Navy Electricity and Electronics Training Series - Historic Naval ...

More documents

Recommendations

Info

INTRODUCTIONIn NEETS, Module 6, Introduction to Electronic Emission, Tubes, and Power Supplies, you learnedthat Thomas Edison's discovery of thermionic emission opened the door to electronic technology.Progress was slow in the beginning, but each year brought new and more amazing discoveries. Thedevelopment of vacuum tubes soon led to the simple radio. Then came more complex systems ofcommunications. Modern systems now allow us to communicate with other parts of the world viasatellite. Data is now collected from space by probes without the presence of man because ofmicroelectronic technology.Sophisticated control systems allow us to operate equipment by remote control in hazardoussituations, such as the handling of radioactive materials. We can remotely pilot aircraft from takeoff tolanding. We can make course corrections to spacecraft millions of miles from Earth. Space flight,computers, and even video games would not be possible except for the advances made inmicroelectronics.The most significant step in modern electronics was the development of the transistor by BellLaboratories in 1948. This development was to solid-state electronics what the Edison Effect was to thevacuum tube. The solid-state diode and the transistor opened the door to microelectronics.MICROELECTRONICS is defined as that area of technology associated with and applied to therealization of electronic systems made of extremely small electronic parts or elements. As discussed intopic 2 of NEETS, Module 7, Introduction to Solid-State Devices and Power Supplies, the termmicroelectronics is normally associated with integrated circuits (IC). Microelectronics is often thought toinclude only integrated circuits. However, many other types of circuits also fall into the microelectronicscategory. These will be discussed in greater detail under solid-state devices later in this topic.During World War II, the need to reduce the size, weight, and power of military electronic systemsbecame important because of the increased use of these systems. As systems became more complex, theirsize, weight, and power requirements rapidly increased. The increases finally reached a point that wasunacceptable, especially in aircraft and for infantry personnel who carried equipment in combat. Theseunacceptable factors were the driving force in the development of smaller, lighter, and more efficientelectronic circuit components. Such requirements continue to be important factors in the development ofnew systems, both for military and commercial markets. Military electronic systems, for example,continue to become more highly developed as their capability, reliability, and maintainability is increased.Progress in the development of military systems and steady advances in technology point to an everincreasingneed for increased technical knowledge of microelectronics in your Navy job.Q1. What problems were evident about military electronic systems during World War II?Q2. What discovery opened the door to solid-state electronics?Q3. What is microelectronics?EVOLUTION OF MICROELECTRONICSThe earliest electronic circuits were fairly simple. They were composed of a few tubes, transformers,resistors, capacitors, and wiring. As more was learned by designers, they began to increase both the sizeand complexity of circuits. Component limitations were soon identified as this technology developed.1-2
VACUUM-TUBE EQUIPMENTVacuum tubes were found to have several built-in problems. Although the tubes were lightweight,associated components and chassis were quite heavy. It was not uncommon for such chassis to weigh 40to 50 pounds. In addition, the tubes generated a lot of heat, required a warm-up time from 1 to 2 minutes,and required hefty power supply voltages of 300 volts dc and more.No two tubes of the same type were exactly alike in output characteristics. Therefore, designers wererequired to produce circuits that could work with any tube of a particular type. This meant that additionalcomponents were often required to tune the circuit to the output characteristics required for the tube used.Figure 1-1 shows a typical vacuum-tube chassis. The actual size of the transformer is approximately4 × 4 × 3 inches. Capacitors are approximately 1 × 3 inches. The components in the figure are very largewhen compared to modern microelectronics.Figure 1-1.—Typical vacuum tube circuit.A circuit could be designed either as a complete system or as a functional part of a larger system. Incomplex systems, such as radar, many separate circuits were needed to accomplish the desired tasks.Multiple-function tubes, such as dual diodes, dual triodes, tetrodes, and others helped considerably toreduce the size of circuits. However, weight, heat, and power consumption continued to be problems thatplagued designers.Another major problem with vacuum-tube circuits was the method of wiring components referred toas POINT-TO-POINT WIRING. Figure 1-2 is an excellent example of point-to-point wiring. Not onlydid this wiring look like a rat's nest, but it often caused unwanted interactions between components. Forexample, it was not at all unusual to have inductive or capacitive effects between wires. Also, point-topointwiring posed a safety hazard when troubleshooting was performed on energized circuits because ofexposed wiring and test points. Point-to-point wiring was usually repaired with general purpose testequipment and common hand tools.1-3
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15: CHAPTER 1MICROELECTRONICSLEARNING O
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67:
Three methods of interconnecting ci
Page 68 and 69:
ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71:
A43. Conventional printed circuit b
Page 72 and 73:
Upon satisfactory completion of a 2
Page 74 and 75:
One such improvement in system test
Page 76 and 77:
those that should be observed when
Page 78 and 79:
Figure 2-2.—Low voltage Handpiece
Page 80 and 81:
Figure 2-6.—Rotary-drive machine
Page 82 and 83:
Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85:
Figure 2-10a.—Pliers.TweezersView
Page 86 and 87:
Even though all the items are not u
Page 88 and 89:
Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91:
other than eutectic, go through a p
Page 92 and 93:
A1. Chief of Naval Operations (CNO)
Page 94 and 95:
CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97:
The coating material can best be id
Page 98 and 99:
Figure 3-3.—Rotary tool conformal
Page 100 and 101:
Figure 3-4A.—Eyelets (interfacial
Page 102 and 103:
Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105:
Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107:
Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109:
Figure 3-10.—Solder wicking.This
Page 110 and 111:
Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113:
INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115:
Figure 3-15.—Component arrangemen
Page 116 and 117:
Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119:
Removal of Plug-In DIPsTo remove pl
Page 120 and 121:
Figure 3-19.—TO mounting techniqu
Page 122 and 123:
Figure 3-21.—Flat pack in protect
Page 124 and 125:
Figure 3-23.—Pcb conductor damage
Page 126 and 127:
REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129:
5. The repair is completed using th
Page 130 and 131:
SAFETYSafety is a subject of utmost
Page 132 and 133:
OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135:
8. When moving an ESDS device or as
Page 136 and 137:
Power ToolsHazards associated with
Page 138 and 139:
dispensers will prevent many accide
Page 140 and 141:
A GOOD SOLDER JOINT is bright and s
Page 142 and 143:
ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146:
APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148:
MODULAR PACKAGING—Circuit assembl
Page 149:
APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153:
Microelectronics—Continuedpackagi
Page 155:
Assignment QuestionsInformation: Th
Page 158 and 159:
1-7. Which of the following charact
Page 160 and 161:
1-24. Vacuum evaporation and cathod
Page 162 and 163:
___________________________________
Page 164 and 165:
1-49. Ground planes and shielding a
Page 166 and 167:
1-65. Which of the following types
Page 168 and 169:
ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171:
2-20. Turret, fork, and hook termin
Page 172 and 173:
2-39. Component leads may be clippe
Page 174 and 175:
2-52. To ensure a good mechanical b
show all

Navy Electricity and Electronics Training Series - Historic Naval ...

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?