Navy Electricity and Electronics Training Series - Historic Naval ...

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Figure 1-8.—Wafer mask distribution.A wafer mask is a device used to deposit materials on a substrate. It allows material to be depositedin certain areas, but not in others. By changing the pattern of the mask, we can change the componentarrangement of the circuit. Several different masks may be used to produce a simple microelectronicdevice. When used in proper sequence, conductor, semiconductor, or insulator materials may be appliedto the substrate to form transistors, resistors, capacitors, and interconnecting leads.SUBSTRATE PRODUCTIONAs was mentioned earlier in this topic, microelectronic devices are produced on a substrate. Thissubstrate will be of either insulator or semiconductor material, depending on the type of device. Film andhybrid ICs are normally constructed on a glass or ceramic substrate. Ceramic is usually the preferredmaterial because of its durability.Substrates used in monolithic ICs are of semiconductor material, usually silicon. In this type of IC,the substrate can be an active part of the IC. Glass or ceramic substrates are used only to provide supportfor the components.Semiconductor substrates are produced by ARTIFICIALLY GROWING cylindrical CRYSTALS ofpure silicon or germanium. Crystals are "grown" on a SEED CRYSTAL from molten material by slowlylifting and cooling the material repeatedly. This process takes place under rigidly controlled atmosphericand temperature conditions.Figure 1-9 shows a typical CRYSTAL FURNACE. The seed crystal is lowered until it comes incontact with the molten material-silicon in this case. It is then rotated and raised very slowly. The seedcrystal is at a lower temperature than the molten material. When the molten material is in contact with theseed, it solidifies around the seed as the seed is lifted. This process continues until the grown crystal is ofthe desired length. A typical crystal is about 2 inches in diameter and 10 to 12 inches long. Largerdiameter crystals can be grown to meet the needs of the industry. The purity of the material is strictlycontrolled to maintain specific semiconductor properties. Depending on the need, n or p impurities areadded to produce the desired characteristics. Several other methods of growing crystals exist, but thebasic concept of crystal production is the same.1-10
Figure 1-9.—Crystal furnace.The cylinder of semiconductor material that is grown is sliced into thicknesses of .010 to .020 inch inthe first step of preparation, as shown in figure 1-10. These wafers are ground and polished to remove anyirregularities and to provide the smoothest surface possible. Although both sides are polished, only theside that will receive the components must have a perfect finish.Figure 1-10.—Silicon crystal and wafers.Q17. What are the basic steps in manufacturing an IC?Q18. Computer-aided layout is used to prepare _______ devices.Q19. What purpose do masks serve?Q20. What type of substrates are used for film and hybrid ICs?1-11
Page 1 and 2: NONRESIDENTTRAININGCOURSESEPTEMBER
Page 3 and 4: PREFACEBy enrolling in this self-st
Page 5: TABLE OF CONTENTSCHAPTERPAGE1. Micr
Page 8 and 9: Module 11, Microwave Principles, ex
Page 10 and 11: INSTRUCTIONS FOR TAKING THE COURSEA
Page 12 and 13: THIS PAGE LEFT BLANK INTENTIONALLY.
Page 15 and 16: CHAPTER 1MICROELECTRONICSLEARNING O
Page 17 and 18: VACUUM-TUBE EQUIPMENTVacuum tubes w
Page 19 and 20: SOLID-STATE DEVICESNow would be a g
Page 21 and 22: FILM INTEGRATED CIRCUITS are broken
Page 23: Development of a microelectronic de
Page 27 and 28: Figure 1-12.—Planar-diffused tran
Page 29 and 30: Figure 1-14.—Vacuum evaporation o
Page 31 and 32: Figure 1-17.—Cathode-sputtering m
Page 33 and 34: Q23. How do the two types of monoli
Page 35 and 36: Figure 1-21A.—TO-5 mounting PLUG-
Page 37 and 38: Dual Inline PackageThe dual inline
Page 39 and 40: wafer, as shown in figure 1-27. Thi
Page 41 and 42: Figure 1-29.—J-K flip-flop discre
Page 43 and 44: Figure 1-31.—Lead numbering for a
Page 45 and 46: Figure 1-34.—Manufacturer's Data
Page 47: comparison to the distance between
Page 50 and 51: LEVEL III.—Drawers or pull-out ch
Page 52 and 53: Conductors located several layers b
Page 54 and 55: Figure 1-43A.—Evolution of modula
Page 56 and 57: ENVIRONMENTAL CONSIDERATIONSThe env
Page 58 and 59: SUMMARYThis topic has presented inf
Page 60 and 61: Rapid development has resulted in i
Page 62 and 63: Large DIPs are being used to packag
Page 64 and 65: MINIATURE ELECTRONICS are card asse
Page 66 and 67: Three methods of interconnecting ci
Page 68 and 69: ANSWERS TO QUESTIONS Q1. THROUGH Q5
Page 70 and 71: A43. Conventional printed circuit b
Page 72 and 73: Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
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Figure 3-10.—Solder wicking.This
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Figure 3-12B.—Motorized vacuum/pr
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INSTALLATION AND SOLDERING OF PRINT
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Figure 3-15.—Component arrangemen
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Figure 3-16.—Thermal shunt.APPLIC
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Removal of Plug-In DIPsTo remove pl
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Figure 3-19.—TO mounting techniqu
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Figure 3-21.—Flat pack in protect
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Figure 3-23.—Pcb conductor damage
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REPAIRING DELAMINATED CONDUCTORS.
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5. The repair is completed using th
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SAFETYSafety is a subject of utmost
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OBJECT OR PROCESSWORK SURFACESFLOOR
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8. When moving an ESDS device or as
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Power ToolsHazards associated with
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dispensers will prevent many accide
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A GOOD SOLDER JOINT is bright and s
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ANSWERS TO QUESTIONS Q1. THROUGH Q3
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APPENDIX IGLOSSARYALLOWANCE PARTS L
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MODULAR PACKAGING—Circuit assembl
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APPENDIX IIREFERENCE LISTCHAPTER ON
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Microelectronics—Continuedpackagi
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Assignment QuestionsInformation: Th
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1-7. Which of the following charact
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1-24. Vacuum evaporation and cathod
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___________________________________
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1-49. Ground planes and shielding a
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1-65. Which of the following types
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ASSIGNMENT 2Textbook assignment: Ch
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2-20. Turret, fork, and hook termin
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2-39. Component leads may be clippe
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2-52. To ensure a good mechanical b
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