Navy Electricity and Electronics Training Series - Historic Naval ...

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1-65. Which of the following types of testequipment is classified as off-lineautomatic test equipment?1. Centralized Automatic Test System(CATS)2. Versatile Avionic Shop Test System(VAST)3. General Purpose Electronic TestEquipment (GPETE)4. Test Evaluation and MonitoringSystem (TEAMS)1-66. Fault diagnosis using GPETE shouldonly be attempted by which of thefollowing personnel?1. Officers2. Technician strikers3. Experienced technicians4. Basic Electricity and Electronicsschool graduates1-67. During fault isolation procedures, adevice or component should bedesoldered and removed from the circuitonly at which of the following times?1. After defect verification2. For out-of-circuit testing3. During static resistance checks4. At any time the technician desires1-68. 2M repair stations are equippedaccording to the types of repairs to beaccomplished. The use of microscopesand precisions drill presses would berequired in which of the following typesof repair?1. Miniature2. Microminiature3. Both 1 and 2 above4. Emergency1-69. In the selection of a soldering iron tip,which of the following factors should beconsidered?1. The complexity of the pcb2. The composition of the pcb3. The area and mass being soldered4. The type of component beingsoldered1-70. The handpiece that can be used for thegreatest variety of operations is the1. solder extractor2. rotary-drive tool3. resistive tweezers4. lapflow and thermal scraperhandtool1-71. Regardless of location, 2M repairstations require adequate work surfacearea, lighting, power, and what otherminimum requirement?1. Heat source2. Ventilation3. Illumination4. Dust-free space1-72. Solder used in electronics is an alloycomposed of which of the followingmetals?1. Tin and zinc2. Tin and lead3. Lead and zinc4. Lead and copper1-73. A roll of solder is marked 60/40. Whatdo these numbers indicate?1. 60% tin, 40% lead2. 60% tin, 40% copper3. 60% lead, 40% tin4. 60% lead, 40% copper10
1-74. Which of the following alloys will meltdirectly into a liquid and have no plasticor semiliquid state?1. Metallic alloy2. Eutectic alloy3. Zinc-lead alloy4. Copper-zinc alloy1-75. The PREFERRED solder alloy ratio forelectronic repair is 63/37. Which of thefollowing alloy ratios is alsoACCEPTABLE for this type of repair?1. 30/702. 50/503. 60/404. 70/3011
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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