Navy Electricity and Electronics Training Series - Historic Naval ...

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Three methods of interconnecting circuitry in multilayer printed circuit boards are theCLEARANCE-HOLE, the PLATED-THROUGH-HOLE, and LAYER BUILD-UP.MODULAR ASSEMBLIES were devised to achieve high circuit density.Modular assemblies have progressed from CORDWOOD MODULES throughMICROMODULES. Micromodules consist of film components and discrete components to integratedand hybrid circuitry.ENVIRONMENTAL FACTORS to be considered are temperature, humidity, shock, vibration, andrf interference.1-52
ELECTRICAL FACTORS are overcome by using shielding and ground planes and by carefulplacement of components.1-53
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
Page 74 and 75: One such improvement in system test
Page 76 and 77: those that should be observed when
Page 78 and 79: Figure 2-2.—Low voltage Handpiece
Page 80 and 81: Figure 2-6.—Rotary-drive machine
Page 82 and 83: Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85: Figure 2-10a.—Pliers.TweezersView
Page 86 and 87: Even though all the items are not u
Page 88 and 89: Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91: other than eutectic, go through a p
Page 92 and 93: A1. Chief of Naval Operations (CNO)
Page 94 and 95: CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97: The coating material can best be id
Page 98 and 99: Figure 3-3.—Rotary tool conformal
Page 100 and 101: Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107: Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117:
Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
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Figure 3-23.—Pcb conductor damage
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REPAIRING DELAMINATED CONDUCTORS.
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5. The repair is completed using th
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SAFETYSafety is a subject of utmost
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OBJECT OR PROCESSWORK SURFACESFLOOR
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8. When moving an ESDS device or as
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Power ToolsHazards associated with
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dispensers will prevent many accide
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A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
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APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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___________________________________
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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