q23. What is the appearance of a properly soldered joint?REMOVAL AND REPLACEMENT OF DIPSIn topic 1 you learned the advantages of DIPs. They are easily inserted by hand or machine andrequire no special spreaders, spacers, insulators, or lead-forming tools. Standard hand tools and solderingequipment can be used to remove and replace DIPS.DIPs may be mounted on a board in two ways: (1) They may be mounted by plugging them into DIPmounting sockets that are soldered to the printed circuit boards or (2) they are soldered in place and mayor may not be conformally coated. Although plug-ins are very easy to service, they lack the reliability ofsoldered-in units, do not meet MILSPECS, and are seldom used in military designed equipment. They aresusceptible to loosening because of vibration and to poor electrical contact because of dust and dirt andcorrosion.3-25
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89: Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91: other than eutectic, go through a p
Page 92 and 93: A1. Chief of Naval Operations (CNO)
Page 94 and 95: CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97: The coating material can best be id
Page 98 and 99: Figure 3-3.—Rotary tool conformal
Page 100 and 101: Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107: Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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