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Callister - An introduction - 8th edition

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18.8 Electrical Resistivity of Metals • 729<br />

Electrical resistivity (10 –8 Ω.m)<br />

6<br />

5<br />

4<br />

3<br />

2<br />

1<br />

Temperature (°F)<br />

–400 –300 –200 –100 0 +100<br />

Cu + 3.32 at% Ni<br />

Cu + 2.16 at% Ni<br />

Deformed<br />

d<br />

Cu + 1.12 at% Ni<br />

i<br />

"Pure" copper<br />

Figure 18.8 The<br />

electrical resistivity versus<br />

temperature for copper<br />

and three copper–nickel<br />

alloys, one of which has<br />

been deformed. Thermal,<br />

impurity, and deformation<br />

contributions to the<br />

resistivity are indicated<br />

at 100C. [Adapted from<br />

J. O. Linde, <strong>An</strong>n. Physik,<br />

5, 219 (1932); and C. A.<br />

Wert and R. M. Thomson,<br />

Physics of Solids, 2nd<br />

<strong>edition</strong>, McGraw-Hill<br />

Book Company, New<br />

York, 1970.]<br />

t<br />

0<br />

–250 –200 –150 –100 –50 0<br />

Temperature (°C)<br />

+50<br />

Matthiessen’s rule—<br />

for a metal, total<br />

electrical resistivity<br />

equals the sum of<br />

thermal, impurity,<br />

and deformation<br />

contributions<br />

Matthiessen’s rule<br />

Dependence of<br />

thermal resistivity<br />

contribution on<br />

temperature<br />

Impurity resistivity<br />

contribution (for<br />

solid solution)—<br />

dependence on<br />

impurity<br />

concentration (atom<br />

fraction)<br />

mechanisms act independently of one another. This may be represented in mathematical<br />

form as follows:<br />

total t i d (18.9)<br />

in which t , i , and d represent the individual thermal, impurity, and deformation<br />

resistivity contributions, respectively. Equation 18.9 is sometimes known as<br />

Matthiessen’s rule. The influence of each r variable on the total resistivity is demonstrated<br />

in Figure 18.8, a plot of resistivity versus temperature for copper and several<br />

copper–nickel alloys in annealed and deformed states. The additive nature of<br />

the individual resistivity contributions is demonstrated at 100C.<br />

Influence of Temperature<br />

For the pure metal and all the copper–nickel alloys shown in Figure 18.8, the resistivity<br />

rises linearly with temperature above about 200C. Thus,<br />

(18.10)<br />

where and a are constants for each particular metal. This dependence of the thermal<br />

resistivity component on temperature is due to the increase with temperature<br />

in thermal vibrations and other lattice irregularities (e.g., vacancies), which serve as<br />

electron-scattering centers.<br />

Influence of Impurities<br />

For additions of a single impurity that forms a solid solution, the impurity resistivity<br />

is related to the impurity concentration c i in terms of the atom fraction<br />

(at%/100) as follows:<br />

r i<br />

r 0<br />

r t r 0 aT<br />

i Ac i (1 c i ) (18.11)

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