Navy Electricity and Electronics Training Series - Historic Naval ...

More documents

Recommendations

Info

ASSIGNMENT 2Textbook assignment: Chapter 3, “Miniature and Microminiature Repair Procedures,” pages 3-1 through3-51._________________________________________________________________________________________2-1. Which of the following requirements mustbe met by a 2M technician to be authorizedto perform repairs at a particular level?1. Have knowledge of that level2. Be certified at that level3. Be experienced at that level4. Be licensed at the next higher level2-2. Protective materials applied to electronicassemblies to prevent damage caused bycorrosion, moisture, and stress are called1. conformal coatings2. isolation materials3. electrical insulation4. encapsulation coatings2-3. Before working on a pcb, the conformalcoating should be removed from what partof the board?1. The entire board2. The component side3. The area of the repair4. The side opposite the component side2-4. What are the approved methods ofconformal coating removal?1. Peeling and abrading2. Stripping and heating3. Mechanical and thermal only4. Mechanical, thermal, and chemical2-6. What is the preferred method of removingepoxy conformal coatings?1. Solvent2. Ball mill3. Hot-air jet4. Thermal parting tool2-7. A conformal coating is considered to bethin if it is less than what thickness?1. 0.025 inches2. 0.040 inches3. 0.050 inches4. 0.250 inches2-8. Of the various mechanical methods ofconformal coating removal, physicalcontact with the work piece is NOTrequired using which of the followingmethods?1. Cutting2. Grinding3. Hot-air jet4. Thermal parting2-9. Cutting and peeling is an easy method ofremoving which of the following types ofcoatings?1. Epox2. Varnish3. Parylene4. Silicone2-5. Most methods of conformal coatingremoval are variations of which of thefollowing types of removal?1. Thermal2. Chemical3. Mechanical4. Electrical12
2-10. Thin acrylic coatings are readily removedin which of the following ways?1. Routing2. Hot-air jet3. Cut and peel4. Mild solvents2-11. When applying an application ofconformal coating, which of the followingconditions is true?1. The board should be clean and moist2. The coating should be applied only tothe component replaced3. The coating should be the same type asthat used by the manufacturer4. The coating should be applied only tothe solder joints2-12. The procedure of connecting circuitry onone side of a board with the circuitry onthe other side is known as1. mounting2. termination3. hole reinforcement4. interfacial connections2-13. Reinforcement for circuit pads on bothsides of the board is provided by which ofthe following types of eyelets?1. Flat-set2. Roll-set3. Funnel-set2-14. The manner in which wires and leads areattached to an assembly is described bywhich of the following terms?1. Termination2. Solder joints3. Lead formation4. Interfacial connections2-15. Clinched leads, straight-through leads, andoffset pads are variations of what type oftermination?1. Solder cup2. On-the-board3. Above-the-board4. Through-hole2-16. What total number of degrees of bend are(a) fully clinched leads and (b)semiclinched leads?1. (a) 45 (b) 902. (a) 45 (b) 453. (a) 90 (b) 454. (a) 90 (b) 902-17. Which of the following types of terminalsare used as tie points for interconnectingwiring?1. Pins2. Hooks3. Solder cups4. Turrets2-18. During assembly, component stability isprovided by which of the following typesof lead termination?1. Hook terminal2. Clinched lead3. Turret terminal4. On-the-board (lap-flow)2-19. Which of the following types of leadterminations is the easiest to remove andrework?1. Offset-pad2. Semiclinched3. Fully clinched4. Straight-through13
Page 1 and 2:
NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4:
PREFACEBy enrolling in this self-st
Page 5:
TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9:
Module 11, Microwave Principles, ex
Page 10 and 11:
INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13:
THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16:
CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18:
VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20:
SOLID-STATE DEVICESNow would be a g
Page 21 and 22:
FILM INTEGRATED CIRCUITS are broken
Page 23 and 24:
Development of a microelectronic de
Page 25 and 26:
Figure 1-9.—Crystal furnace.The c
Page 27 and 28:
Figure 1-12.—Planar-diffused tran
Page 29 and 30:
Figure 1-14.—Vacuum evaporation o
Page 31 and 32:
Figure 1-17.—Cathode-sputtering m
Page 33 and 34:
Q23. How do the two types of monoli
Page 35 and 36:
Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38:
Dual Inline PackageThe dual inline
Page 39 and 40:
wafer, as shown in figure 1-27. Thi
Page 41 and 42:
Figure 1-29.—J-K flip-flop discre
Page 43 and 44:
Figure 1-31.—Lead numbering for a
Page 45 and 46:
Figure 1-34.—Manufacturer's Data
Page 47:
comparison to the distance between
Page 50 and 51:
LEVEL III.—Drawers or pull-out ch
Page 52 and 53:
Conductors located several layers b
Page 54 and 55:
Figure 1-43A.—Evolution of modula
Page 56 and 57:
ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59:
SUMMARYThis topic has presented inf
Page 60 and 61:
Rapid development has resulted in i
Page 62 and 63:
Large DIPs are being used to packag
Page 64 and 65:
MINIATURE ELECTRONICS are card asse
Page 66 and 67:
Three methods of interconnecting ci
Page 68 and 69:
ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71:
A43. Conventional printed circuit b
Page 72 and 73:
Upon satisfactory completion of a 2
Page 74 and 75:
One such improvement in system test
Page 76 and 77:
those that should be observed when
Page 78 and 79:
Figure 2-2.—Low voltage Handpiece
Page 80 and 81:
Figure 2-6.—Rotary-drive machine
Page 82 and 83:
Figure 2-9.—Pana Vise.HAND TOOLSF
Page 84 and 85:
Figure 2-10a.—Pliers.TweezersView
Page 86 and 87:
Even though all the items are not u
Page 88 and 89:
Figure 2-14.—Stereoscopic zoom mi
Page 90 and 91:
other than eutectic, go through a p
Page 92 and 93:
A1. Chief of Naval Operations (CNO)
Page 94 and 95:
CAUTIONTHIS SECTION IS NOT, IN ANY
Page 96 and 97:
The coating material can best be id
Page 98 and 99:
Figure 3-3.—Rotary tool conformal
Page 100 and 101:
Figure 3-4A.—Eyelets (interfacial
Page 102 and 103:
Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105:
Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107:
Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109:
Figure 3-10.—Solder wicking.This
Page 110 and 111:
Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113:
INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115:
Figure 3-15.—Component arrangemen
Page 116 and 117:
Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
show all

Navy Electricity and Electronics Training Series - Historic Naval ...

Create successful ePaper yourself

Delete template?

Save as template?