Navy Electricity and Electronics Training Series - Historic Naval ...

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2-20. Turret, fork, and hook terminals areexamples of what type of termination?1. Off-set2. On-the-board3. Above-the-board4. Through-the-board2-21. When a lead is soldered to a pad withoutpassing it through the board, what type oftermination has been made?1. Lap-flow2. Off-set pad3. Clinched lead4. Straight-through lead2-22. Most damage to printed circuit boardsoccurs at which of the following times?1. During trouble shooting2. During component removal3. During component replacement4. During normal system operations2-23. Of the solder removal methods listedbelow, which one is most versatile andreliable?1. Wicking2. Heat and shake3. Motorized solder extractor4. Manually controlled vacuum plunge2-25. The motorized solder extractor may beoperated in three different modes. Whichof the following is NOT one of thosemodes?1. Hot-air jet2. One-shot vacuum3. Heat and vacuum4. Heat and pressure2-26. Stirring the lead during desolderingprevents which of the following unwantedresults?1. Sweat joints2. Overheating3. Cold solder joints4. Pad delamination2-27. Of the following solder removal methods,which one is acceptable for removingsolder?1. Hot-air jet2. Heat and pull3. Heat and shake4. Heat and squeeze2-28. Which of the following examplesrepresents properly formed leads?2-24. When removing solder with a solder wick,where should the wick be placed inrelation to the solder joint and the iron?1. Below both the joint and the iron2. Between the joint and the iron3. Above the joint and the iron14
2-29. A 2M technician is repairing a board thatis manufactured with semiclinched leads.What type of termination should thetechnician use in replacing components?1. Lap flow2. Clinched lead3. Semiclinched lead4. Straight-through-lead2-32. The shape and size of the soldering iron tipto be used is determined by which of thefollowing factors?1. The type of flux to be used2. The type of work to be done3. The type of solder to be used4. The voltage source for the iron2-33. A thermal shunt is attached to the leads ofa transistor prior to applying solder to thejoint. This shunt serves what purpose?1. Prevents short circuits2. Retains heat at the joint3. Conducts heat away from thecomponent4. Physically supports the lead duringsoldering2-34. What is the appearance of a good solderjoint?Figure 2A.⎯Component mounting.IN ANSWERING QUESTION 2-30, REFER TOFIGURE 2A.2-30. What component on the board is NOTproperly mounted?1. A2. B3. C4. D1. Dull gray2. Crystalline3. Bright and shiny4. Shiny with small pits2-35. What is the most efficient solderingtemperature?1. 360 °F2. 440 °F3. 550 °F4. 800 °F2-31. What type of heat source is a solderingiron?1. Radiant2. Resistive3. Conductive4. Convective15
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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