Navy Electricity and Electronics Training Series - Historic Naval ...

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1-49. Ground planes and shielding are used toprevent which of the following electricalinteractions?1. Cross talk2. External interference3. The generation of rf within thesystem4. All of the above1-50. Training requirements for miniature andmicrominiature (2M) repair personnelwas established by which of thefollowing authorities?1. Chief of Naval Education andTraining2. Chief of Naval Technical Training3. Chief of Naval Operations4. Commander, Naval Sea SystemsCommand1-51. The standards of workmanship andguidelines for specific repairs toequipment are contained in which of thefollowing Navy publications?1. Introduction to Microelectronics2. NAVSHIPS Technical Manual3. Electronics Installation andMaintenance Books (EIMB)4. Miniature/Microminiature (2M)Electronic Repair Program1-52. A technician is authorized to perform2M repairs upon satisfactory completionof which of the following types oftraining?1. A 2M training class2. On-the-job training3. NEETS, Module 144. Any electronics class "A" school1-53. Repairs that are limited to discretecomponents and single- and doublesidedboards are classified as what levelof repairs?1. Intermediate2. Organizational3. Miniature component4. Microminiature component1-54. To ensure that a 2M technicianmaintains the minimum standards ofworkmanship, the Navy requires that thetechnician meet which of the followingrequirements?1. Be licensed2. Be certified3. Be experienced4. Be retrained1-55. If a technician should fail to maintainthe required standards of workmanship,the technician's certification is subject towhat action?1. Cancellation2. Recertification3. Reduction to next lower level4. Withholding pending requalification1-56. The most extensive shop facilities andhighly skilled technicians are located atwhat SM & R level of maintenance?1. Depot2. Operational3. Intermediate4. Organizational8
1-57. SM & R code D maintenance facilitiesare usually located at which of thefollowing activities?1. Shipyards2. Contractor maintenanceorganizations3. Shore-based facilities4. All of the above1-58. Direct support to user organizations isprovided by which of the following SM& R code maintenance levels?1. Depot2. Operational3. Intermediate4. Organizational1-59. Inspecting, servicing, and adjustingequipment is the function of which ofthe following SM & R codemaintenance levels?1. Depot2. Operational3. Intermediate4. Organizational1-60. The maintenance level at which normal2M repairs are performed is set forth inthe maintenance plan and specified bythe1. NAVSEA 2M Repair Program2. Source, Maintenance, andRecoverability (SM & R) code3. Chief of Naval Operations4. Equipment manufacturers'documentation1-61. Boards or modules that are SM & Rcode D may be repaired at theorganizational level under which of thefollowing conditions?1. On a routine basis2. When parts are available3. To meet an urgent operationalcommitment4. When code D repair will take sixweeks or longer1-62. Source, Maintenance, and Recovery(SM & R) codes that list where repairparts may be obtained, who isauthorized to make the repair, and themaintenance level for the item are foundin which of the following documents?1. Allowance Equipage Lists (AEL)2. Allowance Parts Lists (APL)3. Manufacturer's Parts List4. Navy Stock System1-63. Test equipment that continuouslymonitors performance and automaticallyisolates faults to removable assembliesis what category of equipment?1. On-line2. Off-line3. General purpose4. Fault isolating1-64. A dc voltmeter that is permanentlyattached to a power supply for thepurpose of monitoring the output is anexample of what type test equipment?1. General Purpose Electronic TestEquipment (GPETE)2. Built in Test Equipment (BITE)3. Off-line test equipment4. Specialized test equipment9
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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