Navy Electricity and Electronics Training Series - Historic Naval ...

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CHAPTER 1MICROELECTRONICSLEARNING OBJECTIVESLearning objectives are stated at the beginning of each topic. These learning objectives serve as apreview of the information you are expected to learn in the topic. The comprehensive check questions arebased on the objectives. By successfully completing the OCC-ECC, you indicate that you have met theobjectives and have learned the information. The learning objectives are listed below.Upon completion of this topic, you will be able to:1. Outline the progress made in the history of microelectronics.2. Describe the evolution of microelectronics from point-to-point wiring through high elementdensity state-of-the-art microelectronics.3. List the advantages and disadvantages of point-to-point wiring and high element density state-ofthe-artmicroelectronics.4. Identify printed circuit boards, diodes, transistors, and the various types of integrated circuits.Describe the fabrication techniques of these components.5. Define the terminology used in microelectronic technology including the following terms usedby the Naval Systems Commands:a. microelectronicsb. microcircuitc. microcircuit moduled. miniature electronicse. system packagingf. levels of packaging (0 to IV)g. modular assembliesh. cordwood modulesi. micromodules6. Describe typical packaging levels presently used for microelectronic systems.7. Describe typical interconnections used in microelectronic systems.8. Describe environmental considerations for microelectronics.1-1
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 16 and 17: INTRODUCTIONIn NEETS, Module 6, Int
Page 18 and 19: Figure 1-2.—Point-to-point wiring
Page 20 and 21: Another mounting form that has been
Page 22 and 23: used instead of one that has been s
Page 24 and 25: Figure 1-8.—Wafer mask distributi
Page 26 and 27: Q21. Describe the preparation of a
Page 28 and 29: EPITAXIAL METHOD.—The EPITAXIAL p
Page 30 and 31: The vacuum evaporation technique is
Page 32 and 33: Hybrid MicrocircuitA hybrid microci
Page 34 and 35: Figure 1-19.—Exploded TO-5.Figure
Page 36 and 37: Figure 1-22.—Enlarged flat pack e
Page 38 and 39: used to encapsulate the IC die, no
Page 40 and 41: You should recall from NEETS, Modul
Page 42 and 43: Figure 1-30A.—DIP and flat-pack l
Page 44 and 45: Figure 1-33.—Manufacturer's Data
Page 46 and 47: Q32. On DIP and flat-pack ICs viewe
Page 49 and 50: maintenance you can replace the fau
Page 51 and 52: • allow greater wiring density on
Page 53 and 54: Figure 1-42.—Layer build-up techn
Page 55 and 56: Figure 1-43C.—Evolution of modula
Page 57 and 58: are shown in figure 1-44. As shown
Page 59 and 60: FILM COMPONENTS are passive element
Page 61 and 62: FLIP CHIPS and BEAM-LEAD CHIPS are
Page 63 and 64: Numbers and letters on schematics a
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LEVEL IV - Cabinets.The most common
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ELECTRICAL FACTORS are overcome by
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A15. Combination of monolithic ICs
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CHAPTER 2MINIATURE/MICROMINIATURE (
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ORGANIZATIONAL-LEVEL MAINTENANCESM&
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which equipments are being tested a
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Figure 2-1.—Repair station power
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Soldering IronsA soldering iron is
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Figure 2-7.—Card holder and magni
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Figure 2-10.—Pliers, tweezers, an
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Figure 2-10c.—Dental tools.Eyelet
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Figure 2-13.—Safety equipment.STE
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found in closed ventilation systems
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SUMMARYThis topic has presented inf
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CHAPTER 3MINIATURE AND MICROMINIATU
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Table 3-1.—Conformal Coating Remo
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physically contact the workpiece su
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Conformal coating application techn
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As you can see, the flat-set eyelet
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The Offset-Pad Termination.—This
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Figure 3-8C.—Terminals. HOOK TERM
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Figure 3-9.—On-the-board terminat
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Because 100 percent of the solder c
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the delicate pad. This method is se
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Figure 3-13.—Minimum distance lea
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Q18. In what direction are componen
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Figure 3-17.—Preferred solder joi
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the chance of damage to the board.
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Figure 3-20.—Imbedded TO removal.
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Because most replacement flat packs
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Figure 3-24.—Clinched-staple repa
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must not flex the board. Rebuilding
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2. Repairable delaminations not ext
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Table 3-2.—Typical Measured Stati
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touched with a bare hand. Figure 3-
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Figure 3-33.—Typical ESD ground w
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• Do not solder electronic equipm
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Component LEADS are terminated eith
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ELECTROSTATIC DISCHARGE (ESD) can d
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A28. Inspect and test.A29. Operatio
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EPITAXIAL PROCESS—The depositing
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THIN FILM COMPONENTS—Passive circ
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MODULE 14 INDEXBBuilt-in test equip
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OOff-line test equipment, 2-5On-lin
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ASSIGNMENT 1Textbook assignment: Ch
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1-15. Integrated circuits containin
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1-31. Which of the following types
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1-41. An assembly of microcircuits
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1-57. SM & R code D maintenance fac
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1-74. Which of the following alloys
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2-10. Thin acrylic coatings are rea
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2-29. A 2M technician is repairing
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2-44. What is the most critical ste
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2-60. To prevent an electrostatic c
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