Callister - An introduction - 8th edition

Appendix B / Properties of Selected Engineering Materials • A19
Table B.6
(Continued)
Coefficient of
Thermal Expansion
Material 10 6 (C) 1 10 6 (F) 1
GRAPHITE, CERAMICS, AND SEMICONDUCTING MATERIALS
Aluminum oxide
• 99.9% pure 7.4 4.1
• 96% pure 7.4 4.1
• 90% pure 7.0 3.9
Concrete 10.0–13.6 5.6–7.6
Diamond (natural) 0.11–1.23 0.06–0.68
Gallium arsenide 5.9 3.3
Glass, borosilicate (Pyrex) 3.3 1.8
Glass, soda–lime 9.0 5.0
Glass-ceramic (Pyroceram) 6.5 3.6
Graphite
• Extruded 2.0–2.7 1.1–1.5
• Isostatically molded 2.2–6.0 1.2–3.3
Silica, fused 0.4 0.22
Silicon 2.5 1.4
Silicon carbide
• Hot pressed 4.6 2.6
• Sintered 4.1 2.3
Silicon nitride
• Hot pressed 2.7 1.5
• Reaction bonded 3.1 1.7
• Sintered 3.1 1.7
Zirconia, 3 mol% Y 2 O 3 9.6 5.3
POLYMERS
Elastomers
• Butadiene-acrylonitrile (nitrile) 235 130
• Styrene-butadiene (SBR) 220 125
• Silicone 270 150
Epoxy 81–117 45–65
Nylon 6,6 144 80
Phenolic 122 68
Poly(butylene terephthalate) (PBT) 108–171 60–95
Polycarbonate (PC) 122 68
Polyester (thermoset) 100–180 55–100
Polyetheretherketone (PEEK) 72–85 40–47
Polyethylene
• Low density (LDPE) 180–400 100–220
• High density (HDPE) 106–198 59–110
• Ultrahigh molecular weight 234–360 130–200
(UHMWPE)
Poly(ethylene terephthalate) (PET) 117 65
Poly(methyl methacrylate) (PMMA) 90–162 50–90
Polypropylene (PP) 146–180 81–100
Polystyrene (PS) 90–150 50–83
Polytetrafluoroethylene (PTFE) 126–216 70–120
Poly(vinyl chloride) (PVC) 90–180 50–100