Navy Electricity and Electronics Training Series - Historic Naval ...

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Figure 1-2.—Point-to-point wiring.Vacuum-tube circuits proved to be reliable under many conditions. Still, the drawbacks of large size,heavy weight, and significant power consumption made them undesirable in most situations. Forexample, computer systems using tubes were extremely large and difficult to maintain. ENIAC, acompletely electronic computer built in 1945, contained 18,000 tubes. It often required a full day just tolocate and replace faulty tubes.In some applications, we are still limited to vacuum tubes. Cathode-ray tubes used in radar,television, and oscilloscopes do not, as yet, have solid-state counterparts.One concept that eased the technician's job was that of MODULAR PACKAGING. Instead ofbuilding a system on one large chassis, it was built of MODULES or blocks. Each module performed anecessary function of the system. Modules could easily be removed and replaced during troubleshootingand repair. For instance, a faulty power supply could be exchanged with a good one to keep the systemoperational. The faulty unit could then be repaired while out of the system. This is an example of how themodule concept improved the efficiency of electronic systems. Even with these advantages, vacuum tubemodules still had faults. Tubes and point-to-point wiring were still used and excessive size, weight, andpower consumption remained as problems to be overcome.Vacuum tubes were the basis for electronic technology for many years and some are still with us.Still, emphasis in vacuum-tube technology is rapidly becoming a thing of the past. The emphasis oftechnology is in the field of microelectronics.Q4. What discovery proved to be the foundation for the development of the vacuum tube?Q5. Name the components which greatly increase the weight of vacuum-tube circuitry.Q6. What are the disadvantages of point-to-point wiring?Q7. What is a major advantage of modular construction?Q8. When designing vacuum-tube circuits, what characteristics of tubes must be taken intoconsideration?1-4
SOLID-STATE DEVICESNow would be a good time for you to review the first few pages of NEETS, Module 7, Introductionto Solid-State Devices and Power Supplies, as a refresher for solid-state devices.The transition from vacuum tubes to solid-state devices took place rapidly. As new types oftransistors and diodes were created, they were adapted to circuits. The reductions in size, weight, andpower use were impressive. Circuits that earlier weighed as much as 50 pounds were reduced in weight tojust a few ounces by replacing bulky components with the much lighter solid-state devices.The earliest solid-state circuits still relied on point-to-point wiring which caused many of thedisadvantages mentioned earlier. A metal chassis, similar to the type used with tubes, was required toprovide physical support for the components. The solid-state chassis was still considerably smaller andlighter than the older, tube chassis. Still greater improvements in component mounting methods were yetto come.One of the most significant developments in circuit packaging has been the PRINTED CIRCUITBOARD (pcb), as shown in figure 1-3. The pcb is usually an epoxy board on which the circuit leads havebeen added by the PHOTOETCHING process. This process is similar to photography in that copper-cladboards are exposed to controlled light in the desired circuit pattern and then etched to remove theunwanted copper. This process leaves copper strips (LANDS) that are used to connect the components. Ingeneral, printed circuit boards eliminate both the heavy, metal chassis and the point-to-point wiring.Figure 1-3.—Printed circuit board (pcb).Although printed circuit boards represent a major improvement over tube technology, they are notwithout fault. For example, the number of components on each board is limited by the sizes and shapes ofcomponents. Also, while vacuum tubes are easily removed for testing or replacement, pcb componentsare soldered into place and are not as easily removed.Normally, each pcb contains a single circuit or a subassembly of a system. All printed circuit boardswithin the system are routinely interconnected through CABLING HARNESSES (groups of wiring orribbons of wiring). You may be confronted with problems in faulty harness connections that affect systemreliability. Such problems are often caused by wiring errors, because of the large numbers of wires in aharness, and by damage to those wires and connectors.1-5
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
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Figure 3-23.—Pcb conductor damage
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REPAIRING DELAMINATED CONDUCTORS.
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5. The repair is completed using th
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SAFETYSafety is a subject of utmost
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OBJECT OR PROCESSWORK SURFACESFLOOR
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8. When moving an ESDS device or as
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Power ToolsHazards associated with
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dispensers will prevent many accide
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A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
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APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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___________________________________
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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