Navy Electricity and Electronics Training Series - Historic Naval ...

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2-52. To ensure a good mechanical bondbetween the board and replacement padand to provide good electrical contact forcomponents, which of the followingprocedures is used?1. Epoxying the pad to the run2. Electroplating the repair area3. Installing an eyelet in the pad4. Lap-flow soldering the repair area2-57. Electrostatic discharge (ESD) has thegreatest effect on which of the followingdevices?1. Silicon diodes2. Selenium rectifiers3. Germanium transistors4. Metal-oxide transistor2-53. Breaks, holes, and cracks in pcbs arerepaired by using a mixture of1. fiberglass and rosin2. epoxy and powdered carbon3. conformal coating and RTV4. epoxy and powdered fiberglass2-54. What is the first step in the repair ofburned or scorched boards?1. Filling the burned area with epoxy andfiberglass2. Removing all discolored material3. Removing all delaminated conductors4. Cleaning all surfaces with solvent2-55. Which of the following statements iscorrect concerning the repair of repairabledelaminated conductors?1. All delaminations are removed2. Repairable delaminations are notremoved3. All delaminations are epoxied to theboard4. All delaminations are replaced withinsulated wire2-56. Damage to some electronic componentscan occur at what minimum electrostaticpotential?1. 14 volts2. 35 volts3. 350 volts4. 3,500 voltsFigure 2C. ⎯Symbol.IN ANSWERING QUESTION 2-58, REFER TOFIGURE 2C.2-58. The symbol shown in the figure is foundon a component package. What does itindicate about the component?1. It is a high cost item2. It is a bipolar device3. It is an integrated circuit4. It is electrostatic discharge sensitive2-59. Electrostatic charges may develop as highas which of the following voltages?1. 3,000 volts2. 15,000 volts3. 20,000 volts4. 35,000 volts18
2-60. To prevent an electrostatic charge built upon the body of the technician fromdamaging ESDS devices, the technicianshould take which of the followingprecautions?1. Be grounded2. Wear gloves3. Ground the device4. Handle the device with insulated tools2-61. The best source of information concerningthe application, handling, and storage ofany aerosol dispensers may be found in/onwhich of the following sources?1. NAVSEA 2M manual2. NEETS, Module 14, Topic 33. On the aerosol dispenser4. Applicable military standards19
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
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