Callister - An introduction - 8th edition

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734 • Chapter 18 / Electrical Properties Table 18.3 Band Gap Energies, Electron and Hole Mobilities, and Intrinsic Electrical Conductivities at Room Temperature for Semiconducting Materials Electrical Band Gap Conductivity Electron Mobility Hole Mobility Material (eV) [(# m) 1 ] (m 2 /V# s) (m 2 /V# s) Elemental Si 1.11 4 10 4 0.14 0.05 Ge 0.67 2.2 0.38 0.18 III–V Compounds GaP 2.25 — 0.03 0.015 GaAs 1.42 10 6 0.85 0.04 InSb 0.17 2 10 4 7.7 0.07 II–VI Compounds CdS 2.40 — 0.03 — ZnTe 2.26 — 0.03 0.01 the influence of an electric field, the position of this missing electron within the crystalline lattice may be thought of as moving by the motion of other valence electrons that repeatedly fill in the incomplete bond (Figure 18.11). This process is expedited by treating a missing electron from the valence band as a positively charged particle called a hole. A hole is considered to have a charge that is of the same magnitude as that for an electron, but of opposite sign (1.6 10 19 C). Thus, in the presence of an electric field, excited electrons and holes move in opposite directions. Furthermore, in semiconductors both electrons and holes are scattered by lattice imperfections. Electrical conductivity for an intrinsic semiconductor— dependence on electron/hole concentrations and electron/hole mobilities For an intrinsic semiconductor, conductivity in terms of intrinsic carrier concentration Intrinsic Conductivity Because there are two types of charge carrier (free electrons and holes) in an intrinsic semiconductor, the expression for electrical conduction, Equation 18.8, must be modified to include a term to account for the contribution of the hole current. Therefore, we write s nem e pem h (18.13) where p is the number of holes per cubic meter and h is the hole mobility. The magnitude of h is always less than e for semiconductors. For intrinsic semiconductors, every electron promoted across the band gap leaves behind a hole in the valence band; thus, n p n i (18.14) where n i is known as the intrinsic carrier concentration. Furthermore, s ne1m e m h 2 pe1m e m h 2 n i e1m e m h 2 (18.15) The room-temperature intrinsic conductivities and electron and hole mobilities for several semiconducting materials are also presented in Table 18.3.
18.10 Intrinsic Semiconduction • 735 Si Si Si Si Si Si Si Si Figure 18.11 Electron bonding model of electrical conduction in intrinsic silicon: (a) before excitation, (b) and (c) after excitation (the subsequent free-electron and hole motions in response to an external electric field). Si Si Si Si (a) Field Si Si Si Si Hole Free electron Si Si Si Si Si Si Si Si (b) Field Si Si Si Si Free electron Si Si Si Hole Si Si Si Si Si (c)
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Characteristics of Selected Element
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With WileyPLUS: This online teachin
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E IGHTH E DITION Materials Science
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Dedicated to our wives, Nancy and E
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viii • Preface FEATURES THAT ARE
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x • Preface 2. Answers to Concept
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Appreciation is expressed to those
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xiv • Contents 3. The Structure o
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xvi • Contents 9.12 Development o
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xviii • Contents 15.14 Factors Th
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xx • Contents 21.14 Optical Fiber
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xxii • List of Symbols HK Knoop
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Chapter 1 Introduction A familiar i
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1.2 Materials Science and Engineeri
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1.4 Classification of Materials •
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1.5 Advanced Materials • 11 aeros
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1.6 Modern Materials’ Needs • 1
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STEELS Processing Diffusion ➣ Rec
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Question • 17 REFERENCES Ashby, M
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WHY STUDY Atomic Structure and Inte
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2.3 Electrons in Atoms • 21 Orbit
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2.3 Electrons in Atoms • 23 Table
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2.3 Electrons in Atoms • 25 Table
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2.4 The Periodic Table • 27 Metal
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2.5 Bonding Forces and Energies •
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2.6 Primary Interatomic Bonds • 3
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2.6 Primary Interatomic Bonds • 3
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2.7 Secondary Bonding or van der Wa
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2.7 Secondary Bonding or van der Wa
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Summary • 39 Primary Interatomic
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Questions and Problems • 41 QUEST
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Questions and Problems • 43 Sprea
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WHY STUDY The Structure of Crystall
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lattice 3.4 Metallic Crystal Struct
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3.4 Metallic Crystal Structures •
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3.5 Density Computations • 51 EXA
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3.7 Crystal Systems • 53 Another
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3.8 Point Coordinates • 55 Concep
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3.9 Crystallographic Directions •
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3.10 Crystallographic Planes • 63
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3.12 Close-Packed Crystal Structure
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3.12 Close-Packed Crystal Structure
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3.15 Anisotropy • 73 (a) (b) grai
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3.16 X-Ray Diffraction: Determinati
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0° 3.16 X-Ray Diffraction: Determi
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3.17 Noncrystalline Solids • 79 (
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Summary • 81 Point Coordinates Cr
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Processing/Structure/Properties/Per
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Questions and Problems • 85 118.7
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Questions and Problems • 89 Inten
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WHY STUDY Imperfections in Solids?
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self-interstitial increases exponen
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2. Crystal structure. For appreciab
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4.4 Specification of Composition
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4.5 Dislocations—Linear Defects
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4.5 Dislocations—Linear Defects
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4.6 Interfacial Defects • 103 Ang
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4.6 Interfacial Defects • 105 MAT
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the order of 10 13 vibrations per s
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4.10 Microscopic Techniques • 109
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4.10 Microscopic Techniques • 111
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4.11 GRAIN SIZE DETERMINATION grain
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Summary • 115 Specification of Co
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Summary • 117 List of Symbols Sym
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Questions and Problems • 119 (a)
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Design Problems • 121 (a) at a ma
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WHY Study Diffusion? Materials of a
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5.2 Diffusion Mechanisms • 125 se
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5.3 Steady-State Diffusion • 127
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5.4 Nonsteady-State Diffusion • 1
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5.4 Nonsteady-State Diffusion • 1
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5.5 Factors That Influence Diffusio
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5.5 Factors That Influence Diffusio
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5.6 Diffusion in Semiconducting Mat
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is only an approximation), then the
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5.6 Diffusion in Semiconducting Mat
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Summary • 143 Diffusion in Semico
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Questions and Problems • 145 QUES
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Diffusion coefficient (m 2 /s) 10 -
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Design Problems • 149 the process
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WHY STUDY The Mechanical Properties
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6.2 Concepts of Stress and Strain
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6.2 Concepts of Stress and Strain
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6.3 Stress-Strain Behavior • 157
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6.4 Anelasticity • 159 Figure 6.8
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6.5 Elastic Properties Of Materials
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6.6 Tensile Properties • 163 Figu
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6.6 Tensile Properties • 165 in F
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6.6 Tensile Properties • 167 Brit
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6.6 Tensile Properties • 169 y F
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6.7 True Stress and Strain • 171
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6.9 Compressive, Shear, and Torsion
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Table 6.5 Hardness-Testing Techniqu
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Brinell Hardness Tests 15 6.10 Hard
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6.10 Hardness • 179 are contained
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6.11 Variability Of Material Proper
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6.12 Design/Safety Factors • 183
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Summary • 185 • For an isotropi
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Summary • 187 6.15 s T F True st
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Questions and Problems • 189 a lo
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Questions and Problems • 191 tens
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Questions and Problems • 193 modu
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Design Problems • 195 (a) Determi
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Chapter 7 Dislocations and Strength
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Dislocations and Plastic Deformatio
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7.3 Characteristics of Dislocations
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7.4 Slip Systems • 203 D B A (a)
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7.5 Slip in Single Crystals • 205
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7.5 Slip in Single Crystals • 207
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7.6 Plastic Deformation of Polycrys
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7.7 Deformation by Twinning • 211
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7.9 Solid-Solution Strengthening
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7.10 Strain Hardening • 215 (a) (
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7.10 Strain Hardening • 217 600 2
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7.11 RECOVERY recovery 7.12 RECRYST
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7.12 Recrystallization • 221 (e)
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7.12 Recrystallization • 223 DESI
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Summary • 225 Figure 7.25 The log
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Summary • 227 Strain Hardening
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Questions and Problems • 229 Iron
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Questions and Problems • 231 and
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Design Problems • 233 Spreadsheet
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WHY STUDY Failure? The design of a
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8.3 Ductile Fracture • 237 Figure
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8.4 Brittle Fracture • 239 8.4 BR
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8.4 Brittle Fracture • 241 SEM Mi
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8.5 Principles of Fracture Mechanic
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8.6 Fracture Toughness Testing •
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8.6 Fracture Toughness Testing •
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8.7 Cyclic Stresses • 255 Most ce
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8.8 The S-N Curve • 257 fatigue l
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8.9 Crack Initiation and Propagatio
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8.9 Crack Initiation and Propagatio
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8.10 Factors that Affect Fatigue Li
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8.12 Generalized Creep Behavior •
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8.13 Stress and Temperature Effects
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8.15 Alloys For High-Temperature Us
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Summary • 271 Ductile Fracture
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Summary • 273 • The presence of
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fatigue limit fatigue strength frac
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Questions and Problems • 277 Cycl
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Design Problems • 279 8.31 A cyli
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Chapter 9 Phase Diagrams The graph
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Definitions and Basic Concepts 9.2
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9.5 PHASE EQUILIBRIA equilibrium fr
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phases is along curve aO—likewise
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9.8 Interpretation of Phase Diagram
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9.9 Development of Microstructure i
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9.10 Mechanical Properties of Isomo
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9.11 Binary Eutectic Systems • 29
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9.12 Development of Microstructure
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9.13 Equilibrium Diagrams Having In
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9.14 Eutectoid and Peritectic React
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9.15 Congruent Phase Transformation
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9.17 The Gibbs Phase Rule • 317 F
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The Iron-Carbon System 9.18 The Iro
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9.18 The Iron-Iron Carbide (Fe-Fe 3
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Summary • 331 SUMMARY Introductio
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Summary • 333 Development of Micr
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Questions and Problems • 335 Impo
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Questions and Problems • 337 (b)
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Questions and Problems • 339 Figu
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WHY STUDY Phase Transformations? Th
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10.3 The Kinetics of Phase Transfor
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10.4 Metastable versus Equilibrium
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10.5 Isothermal Transformation Diag
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10.6 Continuous Cooling Transformat
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10.6 Continuous Cooling Transformat
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10.7 Mechanical Behavior of Iron-Ca
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10.7 Mechanical Behavior of Iron-Ca
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10.8 TEMPERED MARTENSITE In the as-
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10.8 Tempered Martensite • 377 (b
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10.9 Review of Phase Transformation
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Summary • 381 Figure 10.37. Of co
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Summary • 383 Spheroidite—is co
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Questions and Problems • 385 Stee
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Questions and Problems • 389 (c)
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Chapter 11 Applications and Process
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11.2 Ferrous Alloys • 393 Types o
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11.2 Ferrous Alloys • 395 Table 1
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11.2 Ferrous Alloys • 397 Table 1
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11.2 Ferrous Alloys • 399 is exte
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11.2 Ferrous Alloys • 401 (c) 20
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Table 11.5 Designations, Minimum Me
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11.2 Ferrous Alloys • 405 is pres
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11.3 Nonferrous Alloys • 407 Tabl
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Table 11.9 Compositions, Mechanical
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11.3 Nonferrous Alloys • 415 or n
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11.4 Forming Operations • 417 Met
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11.5 Casting • 419 that have rath
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11.6 Miscellaneous Techniques • 4
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11.7 Annealing Processes • 423 ox
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modification of mechanical properti
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11.8 Heat Treatment of Steels • 4
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11.9 Precipitation Hardening • 43
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Summary • 443 Forming Operations
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Summary • 445 PROCESSING Recrysta
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Questions and Problems • 447 REFE
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Design Problems • 449 and temperi
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Chapter 12 Structures and Propertie
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12.2 Crystal Structures • 453 Con
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12.2 Crystal Structures • 455 Tab
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12.2 Crystal Structures • 457 Fur
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12.2 Crystal Structures • 459 VMS
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12.2 Crystal Structures • 461 Tet
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12.2 Crystal Structures • 463 EXA
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12.3 Silicate Ceramics • 465 Si 4
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12.3 Silicate Ceramics • 467 Figu
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12.4 Carbon • 469 Figure 12.16 Sc
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Another molecular form of carbon ha
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12.5 Imperfections in Ceramics •
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12.5 Imperfections in Ceramics •
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12.7 Ceramic Phase Diagrams • 477
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12.7 Ceramic Phase Diagrams • 479
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12.8 Brittle Fracture of Ceramics
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12.8 Brittle Fracture of Ceramics
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flexural strength Flexural strength
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12.10 Mechanisms of Plastic Deforma
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viscosities at ambient temperatures
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Summary • 491 Table 12.6 Vickers
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Summary • 493 • Diagrams for Al
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Questions and Problems • 495 visc
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Questions and Problems • 497 does
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Questions and Problems • 499 Stre
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Chapter 13 Applications and Process
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13.3 Glass-Ceramics • 503 Ceramic
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13.5 Refractories • 505 Glass-cer
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13.6 Abrasives • 507 (2910F). Thu
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13.8 Advanced Ceramics • 509 Seve
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13.8 Advanced Ceramics • 511 opti
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13.9 Fabrication and Processing of
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13.11 Powder Pressing • 523 a sca
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13.12 Tape Casting • 525 Figure 1
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Summary • 527 • Requirements fo
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Summary • 529 This chapter also d
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13.12 Compare the softening points
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WHY STUDY Polymer Structures? A rel
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14.3 Polymer Molecules • 535 Tabl
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14.4 The Chemistry of Polymer Molec
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14.4 The Chemistry of Polymer Molec
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Figure 14.3 Hypothetical polymer mo
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14.5 Molecular Weight • 543 Table
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14.7 Molecular Structure • 545 Fi
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14.8 Molecular Configurations • 5
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14.8 Molecular Configurations • 5
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14.10 Copolymers • 551 adjacent c
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14.11 Polymer Crystallinity • 553
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For copolymers, as a general rule,
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14.12 Polymer Crystals • 557 ~ 10
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14.14 Diffusion in Polymeric Materi
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Summary • 561 PET is permeable to
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Equation Summary Summary • 563 Po
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Important Terms and Concepts Questi
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Questions and Problems • 567 age
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Chapter 15 Characteristics, Applica
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15.2 Stress-Strain Behavior • 571
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15.3 Macroscopic Deformation • 57
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15.4 Viscoelastic Deformation • 5
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15.4 Viscoelastic Deformation • 5
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15.5 Fracture of Polymers • 579 F
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15.7 Deformation of Semicrystalline
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t 0 t t 0 t 0 Stage 1 Stage 2 (a) (
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15.8 Factors That Influence the Mec
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15.8 Factors That Influence the Mec
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15.9 Deformation of Elastomers •
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15.10 Crystallization • 591 Norma
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15.13 Melting and Glass Transition
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15.14 Factors That Influence Meltin
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15.15 Plastics • 597 Table 15.3 (
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15.16 Elastomers • 599 ing phenol
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15.18 Miscellaneous Applications
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15.19 Advanced Polymeric Materials
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15.19 Advanced Polymeric Materials
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The tensile modulus of this TPE mat
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15.20 Polymerization • 609 Additi
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15.22 Forming Techniques for Plasti
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15.22 Forming Techniques for Plasti
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15.24 Fabrication of Fibers and Fil
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Factors That Influence the Mechanic
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Summary • 619 Equation Summary Eq
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Questions and Problems • 621 McCr
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Questions and Problems • 623 Tens
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Design Questions • 625 Elastomers
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3.1 Hardness • 627 WHY STUDY Comp
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16.1 Introduction • 629 Dispersed
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16.2 Large-Particle Composites •
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16.2 Large-Particle Composites •
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Critical fiber length—dependence
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16.5 Influence of Fiber Orientation
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ut, because s/E, 16.5 Influence o
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16.6 The Fiber Phase • 645 Applic
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eactions with the environment. Such
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16.8 Polymer-Matrix Composites •
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16.8 Polymer-Matrix Composites •
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16.9 Metal-Matrix Composites • 65
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The high-temperature creep and rupt
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16.12 HYBRID COMPOSITES hybrid comp
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16.13 Processing of Fiber-Reinforce
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16.15 Sandwich Panels • 661 Figur
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Summary • 663 they remain separat
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Summary • 665 When l l c , Equat
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References • 667 List of Symbols
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Design Problems • 671 to be align
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Chapter 17 Corrosion and Degradatio
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Corrosion of Metals 17.2 Electroche
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17.2 Electrochemical Considerations
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Page 711 and 712: 17.4 Prediction of Corrosion Rates
Page 719 and 720: 17.5 Passivity • 691 to further c
Page 721 and 722: 17.7 Forms of Corrosion • 693 sur
Page 723 and 724: 17.7 Forms of Corrosion • 695 Fig
Page 729 and 730: sodium chloride. Dilute sulfuric ac
Page 731 and 732: 17.10 Oxidation • 703 Zinc coatin
Page 733 and 734: 17.10 Oxidation • 705 Table 17.3
Page 735 and 736: Ceramic materials are frequently us
Page 737 and 738: 17.12 Bond Rupture • 709 17.12 BO
Page 739 and 740: Summary • 711 marily a result of
Page 741 and 742: Summary • 713 Corrosion Preventio
Page 743 and 744: Questions and Problems • 715 REFE
Page 745 and 746: Questions and Problems • 717 17.1
Page 747 and 748: Chapter 18 Electrical Properties (b
Page 749 and 750: 18.3 Electrical Conductivity • 72
Page 751 and 752: 18.5 Energy Band Structures in Soli
Page 753 and 754: valence band conduction band energy
Page 755 and 756: covalent) and relatively weak, whic
Page 757 and 758: 18.8 Electrical Resistivity of Meta
Page 759 and 760: 18.9 Electrical Characteristics of
Page 761: 18.10 Intrinsic Semiconduction •
Page 765 and 766: 18.11 Extrinsic Semiconduction •
Page 767 and 768: 18.11 Extrinsic Semiconduction •
Page 769 and 770: 18.12 The Temperature Dependence of
Page 771 and 772: 18.13 Factors That Affect Carrier M
Page 773 and 774: DESIGN EXAMPLE 18.1 Acceptor Impuri
Page 775 and 776: 18.14 The Hall Effect • 747 Depen
Page 777 and 778: 18.15 Semiconductor Devices • 749
Page 783 and 784: 18.16 Conduction in Ionic Materials
Page 785 and 786: ands that overlap the valence and c
Page 787 and 788: 18.19 Field Vectors and Polarizatio
Page 789 and 790: 18.19 Field Vectors and Polarizatio
Page 791 and 792: ionic polarization Electric dipole
Page 793 and 794: 18.23 Dielectric Materials • 765
Page 795 and 796: Summary • 767 + + + + + + + + +
Page 797 and 798: Summary • 769 • With these mate
Page 799 and 800: Summary • 771 18.11 r i Ac i 11
Page 801 and 802: Summary • 773 One common use for
Page 803 and 804: Questions and Problems • 775 Elec
Page 805 and 806: Questions and Problems • 777 The
Page 807 and 808: Design Problems • 779 DESIGN PROB
Page 809 and 810: Chapter 19 Thermal Properties (a) (
Page 811 and 812: 19.2 Heat Capacity • 783 Figure 1
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19.3 Thermal Expansion • 785 Tabl
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19.3 Thermal Expansion • 787 For
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19.4 THERMAL CONDUCTIVITY Thermal c
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19.4 Thermal Conductivity • 791 F
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19.5 Thermal Stresses • 793 speci
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Summary • 795 • Coefficient-of-
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Design Problems • 799 rod be fabr
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WHY STUDY the Magnetic Properties o
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20.2 Basic Concepts • 803 I B 0 =
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20.3 Diamagnetism and Paramagnetism
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20.4 Ferromagnetism • 807 Table 2
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20.5 Antiferromagnetism and Ferrima
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20.5 Antiferromagnetism and Ferrima
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20.6 The Influence of Temperature o
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20.7 Domains and Hysteresis • 815
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20.7 Domains and Hysteresis • 817
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20.9 Soft Magnetic Materials • 81
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20.9 Soft Magnetic Materials • 82
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20.10 Hard Magnetic Materials • 8
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20.11 Magnetic Storage • 825 requ
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20.11 Magnetic Storage • 827 Figu
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20.12 Superconductivity • 829 Ele
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20.12 Superconductivity • 831 Tab
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Summary • 833 • For cubic ferri
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Questions and Problems • 835 List
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Questions and Problems • 837 with
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Design Problems • 839 H C 1T 2 H
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WHY STUDY the Optical Properties of
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21.3 Light Interactions with Solids
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21.4 Atomic and Electronic Interact
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21.5 Refraction • 847 Velocity of
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21.7 ABSORPTION Nonmetallic materia
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21.7 Absorption • 851 Reaction de
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21.9 Color • 853 21.9 COLOR color
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21.11 Luminescence • 855 Figure 2
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21.11 Luminescence • 857 n- and p
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21.13 Lasers • 859 Ruby Flash lam
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21.13 Lasers • 861 Partially refl
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21.4 Optical Fibers in Communicatio
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Summary • 865 Input impulse Outpu
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Summary • 867 Transparent nonmeta
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Questions and Problems • 869 Impo
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Design Problem • 871 fiber glass
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WHY STUDY Economic, Environmental,
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Environmental and Societal Consider
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Environmental and Societal Consider
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22.5 Recycling Issues in Materials
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Design Questions • 885 Environmen
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A2 • Appendix A / The Internation
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A4 • Appendix B / Properties of S
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A10 • Appendix B / Properties of
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A32 • Appendix C / Costs and Rela
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A34 • Appendix C / Costs and Rela
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Appendix D Repeat Unit Structures f
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A38 • Appendix D / Repeat Unit St
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Appendix E Glass Transition and Mel
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G2 • Glossary atomic mass units (
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G4 • Glossary according to unit c
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G6 • Glossary Fick’s first law.
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G8 • Glossary J Jominy end-quench
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G10 • Glossary alternating layers
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G12 • Glossary stock; also, elong
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G14 • Glossary tempered martensit
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Answers to Selected Problems Chapte
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S2 • Answers to Selected Problems
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S4 • Answers to Selected Problems
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plane strain fracture toughness, 24
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Clay, characteristics, 518-519 Clay
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Die casting, 419 Dielectric breakdo
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Fatigue life, 258, G4 factors that
Page 985 and 986:
Heat treatable, definition of, 406
Page 987 and 988:
modulus of elasticity, 486 thermal
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Nanotubes, carbon, 13, 471 Natural
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fatigue behavior (PET), 580 magneti
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single crystal, 451 structure of, 4
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Stabilized zirconia, 478, 655 Stabi
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Transparency, 844, G13 Transverse b
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Power 1 W 0.239 cal/s 1 cal/s 4.1
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Callister - An introduction - 8th edition

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