Navy Electricity and Electronics Training Series - Historic Naval ...

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NAVY ELECTRICITY AND ELECTRONICS TRAININGSERIESThe Navy Electricity and Electronics Training Series (NEETS) was developed for use by personnel inmany electrical- and electronic-related Navy ratings. Written by, and with the advice of, seniortechnicians in these ratings, this series provides beginners with fundamental electrical and electronicconcepts through self-study. The presentation of this series is not oriented to any specific rating structure,but is divided into modules containing related information organized into traditional paths of instruction.The series is designed to give small amounts of information that can be easily digested before advancingfurther into the more complex material. For a student just becoming acquainted with electricity orelectronics, it is highly recommended that the modules be studied in their suggested sequence. Whilethere is a listing of NEETS by module title, the following brief descriptions give a quick overview of howthe individual modules flow together.Module 1, Introduction to Matter, Energy, and Direct Current, introduces the course with a short historyof electricity and electronics and proceeds into the characteristics of matter, energy, and direct current(dc). It also describes some of the general safety precautions and first-aid procedures that should becommon knowledge for a person working in the field of electricity. Related safety hints are locatedthroughout the rest of the series, as well.Module 2, Introduction to Alternating Current and Transformers, is an introduction to alternating current(ac) and transformers, including basic ac theory and fundamentals of electromagnetism, inductance,capacitance, impedance, and transformers.Module 3, Introduction to Circuit Protection, Control, and Measurement, encompasses circuit breakers,fuses, and current limiters used in circuit protection, as well as the theory and use of meters as electricalmeasuring devices.Module 4, Introduction to Electrical Conductors, Wiring Techniques, and Schematic Reading, presentsconductor usage, insulation used as wire covering, splicing, termination of wiring, soldering, and readingelectrical wiring diagrams.Module 5, Introduction to Generators and Motors, is an introduction to generators and motors, andcovers the uses of ac and dc generators and motors in the conversion of electrical and mechanicalenergies.Module 6, Introduction to Electronic Emission, Tubes, and Power Supplies, ties the first five modulestogether in an introduction to vacuum tubes and vacuum-tube power supplies.Module 7, Introduction to Solid-State Devices and Power Supplies, is similar to module 6, but it is inreference to solid-state devices.Module 8, Introduction to Amplifiers, covers amplifiers.Module 9, Introduction to Wave-Generation and Wave-Shaping Circuits, discusses wave generation andwave-shaping circuits.Module 10, Introduction to Wave Propagation, Transmission Lines, and Antennas, presents thecharacteristics of wave propagation, transmission lines, and antennas.v
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 9 and 10: Throughout the text of this course
Page 11 and 12: PASS/FAIL ASSIGNMENT PROCEDURESIf y
Page 13: Student CommentsCourse Title:NEETS
Page 16 and 17: INTRODUCTIONIn NEETS, Module 6, Int
Page 18 and 19: Figure 1-2.—Point-to-point wiring
Page 20 and 21: Another mounting form that has been
Page 22 and 23: used instead of one that has been s
Page 24 and 25: Figure 1-8.—Wafer mask distributi
Page 26 and 27: Q21. Describe the preparation of a
Page 28 and 29: EPITAXIAL METHOD.—The EPITAXIAL p
Page 30 and 31: The vacuum evaporation technique is
Page 32 and 33: Hybrid MicrocircuitA hybrid microci
Page 34 and 35: Figure 1-19.—Exploded TO-5.Figure
Page 36 and 37: Figure 1-22.—Enlarged flat pack e
Page 38 and 39: used to encapsulate the IC die, no
Page 40 and 41: You should recall from NEETS, Modul
Page 42 and 43: Figure 1-30A.—DIP and flat-pack l
Page 44 and 45: Figure 1-33.—Manufacturer's Data
Page 46 and 47: Q32. On DIP and flat-pack ICs viewe
Page 49 and 50: maintenance you can replace the fau
Page 51 and 52: • allow greater wiring density on
Page 53 and 54: Figure 1-42.—Layer build-up techn
Page 55 and 56: Figure 1-43C.—Evolution of modula
Page 57 and 58:
are shown in figure 1-44. As shown
Page 59 and 60:
FILM COMPONENTS are passive element
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FLIP CHIPS and BEAM-LEAD CHIPS are
Page 63 and 64:
Numbers and letters on schematics a
Page 65 and 66:
LEVEL IV - Cabinets.The most common
Page 67 and 68:
ELECTRICAL FACTORS are overcome by
Page 69 and 70:
A15. Combination of monolithic ICs
Page 71 and 72:
CHAPTER 2MINIATURE/MICROMINIATURE (
Page 73 and 74:
ORGANIZATIONAL-LEVEL MAINTENANCESM&
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which equipments are being tested a
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Figure 2-1.—Repair station power
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Soldering IronsA soldering iron is
Page 81 and 82:
Figure 2-7.—Card holder and magni
Page 83 and 84:
Figure 2-10.—Pliers, tweezers, an
Page 85 and 86:
Figure 2-10c.—Dental tools.Eyelet
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Figure 2-13.—Safety equipment.STE
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found in closed ventilation systems
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SUMMARYThis topic has presented inf
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CHAPTER 3MINIATURE AND MICROMINIATU
Page 95 and 96:
Table 3-1.—Conformal Coating Remo
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physically contact the workpiece su
Page 99 and 100:
Conformal coating application techn
Page 101 and 102:
As you can see, the flat-set eyelet
Page 103 and 104:
The Offset-Pad Termination.—This
Page 105 and 106:
Figure 3-8C.—Terminals. HOOK TERM
Page 107 and 108:
Figure 3-9.—On-the-board terminat
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Because 100 percent of the solder c
Page 111 and 112:
the delicate pad. This method is se
Page 113 and 114:
Figure 3-13.—Minimum distance lea
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Q18. In what direction are componen
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Figure 3-17.—Preferred solder joi
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the chance of damage to the board.
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Figure 3-20.—Imbedded TO removal.
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Because most replacement flat packs
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Figure 3-24.—Clinched-staple repa
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must not flex the board. Rebuilding
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2. Repairable delaminations not ext
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Table 3-2.—Typical Measured Stati
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touched with a bare hand. Figure 3-
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Figure 3-33.—Typical ESD ground w
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• Do not solder electronic equipm
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Component LEADS are terminated eith
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ELECTROSTATIC DISCHARGE (ESD) can d
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A28. Inspect and test.A29. Operatio
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EPITAXIAL PROCESS—The depositing
Page 148 and 149:
THIN FILM COMPONENTS—Passive circ
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MODULE 14 INDEXBBuilt-in test equip
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OOff-line test equipment, 2-5On-lin
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ASSIGNMENT 1Textbook assignment: Ch
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1-15. Integrated circuits containin
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1-31. Which of the following types
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1-41. An assembly of microcircuits
Page 165 and 166:
1-57. SM & R code D maintenance fac
Page 167 and 168:
1-74. Which of the following alloys
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2-10. Thin acrylic coatings are rea
Page 171 and 172:
2-29. A 2M technician is repairing
Page 173 and 174:
2-44. What is the most critical ste
Page 175:
2-60. To prevent an electrostatic c
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