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NASA Scientific and Technical Aerospace Reports

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20060002148 American Telephone <strong>and</strong> Telegraph Technology Systems, Allentown, PA, USA<br />

The Evolution of Test Heads in High Frequency VLSI Test Systems<br />

Barber, Mark R.; 1987 IEEE International Symposium on Circuits <strong>and</strong> Systems, Volume 2; 1987, pp. 520-525; In English;<br />

See also 20060002103; Copyright; Avail.: Other Sources<br />

LSI test systems built in the 1970’s were equipped with compact, 60-pin, test heads that presented devices-under-test<br />

(DUT)s with open wires leading to lumped-capacitive loads. Today’s VLSI testers have much larger, 256-pin test heads with<br />

transmission lines leading from the DUT’s to driver-comparator circuits that are sometimes 50 cm away. Reflections within<br />

the transmission lines can cause timing measurement errors as large as 10 ns when testing MOS devices whose output<br />

impedances are not matched to the transmission lines. These errors will occur even though the automatic test equipment is<br />

adjusted to subnanosecond accuracy. From a testing point of view it would be desirable if future sub-micron silicon <strong>and</strong><br />

gallium arsenide very high speed IC’s could be designed to drive transmission lines that are terminated with matched resistors<br />

at the comparators.<br />

Author<br />

High Frequencies; Very Large Scale Integration; Systems Engineering; Comparator Circuits; Automatic Test Equipment<br />

20060002149 Ohio Univ., Athens, OH, USA<br />

VLSI Device Characterization for Accurate Delay Measurements Under Transmission Line Effects<br />

Mokari-Bolhassan, M. E.; Kang, S. M.; 1987 IEEE International Symposium on Circuits <strong>and</strong> Systems, Volume 2; 1987,<br />

pp. 526-529; In English; See also 20060002103<br />

Contract(s)/Grant(s): 85-12-109; Copyright; Avail.: Other Sources<br />

The majority of the new VLSI chips have more than 125 pins, thus making it very difficult to place the tester’s high<br />

impedance comparator circuits close to the contact pads of the device-undertest (DUT). The actual measurement of the signals<br />

form the DUT is performed at the far end of transmission lines 50 cm or more away from the contact pads. This non-ideal<br />

measurement suffers from waveform distortions <strong>and</strong> errors which are caused by the intrinsic delay of the transmission lines<br />

<strong>and</strong> also the loading conditions at both ends of the transmission lines. In this paper the non-ideal measurement problem Is<br />

analyzed with mathematical mode]s <strong>and</strong> analytical results are applied to correct the measurement errors with computer aids.<br />

A new technique is presented to evaluate the true output delay time of the DUT under specified loading conditions using the<br />

measured data from an imperfect measurement set up.<br />

Author<br />

Delay Lines; Transmission Lines; Very Large Scale Integration; Characterization; Mathematical Models<br />

20060002152 Texas A&M Univ., College Station, TX, USA<br />

Generation of Continuous-Time Two Integrator Loop OTA Filter Structures<br />

Sanchez-Sinencio, Edgar; Geiger, R<strong>and</strong>all L.; Nevarez-Lozano, Horacio; 1987 IEEE International Symposium on Circuits <strong>and</strong><br />

Systems, Volume 2; 1987, pp. 325-328; In English; See also 20060002103; Copyright; Avail.: Other Sources<br />

Generation of two integrator loop filter structures using operational Transconductance Amplifier (OTAs) <strong>and</strong> Capacitors<br />

(TAC) is presented. A direct block diagram approach is employed to generate the TAC filter structures. The basic filter building<br />

blocks consist of a Lossless Integrator, Lossy Integrators <strong>and</strong> three types of summers. They are implemented using OTAs as<br />

the active components. The resulting TAC 2nd-order filter structures, are orderly generated. The selection of the best structure<br />

depends upon the particular application or design specifications. Programmability of w (sub p 3) Q(sub p) <strong>and</strong> voltage gain<br />

is considered. The generated TAC biquadratic structures are very suitable for monolithic filters since typically only OTAs <strong>and</strong><br />

two capacitors are needed.<br />

Author<br />

Capacitors; Integrators; Operational Amplifiers; Transconductance<br />

20060002153 Canadian Marconi Co. Ltd., Montreal, Quebec, Canada<br />

Digitally Programmable SC-Filters Compatible with Semi-Custom VLSI<br />

Faruque, S. M.; Martens, W.; DeCombe, C.; 1987 IEEE International Symposium on Circuits <strong>and</strong> Systems, Volume 2; 1987,<br />

pp. 339-341; In English; See also 20060002103<br />

Contract(s)/Grant(s): A4489; Copyright; Avail.: Other Sources<br />

A design technique for programmable analog filters is proposed. The basic building block in this realization is aDtoA<br />

converter whose weighted-current output is directly fed into an integrating capacitor to obtain a programmable integrator.<br />

Analog filters based on this integrator then become digitally programmable, It has the flexibility of digital filters <strong>and</strong> can be<br />

72

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