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Callister - An introduction - 8th edition

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240 • Chapter 8 / Failure<br />

Grains<br />

SEM Micrograph<br />

Path of crack propagation<br />

Figure 8.6 (a) Schematic crosssection<br />

profile showing crack<br />

propagation through the interior<br />

of grains for transgranular<br />

fracture. (b) Scanning electron<br />

fractograph of ductile cast iron<br />

showing a transgranular fracture<br />

surface. Magnification unknown.<br />

[Figure (b) from V. J. Colangelo<br />

and F. A. Heiser, <strong>An</strong>alysis of<br />

Metallurgical Failures, 2nd<br />

<strong>edition</strong>. Copyright © 1987 by<br />

John Wiley & Sons, New York.<br />

Reprinted by permission of John<br />

Wiley & Sons, Inc.]<br />

(a)<br />

(b)<br />

transgranular<br />

fracture<br />

marking patterns will be sufficiently coarse to be discerned with the naked eye. For<br />

very hard and fine-grained metals, there will be no discernible fracture pattern. Brittle<br />

fracture in amorphous materials, such as ceramic glasses, yields a relatively shiny<br />

and smooth surface.<br />

For most brittle crystalline materials, crack propagation corresponds to the<br />

successive and repeated breaking of atomic bonds along specific crystallographic<br />

planes (Figure 8.6a); such a process is termed cleavage. This type of fracture is said<br />

to be transgranular (or transcrystalline), because the fracture cracks pass through

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