Navy Electricity and Electronics Training Series - Historic Naval ...

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8. When moving an ESDS device or assembly, always touch (with bare skin) the surface on which itrests for at least one second before picking it up. Before placing it on any surface, touch thesurface with your free hand for at least one second. The bare skin contact provides a safedischarge path for charges accumulated while you are moving around.9. While servicing equipment containing ESD devices, do not handle or touch materials such asplastic, vinyl, synthetic textiles, polished wood, fiberglass, or similar items which create staticcharges; or, be sure to repeat the grounding action with the bare hands after contacting thesematerials. These materials are prime electrostatic generators.10. If possible, avoid repairs that require soldering at the equipment level. Soldering irons must haveheater/tips assemblies that are grounded to ac electrical ground. Do not use ordinary plastic soldersuckers (special antistatic solder suckers are commercially available).11. Ground the leads of test equipment momentarily before you energize the test equipment andbefore you probe ESD items.Grounded Work BenchesWork benches on which ESDS items will be placed and that will be contacted by personnel shouldhave ESD protective work surfaces. These protective surfaces should cover the areas where ESD itemswill be placed. Personnel ground straps are also necessary for ESD protective work bench surfaces. Thesestraps prevent people from discharging a static charge through an ESDS item to the work bench surface.The work bench surface should be connected to ground through a ground cable. The resistance in thebench top ground cable should be located at or near the point of contact with the work bench top. Theresistance should be high enough to limit any leakage current to 5 milliamperes or less; this is taking intoconsideration the highest voltage source within reach of grounded people and all parallel resistances toground, such as wrist ground straps, table tops, and conductive floors. See figure 3-33 for a typical ESDground work bench.3-42
Figure 3-33.—Typical ESD ground work bench.Energized equipment provides protection from ESD damage through operating circuitry. Circuitcards with ESD sensitive devices are generally considered safe when installed in an equipment rack; butthey may be susceptible to damage if a "drawer" or "module" is removed and if connector pins aretouched (even putting on plastic covers can transfer charges that do damage). There must not be anyenergized equipment placed on the conductive ESD work surface. An ESD work area is for "dead"equipment ONLY.ESD protection is critical. If you should be assigned to 2M repair school, your education in ESDprevention will be quite extensive.PERSONAL SAFETYThroughout your career you will be aware of emphasis placed on safety. Safety rules remind you ofpotential dangers in work. Most accidents are preventable. Accidents don't happen without a cause. Mostaccidents are the result of not following prescribed safe operating procedures.This would be a good time to review the safety section in topic 5 of NEETS, Module 2, Introductionto Alternating Current and Transformers. That section covers the basics of electrical shock and how toprevent it.The 2M technician should be aware of other potential dangers in addition to the dangers of electricalshock. These dangers are discussed in the following paragraphs.3-43
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89: Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91: other than eutectic, go through a p
Page 92 and 93: A1. Chief of Naval Operations (CNO)
Page 94 and 95: CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97: The coating material can best be id
Page 98 and 99: Figure 3-3.—Rotary tool conformal
Page 100 and 101: Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107: Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
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Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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