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Callister - An introduction - 8th edition

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Heat treatable, definition of, 406<br />

Heat treatments, 123. See also<br />

<strong>An</strong>nealing; Phase<br />

transformations<br />

dislocation reduction, 201<br />

glass, 516–517<br />

hydrogen embrittlement, 700<br />

intergranular corrosion and, 697<br />

polymer morphology, 592<br />

polymer properties, 586<br />

for precipitation hardening,<br />

437–438<br />

recovery, recrystallization, and<br />

grain growth during, 218–225<br />

steel, 425–436<br />

Hertz, 843<br />

Heterogeneous nucleation, 350–352<br />

Hexagonal close-packed structure,<br />

49–50, G5<br />

anion stacking (ceramics),<br />

460–461<br />

Burgers vector for, 205<br />

close-packed planes (metals),<br />

69–71<br />

slip systems, 203<br />

twinning in, 211<br />

Hexagonal crystal system, 52, 54<br />

direction indices, 60–63<br />

planar indices, 67–68<br />

Hexagonal ferrites, 811<br />

Hexane, 535<br />

High carbon steels, 396, 397<br />

High-cycle fatigue, 259<br />

High polymers, 544, G5<br />

High-strength, low-alloy (HSLA)<br />

steels, 394–395, G6<br />

High-temperature superconductors,<br />

830–831<br />

Holes, 725, 733–734, G6<br />

role, diffusion in ionic materials, 476<br />

mobility:<br />

influence of dopant<br />

concentration on, 742, 743<br />

influence of temperature on,<br />

742, 743<br />

values for selected<br />

semiconductors, 734<br />

temperature dependence of<br />

concentration (Si, Ge), 740<br />

Homogeneous nucleation, 345–350<br />

Homopolymers, 540, G6<br />

Honeycomb structure, 661–662<br />

Hooke’s law, 156, 574<br />

Hot pressing, 525<br />

Hot working, 222, 417, G6. See also<br />

Heat treatments<br />

HSLA (high-strength, low-alloy)<br />

steels, 394–395, G6<br />

Hybrid composites, 657, G6<br />

Hydration, of cement, 509<br />

Hydrocarbons, 534–535<br />

Hydrogen:<br />

diffusive purification, 127, 145, 148<br />

reduction, 684<br />

Hydrogen bonding, 31, 35, 36, G6<br />

water expansion upon freezing, 37<br />

Hydrogen chloride, 36<br />

Hydrogen electrode, 678–679<br />

Hydrogen embrittlement,<br />

699–700, G6<br />

Hydrogen fluoride, 36, 42<br />

Hydrogen induced cracking, 700<br />

Hydrogen stress cracking, 700<br />

Hydroplastic forming, 519, G6<br />

Hydroplasticity, 518<br />

Hydrostatic powder pressing, 523<br />

Hypereutectoid alloys, 327–329, G6<br />

Hypoeutectoid alloys, 324–326, G6<br />

Hysteresis (magnetic), 816–817<br />

Hysteresis, ferromagnetic, G6<br />

soft and hard magnetic materials,<br />

819–820, 822–823<br />

I<br />

Ice, 37, 281, 286, 301, 340, 342<br />

Impact energy, 251, G6<br />

fine pearlite, 371<br />

temperature dependence:<br />

high-strength materials, 254<br />

low-strength FCC and HCP<br />

metals, 254<br />

low-strength steels, 253, 254<br />

Impact fracture testing, 250–254<br />

Impact strength, polymers, 580<br />

Imperfections, see Defects;<br />

Dislocations<br />

Impurities:<br />

in ceramics, 475–476<br />

diffusion, 124<br />

electrical resistivity, 729–730<br />

in metals, 93–95<br />

thermal conductivity, 790<br />

Incongruent phase transformation,<br />

315<br />

Index of refraction, 846–847, G6<br />

selected materials, 848<br />

Indices, Miller, 63–64, G8<br />

Indium antimonide, electrical<br />

characteristics, 734<br />

Induced dipoles, 35<br />

Inert gases, 26<br />

Inhibitors, 701, G6<br />

Initial permeability, 815<br />

Injection molding, 613<br />

Insulators (electrical), G6. See also<br />

Dielectric materials<br />

Index • I9<br />

ceramics and polymers as,<br />

754–756, 765<br />

color, 853–854<br />

defined, 722<br />

electron band structure, 724, 726<br />

translucency and opacity,<br />

854–855<br />

Integrated circuits, 753–754, G6<br />

interconnects, 140–141<br />

scanning electron micrograph,<br />

719, 754<br />

Interatomic bonding, 30–34<br />

Interatomic separation, 28, 29<br />

Interconnects, integrated circuits,<br />

140–141<br />

Interdiffusion, 124, G6<br />

Interfacial defects, 102–106<br />

Interfacial energies, 106<br />

for heterogeneous<br />

nucleation, 351<br />

Intergranular corrosion,<br />

696–697, G6<br />

Intergranular fracture, 241, G6<br />

Intermediate solid solutions, 311,<br />

314, G6<br />

Intermetallic compounds, 311, 439,<br />

G6<br />

Interplanar spacing, cubic<br />

crystals, 76<br />

Interstitial diffusion, 125, 126, G6<br />

Interstitial impurity defects,<br />

94, 95<br />

Interstitials:<br />

in ceramics, 472<br />

in polymers, 558<br />

self-, 93, G11<br />

Interstitial solid solutions, 94, 474,<br />

G6<br />

Intrinsic carrier concentration, 734<br />

temperature dependence for Si<br />

and Ge, 740<br />

Intrinsic conductivity, 734–735<br />

Intrinsic semiconductors, 733–736,<br />

G6<br />

Invar, Material of Importance, 788<br />

thermal properties, 785<br />

Invariant point, 299, G6<br />

Inverse lever rule, see Lever rule<br />

Inverse spinel structure, 809–810<br />

Ion cores, 33<br />

Ionic bonding, 30–31, G6<br />

in ceramics, 453<br />

Ionic character (percent), 33, 453<br />

Ionic conduction, 476, 722,<br />

755–756<br />

Ionic polarization, 763, G9<br />

Ionic radii, 454, 456<br />

Iridium, 415

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