Navy Electricity and Electronics Training Series - Historic Naval ...

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2-39. Component leads may be clipped to aid intheir removal under which of the followingconditions?Figure 2B. ⎯Solder joints.IN ANSWERING QUESTION 2-36, REFER TOFIGURE 2B.2-36. All the solder joints in the figure have twothings in common. The first is that all arethrough-the-board terminations. Theother is that they are all what type of joint?1. Sweat2. Full-fillet3. Unacceptable4. Clinched-lead2-37. Plug-in DIPs are mounted by using whichof the following aids/parts?1. Insulators2. Special tools3. Clinched leads4. Mounting sockets2-38. Plug-in DIPs are susceptible to looseningbecause of which of the following causes?1. Heat2. Stress3. Warpage4. Vibration1. When the component is conformallycoated2. When the component is known to bedefective3. When board damage may result fromnormal removal methods4. Both 2 and 3 above2-40. Visual inspection of a completed repair isconducted to evaluate which of thefollowing aspects of the repair?1. Workmanship quality2. Component placement3. In-circuit quality test4. Conformal coating integrity2-41. When speaking of TO mountingtechniques, the term "plug-in" refers to thesame technique as is used with DIPs.1. True2. False2-42. In addition to heat dissipation and physicalsupport, which of the following needsmight justify the use of a spacer with a TOmount?1. Vibration elimination2. Proper lead formation3. Proper lead termination4. Short-circuit protection2-43. For the removal of imbedded TOs inwhich all the leads are free, which of thefollowing methods is recommended?1. Push out gently2. Pull out with pliers3. Pull out with fingers4. Tap out with soft mallet16
2-44. What is the most critical step in replacingan imbedded TO?2-48. Which of the examples shows the correctlead formation for a flat pack?1. Seating the leads2. Forming the leads3. Soldering the leads4. Seating the body of the TO2-45. When a TO or a DIP is replaced on aprinted circuit board, what type oftermination is normally used?1. Lap flow2. On-the-board3. Above-the-board4. Through-the-board2-46. What type of termination is used in thereplacement of a flat pack?1. Lap flow2. Solder cup3. Solder plug4. Full fillet2-47. Heating the leads and lifting them freewith tweezers is the preferred method ofremoving which of the followingcomponents?1. TOs2. DIPs3. Flat packs4. Transistors2-49. Use of a skipping pattern when solderingmultilead components prevents1. cold solder joints2. excessive heat buildup3. the component from moving4. the need to visually inspect the piece2-50. Cards and boards may be damaged underwhich of the following conditions?1. When unauthorized repairs areattempted by untrained personnel2. When technicians use improper tools3. When improperly stored4. Each of the above2-51. DS3 Spark is preparing to repair a crackedconductor on a card. For this type ofdamage, which of the following repairmethods is preferred?1. Solder bridge2. Clinched staple3. Install an eyelet at the crack and solderin place4. Lap-flow soldered wire across thebreak17
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 174 and 175: 2-52. To ensure a good mechanical b
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