Navy Electricity and Electronics Training Series - Historic Naval ...

More documents

Recommendations

Info

used to encapsulate the IC die, no void will exist between the cover and die, as is the case with ceramicpackaging.At present, ceramic DIPs are the most common of the two package types to be found in Navymicroelectronic systems. Figure 1-25 shows a DIP which has been opened.RECENT DEVELOPMENTS IN PACKAGINGFigure 1-25.—Dual inline package (DIP).Considerable effort has been devoted to eliminating the fine wires used to connect ICs to Kovarleads. The omission of these wires reduces the cost of integrated circuits by eliminating the costsassociated with the bonding process. Further, omission of the wires improves reliability by eliminating acommon cause of circuit failure.A promising packaging technique is the face-down (FLIP-CHIP) mounting method by whichconductive patterns are evaporated inside the package before the die is attached. These patterns connectthe external leads to bonding pads on the inside surface of the die. The pads are then bonded toappropriate pedestals on the package that correspond to those of the bonding pads on the die (figure 1-26).Figure 1-26.—Flip-chip package.The BEAM-LEAD technique is a process developed to batch-fabricate (fabricate many at once)semiconductor circuit elements and integrated circuits with electrodes extended beyond the edges of the1-24
wafer, as shown in figure 1-27. This type of structure imposes no electrical difficulty, and parasiticcapacitance (under 0.05 picofarad per lead) is equivalent to that of a wire-bonded and brazed-chipassembly. In addition, the electrodes may be tapered to allow for lower inductance, impedance matching,and better heat conductance. The beam-lead technique is easily accomplished and does not have thedisadvantages of chip brazing and wire bonding. The feasibility of this technique has been demonstratedin a variety of digital, linear, and thin-film circuits.Figure 1-27.—Beam-lead technique.Another advance in packaging is that of increasing the size of DIPs. General purpose DIPs have from4 to 16 pins. Because of lsi and vlsi, manufacturers are producing DIPs with up to 64 pins. Although sizeis increased considerably, all the advantages of the DIP are retained. DIPs are normally designed to aparticular specification set by the user.Q29. What is the purpose of the IC package?Q30. What are the three most common types of packages?Q31. What two methods of manufacture are being used to eliminate bonding wires?EQUIVALENT CIRCUITSAt the beginning of this topic, we discussed many applications of microelectronics. You shouldunderstand that these applications cover all areas of modern electronics technology. Microelectronic ICsare produced that can be used in many of these varying circuit applications to satisfy the needs of moderntechnology. This section will introduce you to some of these applications and will show you someEQUIVALENT CIRCUIT comparisons of discrete components and integrated circuits.J-K FLIP-FLOP AND IC SIZESIntegrated circuits can be produced that combine all the elements of a complete electronic circuit.This can be done with either a single chip of silicon or a single chip of silicon in combination with filmcomponents. The importance of this new production method in the evolution of microelectronics can bedemonstrated by comparing a conventional J-K flip-flop circuit incorporating solid-state discrete devicesand the same type of circuit employing integrated circuitry. (A J-K flip-flop is a circuit used primarily incomputers.)1-25
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37: Dual Inline PackageThe dual inline
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89:
Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91:
other than eutectic, go through a p
Page 92 and 93:
A1. Chief of Naval Operations (CNO)
Page 94 and 95:
CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97:
The coating material can best be id
Page 98 and 99:
Figure 3-3.—Rotary tool conformal
Page 100 and 101:
Figure 3-4A.—Eyelets (interfacial
Page 102 and 103:
Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105:
Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107:
Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109:
Figure 3-10.—Solder wicking.This
Page 110 and 111:
Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113:
INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115:
Figure 3-15.—Component arrangemen
Page 116 and 117:
Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119:
Removal of Plug-In DIPsTo remove pl
Page 120 and 121:
Figure 3-19.—TO mounting techniqu
Page 122 and 123:
Figure 3-21.—Flat pack in protect
Page 124 and 125:
Figure 3-23.—Pcb conductor damage
Page 126 and 127:
REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129:
5. The repair is completed using th
Page 130 and 131:
SAFETYSafety is a subject of utmost
Page 132 and 133:
OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135:
8. When moving an ESDS device or as
Page 136 and 137:
Power ToolsHazards associated with
Page 138 and 139:
dispensers will prevent many accide
Page 140 and 141:
A GOOD SOLDER JOINT is bright and s
Page 142 and 143:
ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146:
APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148:
MODULAR PACKAGING—Circuit assembl
Page 149:
APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153:
Microelectronics—Continuedpackagi
Page 155:
Assignment QuestionsInformation: Th
Page 158 and 159:
1-7. Which of the following charact
Page 160 and 161:
1-24. Vacuum evaporation and cathod
Page 162 and 163:
___________________________________
Page 164 and 165:
1-49. Ground planes and shielding a
Page 166 and 167:
1-65. Which of the following types
Page 168 and 169:
ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171:
2-20. Turret, fork, and hook termin
Page 172 and 173:
2-39. Component leads may be clippe
Page 174 and 175:
2-52. To ensure a good mechanical b
show all

Navy Electricity and Electronics Training Series - Historic Naval ...

Create successful ePaper yourself

Delete template?

Save as template?