Navy Electricity and Electronics Training Series - Historic Naval ...

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1-7. Which of the following characteristicsof a printed circuit board (pcb) is NOTan advantage over a point-to-point wiredtube circuit?1. The pcb weighs less2. The pcb eliminates the need forpoint-to-point wiring3. The pcb eliminates the need for aheavy metal chassis4. The pcb contains a limited numberof components1-8. A module in which the components aresupported by end plates is referred to as1. a pcb2. cordwood3. a substrate4. encapsulated1-9. A module which is difficult to repairbecause it is completely imbedded insolid material is one which has been1. balanced2. enveloped3. integrated4. encapsulated1-10. All components and interconnectionsare formed on or within a singlesubstrate in which of the followingunits?1-11. Monolithic integrated circuits areusually referred to as1. hybrids2. substrates3. silicon chips4. selenium rectifiers1-12. In integrated circuits, a conductive ornonconductive film is used for which ofthe following types of components?1. Capacitors and diodes2. Transistors and diodes3. Resistors and capacitors4. Resistors and transistors1-13. Which of the following types ofelectronic circuits is NOT a hybridintegrated circuit?1. Thick film and transistors2. Thin film and silicon chips3. Transistors and vacuum tubes4. Silicon chips and transistors1-14. What maximum number of logic gatesshould be expected in a large-scaleintegration circuit?1. 202. 2003. 2,0004. 20,0001. Cordwood2. Integrated circuit3. Equivalent circuit4. Printed circuit board2
1-15. Integrated circuits containing more than64,000 bits of memory are referred to as1. hybrid integration2. large-scale integration3. small-scale integration4. very large-scale integration1-16. Which of the following pieces ofequipment is used to prepare componentlayout in complex ICs?1. A mask2. A camera3. A computer4. A microscope1-17. A device that allows the depositing ofmaterial in selected areas of asemiconductor substrate, but not inothers, is known as a1. blind2. screen3. filter4. wafer mask1-18. Which of the following types of materialis preferred for film circuit substrates?1. Silicon2. Ceramic3. Germanium4. Fiberglass1-19. A typical silicon wafer hasapproximately (a) what diameter and (b)what thickness?1-20. Artificially grown silicon or germaniumcrystals are used to produce substratesfor which of the following types ofintegrated circuits?1. Hybrid2. Thin-film3. Thick-film4. Monolithic1-21. Elements penetrate the semiconductorsubstrate in (a) what type of IC but (b)do NOT penetrate the substrate in whattype of IC?1. (a) Diffused (b) thin-film2. (a) Diffused (b) epitaxial3. (a) Thick-film (b) epitaxial4. (a) Thick-film (b) thin-film1-22. Pn junctions are protected fromcontamination during the fabricationprocess by which of the followingmaterials?1. Oxide2. Silicon3. Germanium4. Photoetch1-23. The prevention of unwanted interactionor leakage between components isaccomplished by which of the followingtechniques?1. Isolation2. Insulation3. Integration4. Differentiation1. (a) 2 inches (b) 0.01 to 0.02 inches2. (a) 2 inches (b) 0.21 to 0.40 inches3. (a) 3 inches (b) 0.21 to 0.40 inches4. (a) 3 inches (b) 0.01 to 0.20 inches3
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NONRESIDENTTRAININGCOURSESEPTEMBER
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PREFACEBy enrolling in this self-st
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TABLE OF CONTENTSCHAPTERPAGE1. Micr
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Module 11, Microwave Principles, ex
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INSTRUCTIONS FOR TAKING THE COURSEA
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THIS PAGE LEFT BLANK INTENTIONALLY.
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CHAPTER 1MICROELECTRONICSLEARNING O
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VACUUM-TUBE EQUIPMENTVacuum tubes w
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SOLID-STATE DEVICESNow would be a g
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FILM INTEGRATED CIRCUITS are broken
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Development of a microelectronic de
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Figure 1-9.—Crystal furnace.The c
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Figure 1-12.—Planar-diffused tran
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Figure 1-14.—Vacuum evaporation o
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Figure 1-17.—Cathode-sputtering m
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Q23. How do the two types of monoli
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Figure 1-21A.—TO-5 mounting PLUG-
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Dual Inline PackageThe dual inline
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wafer, as shown in figure 1-27. Thi
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Figure 1-29.—J-K flip-flop discre
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Figure 1-31.—Lead numbering for a
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Figure 1-34.—Manufacturer's Data
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comparison to the distance between
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LEVEL III.—Drawers or pull-out ch
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Conductors located several layers b
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Figure 1-43A.—Evolution of modula
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ENVIRONMENTAL CONSIDERATIONSThe env
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SUMMARYThis topic has presented inf
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Rapid development has resulted in i
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Large DIPs are being used to packag
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MINIATURE ELECTRONICS are card asse
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Three methods of interconnecting ci
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ANSWERS TO QUESTIONS Q1. THROUGH Q5
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A43. Conventional printed circuit b
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Upon satisfactory completion of a 2
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One such improvement in system test
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those that should be observed when
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Figure 2-2.—Low voltage Handpiece
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Figure 2-6.—Rotary-drive machine
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Figure 2-9.—Pana Vise.HAND TOOLSF
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Figure 2-10a.—Pliers.TweezersView
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Even though all the items are not u
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Figure 2-14.—Stereoscopic zoom mi
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other than eutectic, go through a p
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A1. Chief of Naval Operations (CNO)
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CAUTIONTHIS SECTION IS NOT, IN ANY
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The coating material can best be id
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Figure 3-3.—Rotary tool conformal
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Figure 3-4A.—Eyelets (interfacial
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Figure 3-5B.—Clinched leads. SEMI
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Figure 3-8A.—Terminals. PIN AND T
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Figure 3-8E.—Terminals. SOLDER CU
Page 108 and 109: Figure 3-10.—Solder wicking.This
Page 110 and 111: Figure 3-12B.—Motorized vacuum/pr
Page 112 and 113: INSTALLATION AND SOLDERING OF PRINT
Page 114 and 115: Figure 3-15.—Component arrangemen
Page 116 and 117: Figure 3-16.—Thermal shunt.APPLIC
Page 118 and 119: Removal of Plug-In DIPsTo remove pl
Page 120 and 121: Figure 3-19.—TO mounting techniqu
Page 122 and 123: Figure 3-21.—Flat pack in protect
Page 124 and 125: Figure 3-23.—Pcb conductor damage
Page 126 and 127: REPAIRING DELAMINATED CONDUCTORS.
Page 128 and 129: 5. The repair is completed using th
Page 130 and 131: SAFETYSafety is a subject of utmost
Page 132 and 133: OBJECT OR PROCESSWORK SURFACESFLOOR
Page 134 and 135: 8. When moving an ESDS device or as
Page 136 and 137: Power ToolsHazards associated with
Page 138 and 139: dispensers will prevent many accide
Page 140 and 141: A GOOD SOLDER JOINT is bright and s
Page 142 and 143: ANSWERS TO QUESTIONS Q1. THROUGH Q3
Page 145 and 146: APPENDIX IGLOSSARYALLOWANCE PARTS L
Page 147 and 148: MODULAR PACKAGING—Circuit assembl
Page 149: APPENDIX IIREFERENCE LISTCHAPTER ON
Page 152 and 153: Microelectronics—Continuedpackagi
Page 155: Assignment QuestionsInformation: Th
Page 160 and 161: 1-24. Vacuum evaporation and cathod
Page 162 and 163: ___________________________________
Page 164 and 165: 1-49. Ground planes and shielding a
Page 166 and 167: 1-65. Which of the following types
Page 168 and 169: ASSIGNMENT 2Textbook assignment: Ch
Page 170 and 171: 2-20. Turret, fork, and hook termin
Page 172 and 173: 2-39. Component leads may be clippe
Page 174 and 175: 2-52. To ensure a good mechanical b
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