Navy Electricity and Electronics Training Series - Historic Naval ...

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A1. Chief of Naval Operations (CNO).ANSWERS TO QUESTIONS Q1. THROUGH Q14.A2. Naval Sea Systems Command (NAVSEASYSCOM) and Naval Air Systems Command(NAVAIRSYSCOM).A3. Microminiature component repair.A4. Microminiature repair technician.A5. Depot, Intermediate, and Organizational.A6. Organizational.A7. On-line, off-line, and General Purpose Electronic Test Equipment (GPETE).A8. On-line.A9. Off-line.A10. Microminiature repair station.A11. Tin and lead.A12. Eutectic.A13. Oxides.A14. Chloride or (acid) and organic.2-22
CHAPTER 3MINIATURE AND MICROMINIATURE REPAIRPROCEDURESLEARNING OBJECTIVESUpon completion of this topic, the student will be able to:1. Explain the purpose of conformal coatings and the methods used for removal and replacement ofthese coatings.2. Explain the methods and practices for the removal and replacement of discrete components onprinted circuit boards.3. Identify types of damage to printed circuit boards, and describe the repair procedures for eachtype of repair.4. Describe the removal and replacement of the dual-in-line integrated circuit.5. Describe the removal and replacement of the TO-5 integrated circuit.6. Describe the removal and replacement of the flat-pack integrated circuit.7. Describe the types of damage to which many microelectronic components are susceptible andmethods of preventing damage.8. Explain safety precautions as they relate to 2M repair.INTRODUCTIONAs you progress in your training as a technician, you will find that the skill and knowledge levelsrequired to maintain electronic systems become more demanding. The increased use of miniature andmicrominiature electronic circuits, circuit complexity, and new manufacturing techniques will make yourjob more challenging. To maintain and repair equipment effectively, you will have to duplicate withlimited facilities what was accomplished in the factory with extensive facilities. Printed circuit boards thatwere manufactured completely by machine will have to be repaired by hand.To meet the needs for repairing the full range of electronic equipment, you must be properly trained.You must be capable of performing high-quality, reliable repairs to the latest circuitry.MINIATURE AND MICROMINIATURE ELECTRONIC REPAIR PROCEDURESAs mentioned at the beginning of topic 2, 2M repair personnel must undergo specialized training.They are trained for a particular level of repair and must be certified at that level. Also, recertification isrequired to ensure the continued high-quality repair ability of these technicians.3-1
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89: Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91: other than eutectic, go through a p
Page 94 and 95: CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97: The coating material can best be id
Page 98 and 99: Figure 3-3.—Rotary tool conformal
Page 100 and 101: Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107: Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
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APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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___________________________________
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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