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Callister - An introduction - 8th edition

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18.15 Semiconductor Devices • 753<br />

Within this framework, numbers are represented by a series of two states (sometimes<br />

designated 0 and 1). Now, transistors and diodes within a digital circuit operate<br />

as switches that also have two states—on and off, or conducting and nonconducting;<br />

“off” corresponds to one binary number state, and “on” to the other. Thus, a<br />

single number may be represented by a collection of circuit elements containing<br />

transistors that are appropriately switched.<br />

Flash (Solid-State Drive) Memory<br />

A rapidly evolving information storage technology that uses semiconductor devices<br />

is flash memory. As with computer storage, flash memory is programmed and<br />

erased electronically, as described in the preceding paragraph. However, unlike<br />

computer storage, the flash technology is nonvolatile—that is, no electrical power<br />

is needed to retain the stored information.There are no moving parts (as with magnetic<br />

hard drives and magnetic tapes, Section 20.11), which makes flash memory<br />

especially attractive for general storage and transfer of data between portable devices—<br />

such as digital cameras, laptop computers, mobile phones, PDAs, digital audio players,<br />

and game consoles. Furthermore, flash technology is packaged in memory cards<br />

and USB flash drives. Unlike magnetic memory, flash packages are extremely<br />

durable and are capable of withstanding relatively wide temperature extremes as<br />

well as immersion in water.<br />

integrated circuit<br />

Microelectronic Circuitry<br />

During the past few years, the advent of microelectronic circuitry, where millions<br />

of electronic components and circuits are incorporated into a very small space, has<br />

revolutionized the field of electronics. This revolution was precipitated, in part, by<br />

aerospace technology, which necessitated computers and electronic devices that<br />

were small and had low power requirements. As a result of refinement in processing<br />

and fabrication techniques, there has been an astonishing depreciation in the<br />

cost of integrated circuitry. Consequently, at the time of this writing, personal computers<br />

are affordable to large segments of the population in many countries. Also,<br />

the use of integrated circuits has become infused into many other facets of our<br />

lives—calculators, communications, watches, industrial production and control, and<br />

all phases of the electronics industry.<br />

Inexpensive microelectronic circuits are mass produced by using some very ingenious<br />

fabrication techniques. The process begins with the growth of relatively large<br />

cylindrical single crystals of high-purity silicon from which thin circular wafers are cut.<br />

Many microelectronic or integrated circuits, sometimes called chips, are prepared on<br />

a single wafer. A chip is rectangular, typically on the order of 6 mm 1 1 4 in.2 on a side,<br />

and contains millions of circuit elements: diodes, transistors, resistors, and capacitors.<br />

Enlarged photographs of and elemental maps of a microprocessor chip are presented<br />

in Figure 18.27; these micrographs reveal the intricacy of integrated circuits. At this<br />

time, microprocessor chips with densities approaching one billion transistors are being<br />

produced, and this number doubles about every 18 months.<br />

Microelectronic circuits consist of many layers that lie within or are stacked<br />

on top of the silicon wafer in a precisely detailed pattern. Using photolithographic<br />

techniques, for each layer, very small elements are masked in accordance with a<br />

microscopic pattern. Circuit elements are constructed by the selective <strong>introduction</strong><br />

of specific materials [by diffusion (Section 5.6) or ion implantation] into unmasked<br />

regions to create localized n-type, p-type, high-resistivity, or conductive areas. This<br />

procedure is repeated layer by layer until the total integrated circuit has been<br />

fabricated, as illustrated in the MOSFET schematic (Figure 18.26). Elements of

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