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Callister - An introduction - 8th edition
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18.13 Factors That Affect Carrier Mobility • 743<br />
1<br />
Electron mobility (m 2 /V.s)<br />
10 22 m –3<br />
742 • Chapter 18 / Electrical Properties 18.13 FACTORS THAT AFFECT CARRIER MOBILITY The conductivity (or resistivity) of a semiconducting material, in addition to being dependent on electron and/or hole concentrations, is also a function of the charge carriers’ mobilities (Equation 18.13)—that is, the ease with which electrons and holes are transported through the crystal. Furthermore, magnitudes of electron and hole mobilities are influenced by the presence of those same crystalline defects that are responsible for the scattering of electrons in metals—thermal vibrations (i.e., temperature) and impurity atoms. We now explore the manner in which dopant impurity content and temperature influence the mobilities of both electrons and holes. Influence of Dopant Content Figure 18.18 represents the dependence of electron and hole mobilities in silicon as a function of the dopant (both acceptor and donor) content, at room temperature— note that both axes on this plot are scaled logarithmically. At dopant concentrations less than about 10 20 m 3 , both carrier mobilities are at their maximum levels and independent of the doping concentration. In addition, both mobilities decrease with increasing impurity content. Also worth noting is that the mobility of electrons is always larger than the mobility of holes. Influence of Temperature The temperature dependences of electron and hole mobilities for silicon are presented in Figures 18.19a and 18.19b, respectively. Curves for several impurity dopant contents are shown for both carrier types; furthermore, both sets of axes are scaled logarithmically. From these plots, note that, for dopant concentrations of 10 24 m 3 and below, both electron and hole mobilities decrease in magnitude with rising temperature; again, this effect is due to enhanced thermal scattering of the carriers. For both electrons and holes, and dopant levels less than 10 20 m 3 , the dependence of mobility on temperature is independent of acceptor/donor concentration (i.e., is represented by a single curve). Also, for concentrations greater than 10 20 m 3 , curves in both plots are shifted to progressively lower mobility values with increasing dopant level. These latter two effects are consistent with the data presented in Figure 18.18. These previous treatments have discussed the influence of temperature and dopant content on both carrier concentration and carrier mobility. Once values of n, p, e , Mobility (m 2 /V.s) 0.1 Electrons 19 10 20 10 21 0.001 10 10 22 10 23 10 24 10 25 Holes 0.01 Impurity concentration (m –3 ) Figure 18.18 For silicon, dependence of roomtemperature electron and hole mobilities (logarithmic scale) on dopant concentration (logarithmic scale). (Adapted from W. W. Gärtner, “Temperature Dependence of Junction Transistor Parameters,” Proc. of the IRE, 45, 667, 1957. Copyright © 1957 IRE now IEEE.)
18.13 Factors That Affect Carrier Mobility • 743 1 Electron mobility (m 2 /V.s) 10 22 m –3
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Characteristics of Selected Element
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With WileyPLUS: This online teachin
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E IGHTH E DITION Materials Science
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Dedicated to our wives, Nancy and E
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viii • Preface FEATURES THAT ARE
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x • Preface 2. Answers to Concept
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Appreciation is expressed to those
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xiv • Contents 3. The Structure o
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xvi • Contents 9.12 Development o
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xviii • Contents 15.14 Factors Th
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xx • Contents 21.14 Optical Fiber
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xxii • List of Symbols HK Knoop
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Chapter 1 Introduction A familiar i
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1.2 Materials Science and Engineeri
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1.4 Classification of Materials •
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1.4 Classification of Materials •
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1.4 Classification of Materials •
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1.5 Advanced Materials • 11 aeros
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1.6 Modern Materials’ Needs • 1
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STEELS Processing Diffusion ➣ Rec
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Question • 17 REFERENCES Ashby, M
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WHY STUDY Atomic Structure and Inte
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2.3 Electrons in Atoms • 21 Orbit
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2.3 Electrons in Atoms • 23 Table
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2.3 Electrons in Atoms • 25 Table
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2.4 The Periodic Table • 27 Metal
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2.5 Bonding Forces and Energies •
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2.6 Primary Interatomic Bonds • 3
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2.6 Primary Interatomic Bonds • 3
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2.7 Secondary Bonding or van der Wa
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2.7 Secondary Bonding or van der Wa
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Summary • 39 Primary Interatomic
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Questions and Problems • 41 QUEST
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Questions and Problems • 43 Sprea
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WHY STUDY The Structure of Crystall
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lattice 3.4 Metallic Crystal Struct
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3.4 Metallic Crystal Structures •
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3.5 Density Computations • 51 EXA
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3.7 Crystal Systems • 53 Another
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3.8 Point Coordinates • 55 Concep
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3.9 Crystallographic Directions •
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3.9 Crystallographic Directions •
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3.9 Crystallographic Directions •
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3.10 Crystallographic Planes • 63
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3.10 Crystallographic Planes • 65
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3.10 Crystallographic Planes • 67
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3.12 Close-Packed Crystal Structure
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3.12 Close-Packed Crystal Structure
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3.15 Anisotropy • 73 (a) (b) grai
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3.16 X-Ray Diffraction: Determinati
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0° 3.16 X-Ray Diffraction: Determi
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3.17 Noncrystalline Solids • 79 (
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Summary • 81 Point Coordinates Cr
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Processing/Structure/Properties/Per
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Questions and Problems • 85 118.7
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Questions and Problems • 87 3.40
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Questions and Problems • 89 Inten
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WHY STUDY Imperfections in Solids?
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self-interstitial increases exponen
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2. Crystal structure. For appreciab
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4.4 Specification of Composition
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4.5 Dislocations—Linear Defects
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4.5 Dislocations—Linear Defects
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4.6 Interfacial Defects • 103 Ang
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4.6 Interfacial Defects • 105 MAT
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the order of 10 13 vibrations per s
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4.10 Microscopic Techniques • 109
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4.10 Microscopic Techniques • 111
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4.11 GRAIN SIZE DETERMINATION grain
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Summary • 115 Specification of Co
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Summary • 117 List of Symbols Sym
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Questions and Problems • 119 (a)
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Design Problems • 121 (a) at a ma
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WHY Study Diffusion? Materials of a
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5.2 Diffusion Mechanisms • 125 se
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5.3 Steady-State Diffusion • 127
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5.4 Nonsteady-State Diffusion • 1
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5.4 Nonsteady-State Diffusion • 1
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5.5 Factors That Influence Diffusio
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5.5 Factors That Influence Diffusio
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5.6 Diffusion in Semiconducting Mat
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is only an approximation), then the
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5.6 Diffusion in Semiconducting Mat
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Summary • 143 Diffusion in Semico
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Questions and Problems • 145 QUES
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Diffusion coefficient (m 2 /s) 10 -
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Design Problems • 149 the process
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WHY STUDY The Mechanical Properties
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6.2 Concepts of Stress and Strain
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6.2 Concepts of Stress and Strain
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6.3 Stress-Strain Behavior • 157
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6.4 Anelasticity • 159 Figure 6.8
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6.5 Elastic Properties Of Materials
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6.6 Tensile Properties • 163 Figu
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6.6 Tensile Properties • 165 in F
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6.6 Tensile Properties • 167 Brit
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6.6 Tensile Properties • 169 y F
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6.7 True Stress and Strain • 171
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6.9 Compressive, Shear, and Torsion
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Table 6.5 Hardness-Testing Techniqu
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Brinell Hardness Tests 15 6.10 Hard
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6.10 Hardness • 179 are contained
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6.11 Variability Of Material Proper
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6.12 Design/Safety Factors • 183
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Summary • 185 • For an isotropi
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Summary • 187 6.15 s T F True st
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Questions and Problems • 189 a lo
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Questions and Problems • 191 tens
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Questions and Problems • 193 modu
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Design Problems • 195 (a) Determi
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Chapter 7 Dislocations and Strength
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Dislocations and Plastic Deformatio
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7.3 Characteristics of Dislocations
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7.4 Slip Systems • 203 D B A (a)
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7.5 Slip in Single Crystals • 205
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7.5 Slip in Single Crystals • 207
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7.6 Plastic Deformation of Polycrys
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7.7 Deformation by Twinning • 211
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7.9 Solid-Solution Strengthening
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7.10 Strain Hardening • 215 (a) (
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7.10 Strain Hardening • 217 600 2
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7.11 RECOVERY recovery 7.12 RECRYST
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7.12 Recrystallization • 221 (e)
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7.12 Recrystallization • 223 DESI
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Summary • 225 Figure 7.25 The log
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Summary • 227 Strain Hardening
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Questions and Problems • 229 Iron
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Questions and Problems • 231 and
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Design Problems • 233 Spreadsheet
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WHY STUDY Failure? The design of a
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8.3 Ductile Fracture • 237 Figure
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8.4 Brittle Fracture • 239 8.4 BR
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8.4 Brittle Fracture • 241 SEM Mi
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8.5 Principles of Fracture Mechanic
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8.5 Principles of Fracture Mechanic
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8.5 Principles of Fracture Mechanic
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8.5 Principles of Fracture Mechanic
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8.6 Fracture Toughness Testing •
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8.6 Fracture Toughness Testing •
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8.7 Cyclic Stresses • 255 Most ce
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8.8 The S-N Curve • 257 fatigue l
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8.9 Crack Initiation and Propagatio
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8.9 Crack Initiation and Propagatio
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8.10 Factors that Affect Fatigue Li
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8.12 Generalized Creep Behavior •
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8.13 Stress and Temperature Effects
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8.15 Alloys For High-Temperature Us
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Summary • 271 Ductile Fracture
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Summary • 273 • The presence of
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fatigue limit fatigue strength frac
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Questions and Problems • 277 Cycl
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Design Problems • 279 8.31 A cyli
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Chapter 9 Phase Diagrams The graph
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Definitions and Basic Concepts 9.2
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9.5 PHASE EQUILIBRIA equilibrium fr
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phases is along curve aO—likewise
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9.8 Interpretation of Phase Diagram
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9.8 Interpretation of Phase Diagram
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9.8 Interpretation of Phase Diagram
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9.9 Development of Microstructure i
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9.10 Mechanical Properties of Isomo
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9.11 Binary Eutectic Systems • 29
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9.11 Binary Eutectic Systems • 30
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9.11 Binary Eutectic Systems • 30
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9.12 Development of Microstructure
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9.12 Development of Microstructure
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9.12 Development of Microstructure
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9.13 Equilibrium Diagrams Having In
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9.14 Eutectoid and Peritectic React
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9.15 Congruent Phase Transformation
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9.17 The Gibbs Phase Rule • 317 F
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The Iron-Carbon System 9.18 The Iro
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9.18 The Iron-Iron Carbide (Fe-Fe 3
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9.19 Development of Microstructure
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9.19 Development of Microstructure
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9.19 Development of Microstructure
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9.19 Development of Microstructure
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Summary • 331 SUMMARY Introductio
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Summary • 333 Development of Micr
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Questions and Problems • 335 Impo
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Questions and Problems • 337 (b)
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Questions and Problems • 339 Figu
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Questions and Problems • 341 9.54
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WHY STUDY Phase Transformations? Th
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10.3 The Kinetics of Phase Transfor
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10.3 The Kinetics of Phase Transfor
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10.3 The Kinetics of Phase Transfor
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10.3 The Kinetics of Phase Transfor
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10.3 The Kinetics of Phase Transfor
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10.4 Metastable versus Equilibrium
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10.5 Isothermal Transformation Diag
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10.5 Isothermal Transformation Diag
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10.5 Isothermal Transformation Diag
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10.5 Isothermal Transformation Diag
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10.5 Isothermal Transformation Diag
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10.6 Continuous Cooling Transformat
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10.6 Continuous Cooling Transformat
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10.7 Mechanical Behavior of Iron-Ca
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10.7 Mechanical Behavior of Iron-Ca
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10.8 TEMPERED MARTENSITE In the as-
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10.8 Tempered Martensite • 377 (b
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10.9 Review of Phase Transformation
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Summary • 381 Figure 10.37. Of co
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Summary • 383 Spheroidite—is co
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Questions and Problems • 385 Stee
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Questions and Problems • 387 10.1
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Questions and Problems • 389 (c)
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Chapter 11 Applications and Process
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11.2 Ferrous Alloys • 393 Types o
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11.2 Ferrous Alloys • 395 Table 1
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11.2 Ferrous Alloys • 397 Table 1
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11.2 Ferrous Alloys • 399 is exte
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11.2 Ferrous Alloys • 401 (c) 20
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Table 11.5 Designations, Minimum Me
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11.2 Ferrous Alloys • 405 is pres
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11.3 Nonferrous Alloys • 407 Tabl
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11.3 Nonferrous Alloys • 409 Tabl
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11.3 Nonferrous Alloys • 411 Tabl
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Table 11.9 Compositions, Mechanical
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11.3 Nonferrous Alloys • 415 or n
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11.4 Forming Operations • 417 Met
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11.5 Casting • 419 that have rath
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11.6 Miscellaneous Techniques • 4
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11.7 Annealing Processes • 423 ox
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modification of mechanical properti
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11.8 Heat Treatment of Steels • 4
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11.8 Heat Treatment of Steels • 4
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11.8 Heat Treatment of Steels • 4
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11.8 Heat Treatment of Steels • 4
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11.8 Heat Treatment of Steels • 4
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11.9 Precipitation Hardening • 43
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11.9 Precipitation Hardening • 43
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11.9 Precipitation Hardening • 44
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Summary • 443 Forming Operations
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Summary • 445 PROCESSING Recrysta
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Questions and Problems • 447 REFE
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Design Problems • 449 and temperi
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Chapter 12 Structures and Propertie
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12.2 Crystal Structures • 453 Con
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12.2 Crystal Structures • 455 Tab
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12.2 Crystal Structures • 457 Fur
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12.2 Crystal Structures • 459 VMS
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12.2 Crystal Structures • 461 Tet
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12.2 Crystal Structures • 463 EXA
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12.3 Silicate Ceramics • 465 Si 4
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12.3 Silicate Ceramics • 467 Figu
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12.4 Carbon • 469 Figure 12.16 Sc
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Another molecular form of carbon ha
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12.5 Imperfections in Ceramics •
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12.5 Imperfections in Ceramics •
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12.7 Ceramic Phase Diagrams • 477
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12.7 Ceramic Phase Diagrams • 479
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12.8 Brittle Fracture of Ceramics
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12.8 Brittle Fracture of Ceramics
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flexural strength Flexural strength
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12.10 Mechanisms of Plastic Deforma
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viscosities at ambient temperatures
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Summary • 491 Table 12.6 Vickers
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Summary • 493 • Diagrams for Al
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Questions and Problems • 495 visc
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Questions and Problems • 497 does
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Questions and Problems • 499 Stre
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Chapter 13 Applications and Process
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13.3 Glass-Ceramics • 503 Ceramic
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13.5 Refractories • 505 Glass-cer
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13.6 Abrasives • 507 (2910F). Thu
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13.8 Advanced Ceramics • 509 Seve
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13.8 Advanced Ceramics • 511 opti
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13.9 Fabrication and Processing of
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13.9 Fabrication and Processing of
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13.9 Fabrication and Processing of
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13.10 Fabrication and Processing of
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13.10 Fabrication and Processing of
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13.11 Powder Pressing • 523 a sca
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13.12 Tape Casting • 525 Figure 1
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Summary • 527 • Requirements fo
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Summary • 529 This chapter also d
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13.12 Compare the softening points
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WHY STUDY Polymer Structures? A rel
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14.3 Polymer Molecules • 535 Tabl
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14.4 The Chemistry of Polymer Molec
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14.4 The Chemistry of Polymer Molec
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Figure 14.3 Hypothetical polymer mo
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14.5 Molecular Weight • 543 Table
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14.7 Molecular Structure • 545 Fi
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14.8 Molecular Configurations • 5
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14.8 Molecular Configurations • 5
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14.10 Copolymers • 551 adjacent c
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14.11 Polymer Crystallinity • 553
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For copolymers, as a general rule,
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14.12 Polymer Crystals • 557 ~ 10
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14.14 Diffusion in Polymeric Materi
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Summary • 561 PET is permeable to
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Equation Summary Summary • 563 Po
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Important Terms and Concepts Questi
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Questions and Problems • 567 age
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Chapter 15 Characteristics, Applica
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15.2 Stress-Strain Behavior • 571
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15.3 Macroscopic Deformation • 57
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15.4 Viscoelastic Deformation • 5
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15.4 Viscoelastic Deformation • 5
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15.5 Fracture of Polymers • 579 F
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15.7 Deformation of Semicrystalline
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t 0 t t 0 t 0 Stage 1 Stage 2 (a) (
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15.8 Factors That Influence the Mec
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15.8 Factors That Influence the Mec
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15.9 Deformation of Elastomers •
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15.10 Crystallization • 591 Norma
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15.13 Melting and Glass Transition
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15.14 Factors That Influence Meltin
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15.15 Plastics • 597 Table 15.3 (
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15.16 Elastomers • 599 ing phenol
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15.18 Miscellaneous Applications
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15.19 Advanced Polymeric Materials
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15.19 Advanced Polymeric Materials
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The tensile modulus of this TPE mat
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15.20 Polymerization • 609 Additi
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15.22 Forming Techniques for Plasti
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15.22 Forming Techniques for Plasti
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15.24 Fabrication of Fibers and Fil
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Factors That Influence the Mechanic
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Summary • 619 Equation Summary Eq
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Questions and Problems • 621 McCr
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Questions and Problems • 623 Tens
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Design Questions • 625 Elastomers
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3.1 Hardness • 627 WHY STUDY Comp
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16.1 Introduction • 629 Dispersed
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16.2 Large-Particle Composites •
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16.2 Large-Particle Composites •
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Critical fiber length—dependence
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16.5 Influence of Fiber Orientation
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16.5 Influence of Fiber Orientation
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ut, because s/E, 16.5 Influence o
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16.5 Influence of Fiber Orientation
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16.6 The Fiber Phase • 645 Applic
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eactions with the environment. Such
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16.8 Polymer-Matrix Composites •
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16.8 Polymer-Matrix Composites •
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16.9 Metal-Matrix Composites • 65
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The high-temperature creep and rupt
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16.12 HYBRID COMPOSITES hybrid comp
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16.13 Processing of Fiber-Reinforce
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16.15 Sandwich Panels • 661 Figur
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Summary • 663 they remain separat
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Summary • 665 When l l c , Equat
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References • 667 List of Symbols
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Questions and Problems • 669 16.1
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Design Problems • 671 to be align
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Chapter 17 Corrosion and Degradatio
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Corrosion of Metals 17.2 Electroche
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17.2 Electrochemical Considerations
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17.2 Electrochemical Considerations
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17.2 Electrochemical Considerations
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17.4 Prediction of Corrosion Rates
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17.4 Prediction of Corrosion Rates
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17.4 Prediction of Corrosion Rates
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17.4 Prediction of Corrosion Rates
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- Page 739 and 740: Summary • 711 marily a result of
- Page 741 and 742: Summary • 713 Corrosion Preventio
- Page 743 and 744: Questions and Problems • 715 REFE
- Page 745 and 746: Questions and Problems • 717 17.1
- Page 747 and 748: Chapter 18 Electrical Properties (b
- Page 749 and 750: 18.3 Electrical Conductivity • 72
- Page 751 and 752: 18.5 Energy Band Structures in Soli
- Page 753 and 754: valence band conduction band energy
- Page 755 and 756: covalent) and relatively weak, whic
- Page 757 and 758: 18.8 Electrical Resistivity of Meta
- Page 759 and 760: 18.9 Electrical Characteristics of
- Page 761 and 762: 18.10 Intrinsic Semiconduction •
- Page 763 and 764: 18.10 Intrinsic Semiconduction •
- Page 765 and 766: 18.11 Extrinsic Semiconduction •
- Page 767 and 768: 18.11 Extrinsic Semiconduction •
- Page 769: 18.12 The Temperature Dependence of
- Page 773 and 774: DESIGN EXAMPLE 18.1 Acceptor Impuri
- Page 775 and 776: 18.14 The Hall Effect • 747 Depen
- Page 777 and 778: 18.15 Semiconductor Devices • 749
- Page 779 and 780: 18.15 Semiconductor Devices • 751
- Page 781 and 782: 18.15 Semiconductor Devices • 753
- Page 783 and 784: 18.16 Conduction in Ionic Materials
- Page 785 and 786: ands that overlap the valence and c
- Page 787 and 788: 18.19 Field Vectors and Polarizatio
- Page 789 and 790: 18.19 Field Vectors and Polarizatio
- Page 791 and 792: ionic polarization Electric dipole
- Page 793 and 794: 18.23 Dielectric Materials • 765
- Page 795 and 796: Summary • 767 + + + + + + + + +
- Page 797 and 798: Summary • 769 • With these mate
- Page 799 and 800: Summary • 771 18.11 r i Ac i 11
- Page 801 and 802: Summary • 773 One common use for
- Page 803 and 804: Questions and Problems • 775 Elec
- Page 805 and 806: Questions and Problems • 777 The
- Page 807 and 808: Design Problems • 779 DESIGN PROB
- Page 809 and 810: Chapter 19 Thermal Properties (a) (
- Page 811 and 812: 19.2 Heat Capacity • 783 Figure 1
- Page 813 and 814: 19.3 Thermal Expansion • 785 Tabl
- Page 815 and 816: 19.3 Thermal Expansion • 787 For
- Page 817 and 818: 19.4 THERMAL CONDUCTIVITY Thermal c
- Page 819 and 820: 19.4 Thermal Conductivity • 791 F
- Page 821 and 822:
19.5 Thermal Stresses • 793 speci
- Page 823 and 824:
Summary • 795 • Coefficient-of-
- Page 825 and 826:
Questions and Problems • 797 19.8
- Page 827 and 828:
Design Problems • 799 rod be fabr
- Page 829 and 830:
WHY STUDY the Magnetic Properties o
- Page 831 and 832:
20.2 Basic Concepts • 803 I B 0 =
- Page 833 and 834:
20.3 Diamagnetism and Paramagnetism
- Page 835 and 836:
20.4 Ferromagnetism • 807 Table 2
- Page 837 and 838:
20.5 Antiferromagnetism and Ferrima
- Page 839 and 840:
20.5 Antiferromagnetism and Ferrima
- Page 841 and 842:
20.6 The Influence of Temperature o
- Page 843 and 844:
20.7 Domains and Hysteresis • 815
- Page 845 and 846:
20.7 Domains and Hysteresis • 817
- Page 847 and 848:
20.9 Soft Magnetic Materials • 81
- Page 849 and 850:
20.9 Soft Magnetic Materials • 82
- Page 851 and 852:
20.10 Hard Magnetic Materials • 8
- Page 853 and 854:
20.11 Magnetic Storage • 825 requ
- Page 855 and 856:
20.11 Magnetic Storage • 827 Figu
- Page 857 and 858:
20.12 Superconductivity • 829 Ele
- Page 859 and 860:
20.12 Superconductivity • 831 Tab
- Page 861 and 862:
Summary • 833 • For cubic ferri
- Page 863 and 864:
Questions and Problems • 835 List
- Page 865 and 866:
Questions and Problems • 837 with
- Page 867 and 868:
Design Problems • 839 H C 1T 2 H
- Page 869 and 870:
WHY STUDY the Optical Properties of
- Page 871 and 872:
21.3 Light Interactions with Solids
- Page 873 and 874:
21.4 Atomic and Electronic Interact
- Page 875 and 876:
21.5 Refraction • 847 Velocity of
- Page 877 and 878:
21.7 ABSORPTION Nonmetallic materia
- Page 879 and 880:
21.7 Absorption • 851 Reaction de
- Page 881 and 882:
21.9 Color • 853 21.9 COLOR color
- Page 883 and 884:
21.11 Luminescence • 855 Figure 2
- Page 885 and 886:
21.11 Luminescence • 857 n- and p
- Page 887 and 888:
21.13 Lasers • 859 Ruby Flash lam
- Page 889 and 890:
21.13 Lasers • 861 Partially refl
- Page 891 and 892:
21.4 Optical Fibers in Communicatio
- Page 893 and 894:
Summary • 865 Input impulse Outpu
- Page 895 and 896:
Summary • 867 Transparent nonmeta
- Page 897 and 898:
Questions and Problems • 869 Impo
- Page 899 and 900:
Design Problem • 871 fiber glass
- Page 901 and 902:
WHY STUDY Economic, Environmental,
- Page 903 and 904:
Environmental and Societal Consider
- Page 905 and 906:
Environmental and Societal Consider
- Page 907 and 908:
22.5 Recycling Issues in Materials
- Page 909 and 910:
22.5 Recycling Issues in Materials
- Page 911 and 912:
22.5 Recycling Issues in Materials
- Page 913:
Design Questions • 885 Environmen
- Page 916 and 917:
A2 • Appendix A / The Internation
- Page 918 and 919:
A4 • Appendix B / Properties of S
- Page 920 and 921:
A6 • Appendix B / Properties of S
- Page 922 and 923:
A8 • Appendix B / Properties of S
- Page 924 and 925:
A10 • Appendix B / Properties of
- Page 926 and 927:
A12 • Appendix B / Properties of
- Page 928 and 929:
A14 • Appendix B / Properties of
- Page 930 and 931:
A16 • Appendix B / Properties of
- Page 932 and 933:
A18 • Appendix B / Properties of
- Page 934 and 935:
A20 • Appendix B / Properties of
- Page 936 and 937:
A22 • Appendix B / Properties of
- Page 938 and 939:
A24 • Appendix B / Properties of
- Page 940 and 941:
A26 • Appendix B / Properties of
- Page 942 and 943:
A28 • Appendix B / Properties of
- Page 944 and 945:
A30 • Appendix B / Properties of
- Page 946 and 947:
A32 • Appendix C / Costs and Rela
- Page 948 and 949:
A34 • Appendix C / Costs and Rela
- Page 950 and 951:
Appendix D Repeat Unit Structures f
- Page 952 and 953:
A38 • Appendix D / Repeat Unit St
- Page 954 and 955:
Appendix E Glass Transition and Mel
- Page 956 and 957:
G2 • Glossary atomic mass units (
- Page 958 and 959:
G4 • Glossary according to unit c
- Page 960 and 961:
G6 • Glossary Fick’s first law.
- Page 962 and 963:
G8 • Glossary J Jominy end-quench
- Page 964 and 965:
G10 • Glossary alternating layers
- Page 966 and 967:
G12 • Glossary stock; also, elong
- Page 968 and 969:
G14 • Glossary tempered martensit
- Page 970 and 971:
Answers to Selected Problems Chapte
- Page 972 and 973:
S2 • Answers to Selected Problems
- Page 974:
S4 • Answers to Selected Problems
- Page 977 and 978:
plane strain fracture toughness, 24
- Page 979 and 980:
Clay, characteristics, 518-519 Clay
- Page 981 and 982:
Die casting, 419 Dielectric breakdo
- Page 983 and 984:
Fatigue life, 258, G4 factors that
- Page 985 and 986:
Heat treatable, definition of, 406
- Page 987 and 988:
modulus of elasticity, 486 thermal
- Page 989 and 990:
Nanotubes, carbon, 13, 471 Natural
- Page 991 and 992:
fatigue behavior (PET), 580 magneti
- Page 993 and 994:
single crystal, 451 structure of, 4
- Page 995 and 996:
Stabilized zirconia, 478, 655 Stabi
- Page 997 and 998:
Transparency, 844, G13 Transverse b
- Page 999 and 1000:
Power 1 W 0.239 cal/s 1 cal/s 4.1
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