Navy Electricity and Electronics Training Series - Historic Naval ...

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maintenance you can replace the faulty module with a good one. The faulty module can then be repairedat a later time or discarded. This concept significantly reduces the time equipment is inoperable.Figure 1-37.—Printed circuit board (pcb).LEVEL II.—Level II packaging is composed of large printed circuit boards and/or cards (motherboards). Typical units of this level are shown in figures 1-37 and 1-38. In figure 1-38 the card measures15 × 5.25 inches. The large dual inline packages (DIPs) are 2.25 inches x 0.75 inch. Other DIPs on thepcb are much smaller. Interconnections are shown between DIPs. You should also be able to locate a fewdiscrete components. Repair consists of removing the faulty DIP or discrete component from the pcb andreplacing it with a new part. Then the pcb is placed back into service. The removed part may be a level 0or I part and would be handled as described in those sections. In some cases, the entire pcb should bereplaced.Figure 1-38.—Printed circuit board (pcb).1-35
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 51 and 52: • allow greater wiring density on
Page 53 and 54: Figure 1-42.—Layer build-up techn
Page 55 and 56: Figure 1-43C.—Evolution of modula
Page 57 and 58: are shown in figure 1-44. As shown
Page 59 and 60: FILM COMPONENTS are passive element
Page 61 and 62: FLIP CHIPS and BEAM-LEAD CHIPS are
Page 63 and 64: Numbers and letters on schematics a
Page 65 and 66: LEVEL IV - Cabinets.The most common
Page 67 and 68: ELECTRICAL FACTORS are overcome by
Page 69 and 70: A15. Combination of monolithic ICs
Page 71 and 72: CHAPTER 2MINIATURE/MICROMINIATURE (
Page 73 and 74: ORGANIZATIONAL-LEVEL MAINTENANCESM&
Page 75 and 76: which equipments are being tested a
Page 77 and 78: Figure 2-1.—Repair station power
Page 79 and 80: Soldering IronsA soldering iron is
Page 81 and 82: Figure 2-7.—Card holder and magni
Page 83 and 84: Figure 2-10.—Pliers, tweezers, an
Page 85 and 86: Figure 2-10c.—Dental tools.Eyelet
Page 87 and 88: Figure 2-13.—Safety equipment.STE
Page 89 and 90: found in closed ventilation systems
Page 91 and 92: SUMMARYThis topic has presented inf
Page 93 and 94: CHAPTER 3MINIATURE AND MICROMINIATU
Page 95 and 96: Table 3-1.—Conformal Coating Remo
Page 97 and 98: physically contact the workpiece su
Page 99 and 100:
Conformal coating application techn
Page 101 and 102:
As you can see, the flat-set eyelet
Page 103 and 104:
The Offset-Pad Termination.—This
Page 105 and 106:
Figure 3-8C.—Terminals. HOOK TERM
Page 107 and 108:
Figure 3-9.—On-the-board terminat
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Because 100 percent of the solder c
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the delicate pad. This method is se
Page 113 and 114:
Figure 3-13.—Minimum distance lea
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Q18. In what direction are componen
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Figure 3-17.—Preferred solder joi
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the chance of damage to the board.
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Figure 3-20.—Imbedded TO removal.
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Because most replacement flat packs
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Figure 3-24.—Clinched-staple repa
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must not flex the board. Rebuilding
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2. Repairable delaminations not ext
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Table 3-2.—Typical Measured Stati
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touched with a bare hand. Figure 3-
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Figure 3-33.—Typical ESD ground w
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• Do not solder electronic equipm
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Component LEADS are terminated eith
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ELECTROSTATIC DISCHARGE (ESD) can d
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A28. Inspect and test.A29. Operatio
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EPITAXIAL PROCESS—The depositing
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THIN FILM COMPONENTS—Passive circ
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MODULE 14 INDEXBBuilt-in test equip
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OOff-line test equipment, 2-5On-lin
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ASSIGNMENT 1Textbook assignment: Ch
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1-15. Integrated circuits containin
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1-31. Which of the following types
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1-41. An assembly of microcircuits
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1-57. SM & R code D maintenance fac
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1-74. Which of the following alloys
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2-10. Thin acrylic coatings are rea
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2-29. A 2M technician is repairing
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2-44. What is the most critical ste
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2-60. To prevent an electrostatic c
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