Navy Electricity and Electronics Training Series - Historic Naval ...

More documents

Recommendations

Info

Module 11, Microwave Principles, explains microwave oscillators, amplifiers, and waveguides.Module 12, Modulation Principles, discusses the principles of modulation.Module 13, Introduction to Number Systems and Logic Circuits, presents the fundamental concepts ofnumber systems, Boolean algebra, and logic circuits, all of which pertain to digital computers.Module 14, Introduction to Microelectronics, covers microelectronics technology and miniature andmicrominiature circuit repair.Module 15, Principles of Synchros, Servos, and Gyros, provides the basic principles, operations,functions, and applications of synchro, servo, and gyro mechanisms.Module 16, Introduction to Test Equipment, is an introduction to some of the more commonly used testequipments and their applications.Module 17, Radio-Frequency Communications Principles, presents the fundamentals of a radiofrequencycommunications system.Module 18, Radar Principles, covers the fundamentals of a radar system.Module 19, The Technician's Handbook, is a handy reference of commonly used general information,such as electrical and electronic formulas, color coding, and naval supply system data.Module 20, Master Glossary, is the glossary of terms for the series.Module 21, Test Methods and Practices, describes basic test methods and practices.Module 22, Introduction to Digital Computers, is an introduction to digital computers.Module 23, Magnetic Recording, is an introduction to the use and maintenance of magnetic recorders andthe concepts of recording on magnetic tape and disks.Module 24, Introduction to Fiber Optics, is an introduction to fiber optics.Embedded questions are inserted throughout each module, except for modules 19 and 20, which arereference books. If you have any difficulty in answering any of the questions, restudy the applicablesection.Although an attempt has been made to use simple language, various technical words and phrases havenecessarily been included. Specific terms are defined in Module 20, Master Glossary.Considerable emphasis has been placed on illustrations to provide a maximum amount of information. Insome instances, a knowledge of basic algebra may be required.Assignments are provided for each module, with the exceptions of Module 19, The Technician'sHandbook; and Module 20, Master Glossary. Course descriptions and ordering information are inNAVEDTRA 12061, Catalog of Nonresident Training Courses.vi
Throughout the text of this course and while using technical manuals associated with the equipment youwill be working on, you will find the below notations at the end of some paragraphs. The notations areused to emphasize that safety hazards exist and care must be taken or observed.WARNINGAN OPERATING PROCEDURE, PRACTICE, OR CONDITION, ETC., WHICH MAYRESULT IN INJURY OR DEATH IF NOT CAREFULLY OBSERVED ORFOLLOWED.CAUTIONAN OPERATING PROCEDURE, PRACTICE, OR CONDITION, ETC., WHICH MAYRESULT IN DAMAGE TO EQUIPMENT IF NOT CAREFULLY OBSERVED ORFOLLOWED.NOTEAn operating procedure, practice, or condition, etc., which is essential to emphasize.vii
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23 and 24: Development of a microelectronic de
Page 25 and 26: Figure 1-9.—Crystal furnace.The c
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59:
SUMMARYThis topic has presented inf
Page 60 and 61:
Rapid development has resulted in i
Page 62 and 63:
Large DIPs are being used to packag
Page 64 and 65:
MINIATURE ELECTRONICS are card asse
Page 66 and 67:
Three methods of interconnecting ci
Page 68 and 69:
ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71:
A43. Conventional printed circuit b
Page 72 and 73:
Upon satisfactory completion of a 2
Page 74 and 75:
One such improvement in system test
Page 76 and 77:
those that should be observed when
Page 78 and 79:
Figure 2-2.—Low voltage Handpiece
Page 80 and 81:
Figure 2-6.—Rotary-drive machine
Page 82 and 83:
Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85:
Figure 2-10a.—Pliers.TweezersView
Page 86 and 87:
Even though all the items are not u
Page 88 and 89:
Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91:
other than eutectic, go through a p
Page 92 and 93:
A1. Chief of Naval Operations (CNO)
Page 94 and 95:
CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97:
The coating material can best be id
Page 98 and 99:
Figure 3-3.—Rotary tool conformal
Page 100 and 101:
Figure 3-4A.—Eyelets (interfacial
Page 102 and 103:
Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105:
Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107:
Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109:
Figure 3-10.—Solder wicking.This
Page 110 and 111:
Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113:
INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115:
Figure 3-15.—Component arrangemen
Page 116 and 117:
Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119:
Removal of Plug-In DIPsTo remove pl
Page 120 and 121:
Figure 3-19.—TO mounting techniqu
Page 122 and 123:
Figure 3-21.—Flat pack in protect
Page 124 and 125:
Figure 3-23.—Pcb conductor damage
Page 126 and 127:
REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129:
5. The repair is completed using th
Page 130 and 131:
SAFETYSafety is a subject of utmost
Page 132 and 133:
OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135:
8. When moving an ESDS device or as
Page 136 and 137:
Power ToolsHazards associated with
Page 138 and 139:
dispensers will prevent many accide
Page 140 and 141:
A GOOD SOLDER JOINT is bright and s
Page 142 and 143:
ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146:
APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148:
MODULAR PACKAGING—Circuit assembl
Page 149:
APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153:
Microelectronics—Continuedpackagi
Page 155:
Assignment QuestionsInformation: Th
Page 158 and 159:
1-7. Which of the following charact
Page 160 and 161:
1-24. Vacuum evaporation and cathod
Page 162 and 163:
___________________________________
Page 164 and 165:
1-49. Ground planes and shielding a
Page 166 and 167:
1-65. Which of the following types
Page 168 and 169:
ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171:
2-20. Turret, fork, and hook termin
Page 172 and 173:
2-39. Component leads may be clippe
Page 174 and 175:
2-52. To ensure a good mechanical b
show all

Navy Electricity and Electronics Training Series - Historic Naval ...

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?