- Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
- Page 3 and 4: PREFACEBy enrolling in this self-st
- Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
- Page 8 and 9: Module 11, Microwave Principles, ex
- Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
- Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
- Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
- Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
- Page 19 and 20: SOLID-STATE DEVICESNow would be a g
- Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
- Page 23 and 24: Development of a microelectronic de
- Page 25 and 26: Figure 1-9.—Crystal furnace.The c
- Page 27 and 28: Figure 1-12.—Planar-diffused tran
- Page 29 and 30: Figure 1-14.—Vacuum evaporation o
- Page 31 and 32: Figure 1-17.—Cathode-sputtering m
- Page 33: Q23. How do the two types of monoli
- Page 37 and 38: Dual Inline PackageThe dual inline
- Page 39 and 40: wafer, as shown in figure 1-27. Thi
- Page 41 and 42: Figure 1-29.—J-K flip-flop discre
- Page 43 and 44: Figure 1-31.—Lead numbering for a
- Page 45 and 46: Figure 1-34.—Manufacturer's Data
- Page 47: comparison to the distance between
- Page 50 and 51: LEVEL III.—Drawers or pull-out ch
- Page 52 and 53: Conductors located several layers b
- Page 54 and 55: Figure 1-43A.—Evolution of modula
- Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
- Page 58 and 59: SUMMARYThis topic has presented inf
- Page 60 and 61: Rapid development has resulted in i
- Page 62 and 63: Large DIPs are being used to packag
- Page 64 and 65: MINIATURE ELECTRONICS are card asse
- Page 66 and 67: Three methods of interconnecting ci
- Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
- Page 70 and 71: A43. Conventional printed circuit b
- Page 72 and 73: Upon satisfactory completion of a 2
- Page 74 and 75: One such improvement in system test
- Page 76 and 77: those that should be observed when
- Page 78 and 79: Figure 2-2.—Low voltage Handpiece
- Page 80 and 81: Figure 2-6.—Rotary-drive machine
- Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
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Figure 3-23.—Pcb conductor damage
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REPAIRING DELAMINATED CONDUCTORS.
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5. The repair is completed using th
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SAFETYSafety is a subject of utmost
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OBJECT OR PROCESSWORK SURFACESFLOOR
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8. When moving an ESDS device or as
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Power ToolsHazards associated with
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dispensers will prevent many accide
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A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
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APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b