Navy Electricity and Electronics Training Series - Historic Naval ...

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Figure 1-22.—Enlarged flat pack exploded view.After the external leads are sealed to the mounting base, the rectangular area on the inside bottom ofthe base is treated with metal slurry to provide a surface suitable for bonding the monolithic die to thebase. The lead and the metalized area in the bottom of the package are plated with gold. The die is thenattached by gold-silicon bonding.The die-bonding step is followed by bonding gold or aluminum wires between the bonding islandson the IC die and on the inner portions of the package leads. Next, a glass-soldered preformed frame isplaced on top of the mounting base. One surface of the ceramic cover is coated with Pyroceram glass, andthe cover is placed on top of the mounting base. The entire assembly is placed in an oven at 450 degreesCelsius. This causes the glass solder and Pyroceram to fuse and seal the cover to the mounting base. Aceramic flat pack is shown in figure 1-23. It has been opened so that you can see the chip and bondingwires.Figure 1-23.—Typical flat pack.1-22
Dual Inline PackageThe dual inline package (DIP) was designed primarily to overcome the difficulties associated withhandling and inserting packages into mounting boards. DIPs are easily inserted by hand or machine andrequire no spreaders, spacers, insulators, or lead-forming tools. Standard hand tools and soldering ironscan be used to field-service the devices. Plastic DIPs are finding wide use in commercial applications, anda number of military systems are incorporating ceramic DIPS.The progressive stages in the assembly of a ceramic DIP are illustrated in figure 1-24, views (A)through (E). The integrated-circuit die is sandwiched between the two ceramic elements, as shown inview (A). The element on the left of view (A) is the bottom half of the sandwich and will hold theintegrated-circuit die. The ceramic section on the right is the top of the sandwich. The large well in view(B) protects the IC die from mechanical stress during sealing operations. Each of the ceramic elements iscoated with glass which has a low melting temperature for subsequent joining and sealing. View (B)shows the Kovar lead frame stamped and bent into its final shape. The excess material is intended topreserve pin alignment. The holes at each end are for the keying jig used in the final sealing operation.The lower half of the ceramic package is inserted into the lead frame shown in view (C). The die ismounted in the well and leads are attached. The top ceramic elements are bonded to the bottom elementshown in view (D) and the excess material is removed from the package. View (E) is the final product.Figure 1-24.—DIP packaging steps.Ceramic DIPs are processed individually while plastic DIPs are processed in quantities of two ormore (in chain fashion). After processing, the packages are sawed apart. The plastic package also uses aKovar lead frame, but the leads are not bent until the package is completed. Because molded plastic is1-23
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35: Figure 1-21A.—TO-5 mounting PLUG-
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87:
Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
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Figure 3-23.—Pcb conductor damage
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REPAIRING DELAMINATED CONDUCTORS.
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5. The repair is completed using th
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SAFETYSafety is a subject of utmost
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OBJECT OR PROCESSWORK SURFACESFLOOR
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8. When moving an ESDS device or as
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Power ToolsHazards associated with
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dispensers will prevent many accide
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A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146:
APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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___________________________________
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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