Navy Electricity and Electronics Training Series - Historic Naval ...

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______________________________________IN ANSWERING QUESTIONS 1-35THROUGH 1-37, MATCH THE LETTER INEACH OF THE FIGURES THAT IDENTIFIESPIN 1.______________________________________1-37.1-35.1. J2. K3. L4. M1-38. Letters and numbers stamped on thebody of an IC serve to provide which ofthe following types of information?1. A2. B3. C4. D1. Use2. Serial number3. Date of manufacture4. Applicable equipment1-36.1-39. Descriptive information about aparticular type of IC may be found inwhich of the following documents?1. E2. F3. G4. H1. The manufacturer's data sheet2. The equipment Allowance Part List(APL)3. The National Stock Number (NSN)4. The IC identification number list1-40. Assemblies made up EXCLUSIVELYof discrete electronic parts are classifiedas1. vacuum-tube circuits2. microcircuit modules3. hybrid microcircuits4. miniature electronics circuits6
1-41. An assembly of microcircuits or acombination of microcircuits anddiscrete components is referred to as a1. mother board2. microprocessor3. miniature module4. microcircuit module1-42. A technician has isolated a problem to aplug-in module on a printed circuitboard. What is this level of systempackaging?1. Level O2. Level I3. Level II4. Level III1-43. A faulty transistor would be identifiedas what level of packaging?1. Level O2. Level I3. Level II4. Level III1-44. A chassis located in a radar antennapedestal would be identified as whatlevel of system packaging?1. Level I2. Level II3. Level III4. Level IV1-45. Which of the following characteristics isNOT an advantage of multilayer printedcircuit boards?1. Allows greater wiring density onboards2. Provides shielding for a largenumber of conductors3. Eliminates complicated wiringharnesses4. Reduces the number of componentsper board1-46. Which of the following circuitconnection methods is NOT used inmaking interconnections on a multilayerprinted circuit board interconnection?1. Terminal lug2. Clearance hole3. Layer build-up4. Plated-through hole1-47. The most complex to produce anddifficult to repair printed circuit boardsare those made using which of thefollowing methods?1. Layer-buildup2. Clearance-hole3. Step-down-hole4. Plated-through-hole1-48. Environmental performancerequirements for ICs are set forth inwhich of the following publications?1. 2M repair manual2. Military Standards3. System maintenance manuals4. Manufacturer's data sheet7
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 158 and 159: 1-7. Which of the following charact
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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