Navy Electricity and Electronics Training Series - Historic Naval ...

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1-24. Vacuum evaporation and cathodesputtering are two methods used toproduce which of the following types ofcomponents?1. Diodes2. Thin-film3. Thick-film4. Transistors1-25. To deposit highly reactive materials on asubstrate, which of the followingmethods is used?1. Photoetching2. Photolithography3. Cathode sputtering4. Vacuum evaporation_______________________________________IN ANSWERING QUESTIONS 1-29 AND1-30, MATCH THE IC PACKING EXAMPLESIN THE QUESTIONS TO THE PACKAGINGDESCRIPTIONS IN FIGURE 1A.A. TOB. DIPC. FlatpackD. HybridFigure 1A. ⎯Packaging descriptions._______________________________________1-29.1-26. To produce thin film resistors, which ofthe following materials is/are used?1. Nichrome2. Tantalum3. Titanium4. Each of the above1-27. Which of the following is a majoradvantage of hybrid ICs?1. Ease of manufacture2. Ease of replacement3. Design flexibility4. Easy availability1-30.1. A2. B3. C4. D1-28. IC packaging is required for which ofthe following reasons?1. To dissipate heat2. For ease of handling3. To increase shelf life4. To meet stowage requirements1. A2. B3. C4. D4
1-31. Which of the following types of DIPsare most commonly used in the Navy'smicroelectronics systems?1. Glass2. Metal3. Ceramic4. Plastic1-32. In IC production, gold or aluminumbonding wires are used for which of thefollowing purposes?1. To bond the chip to the package2. To provide component isolation3. To connect the package to thecircuit board4. To connect the chip to the packageleads1-33. IC packages that may be easily installedby hand or machine on mounting boardsfall into which of the followingcategories?1. TO2. DIP3. Flatpack4. Each of the above1-34. The need for bonding wires has beeneliminated by which of the followingproduction techniques?1. LSI2. Beam lead3. Flip chip4. Both 2 and 3 aboveTHIS SPACE LEFT BLANKINTENTIONALLY.5
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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