Navy Electricity and Electronics Training Series - Historic Naval ...

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Microelectronics—Continuedpackaging techniques, 1-19 to 1-25recent developments in packaging,1-23 to 1-25substrate production, 1-10, 1-12introduction, 1-2microelectronic system design concepts,1-31 to 1-40electrical considerations, 1-41 to 1-42environmental considerations, 1-41interconnection in printed circuitboards, 1-35 to 1-38modular assemblies, 1-38 to 1-40system packaging, 1-32 to 1-35terminology, 1-31, 1-32summary, 1-43 to 1-54Miniature and microminiature repairprocedures, 3-1 to 3-50introduction, 3-1miniature and microminiature electronicrepair procedures, 3-1 to 3-37conformal coatings, 3-2 to 3-7installation and soldering of printedcircuit components, 3-20 to 3-25planar-mounted components (flatpacks),3-29removal and replacement of DIPs,3-25 to 3-27removal and replacement of discretecomponents, 3-7 to 3-19removal and replacement of flat packs,3-29 to 3-31removal and replacement of TOpackages, 3-27 to 3-29repair of printed circuit boards andcards, 3-31 to 3-37safety, 3-38 to 3-46electrostatic discharge, 3-38 to 3-43personal safety, 3-43 to 3-46summary, 3-46 to 3-50Miniature/Microminiature (2M) RepairProgram and high-reliability soldering, 2-1to 2-22high-reliability soldering, 2-19 to 2-20use of flux in solder bonding, 2-20introduction, 2-1Miniature/Microminiature (2M) Repairlevels of maintenance, 2-2 to 2-3depot-level maintenance, 2-2intermediate-level maintenance, 2-2organizational-level maintenance, 2-3Miniature and Microminiature (2M) ElectronicRepair Program, 2-1 to 2-2repair station facilities, 2-18 to 2-19electrostatic discharge sensitive device(ESDS) capability, 2-19lighting, 2-18noise considerations, 2-19power requirements, 2-19ventilation, 2-18 to 2-19work surface area, 2-19repair stations, 2-6 to 2-19circuit card holder and magnifier, 2-10to 2-11hand pieces, 2-7 to 2-8hand-tools, 2-12 to 2-15high-intensity light, 2-11miscellaneous tools and supplies, 2-15to 2-16Pana Vise, 2-11 to 2-12repair station power unit, 2-6 to 2-10replacement parts, 2-18rotary-drive machine, 2-9 to 2-10safety equipment, 2-16 to 2-17stereoscopic-zoom microscope, 2-17to 2-18tool chest, 2-18source, maintenance, and recoverabilty(SM&R) codes, 2-3summary, 2-21 to 2-22test equipment, 2-3 to 2-6built-in test equipment (BITE), 2-4general-purpose electronic testequipment (GPETE), 2-5 to 2-6off-line test equipment, 2-5on-line test equipment, 2-4 to 2-5Miscellaneous tools and supplies, 2-15 to 2-16Modular assemblies, 1-38 to 1-40NNoise considerations, 2-19INDEX-2
OOff-line test equipment, 2-5On-line test equipment, 2-4 to 2-5Organizational-level maintenance, 2-3PPackage lead identification (numbering), IC,1-27 to 1-28Packaging techniques, 1-19 to 1-25Pana Vise, 2-11 to 2-12Personal safety, 3-43 to 3-46Planar-mounted components (flat-packs), 3-29Power requirements, 2-19Power unit, repair station, 2-6 to 2-10Printed circuit boards and cards, repair of, 3-31to 3-37Printed circuit components, installation andsoldering of, 3-20 to 3-25RRecent developments in packaging, 1-23 to1-25Reference list, AII-1Repair station facilities, 2-18 to 2-19Repair stations, 2-6 to 2-19Replacement parts, 2-18Rotary-drive machine, 2-9 to 2-10SSafety, 3-38 to 3-46Safety equipment, 2-16 to 2-17Shielding and ground planes, 1-41 to 1-42Solder, 2-19 to 2-20Solid-state devices, 1-5 to 1-8Source, maintenance, and recoverability(SM&R) codes, 2-3State-of-the-art microelectronics, 1-7, 1-8Stereoscopic-zoom microscope, 2-17 to 2-18Substrate production, 1-10, 1-12System design concepts, microelectronic, 1-31to 1-40System packaging, 1-32 to 1-35TTerminology, 1-31, 1-32Test equipment, 2-3 to 2-6TO packages, removal and replacement of,3-27 to 3-29Tool chest, 2-18Training and certification, 2-1 to 2-22-M electronic repair program, (miniature andmicrominiature), 2-1 to 2-2VVacuum-tube equipment, 1-2 to 1-4Ventilation, 2-18 to 2-19WWork surface area, 2-19INDEX-3
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
Page 102 and 103: Figure 3-5B.—Clinched leads. SEMI
Page 104 and 105: Figure 3-8A.—Terminals. PIN AND T
Page 106 and 107: Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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