Callister - An introduction - 8th edition

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772 • Chapter 18 / Electrical Properties Processing/Structure/Properties/Performance Summary Relative to the processing, in Chapter 5 we discussed principles of diffusion as they apply to semiconductors (specifically silicon). In some instances, doping of impurity atoms (which makes the semiconductor extrinsic) is accomplished by diffusion. The following diagram illustrates these relationships. Nonsteady-state diffusion (Chapter 5) Silicon Semiconductors (Processing) Specification of composition (Chapter 4) Temperature dependence of diffusion coefficient (Chapter 5) Diffusion in semiconductors (Chapter 5) Doping of semiconductors (Chapter 18) One of the important structural elements of semiconductors is electron band structure. We discussed this concept as well as band structures for both intrinsic and extrinsic materials. Band structure, to some degree, is due to the covalent (or predominantly covalent) interatomic bonding, which, in turn, is a consequence of the electron configuration of the semiconductor (Chapter 2). These relationships are noted in the following diagram. Silicon Semiconductors (Structure) Electron configuration: Si (Chapter 2) Covalent interatomic bonding (Chapter 2) Intrinsic electron band structure (narrow band gap) (Chapter 18) Extrinsic electron band structure (donor/acceptor levels) (Chapter 18) For both intrinsic and extrinsic semiconduction, electrical conductivity is a function of both carrier concentration and mobility of the carriers (electrons and/or holes). Both carrier concentration and mobility depend on temperature and impurity content. We note these relationships in the following diagram. Temperature dependence, carrier concentration Silicon Semiconductors (Properties) Electrical conductivity (definitions) Intrinsic semiconduction Electron/hole mobilities, factors that affect Extrinsic semiconduction
Summary • 773 One common use for semiconducting materials is in integrated-circuit components. In our discussion of rectifying junctions and transistors, two of these components, we detailed their electrical characteristics and mechanics of operation, per the diagram that follows. Silicon Semiconductors (Performance) p–n rectifying junctions (electrical characteristics, mechanics of operation) Transistors—junction, MOSFET (electrical characteristics, mechanics of operation) Integrated circuits This concludes our processing/structure/properties/performance commentary for silicon semiconductors. For the most part, the individual components found in the preceding interrelationships are conceptual in nature—that is, they represent the scientific (as opposed to engineering) aspects of materials. We have also generated a processing/structure/properties/performance relational diagram (for these materials) taken from the materials engineering perspective, which is presented in Figure 18.37. Processing Structure Properties Performance Growth of single crystals Photolithography Impurity doping Interconnect wiring Extrinsic band structure Conductivity type (n or p) Electrical conductivity Integrated circuit Figure 18.37 Schematic diagram that summarizes the elements of processing, structure, properties, and performance for silicon semiconductors, which includes components of materials engineering. Important Terms and Concepts acceptor state (level) capacitance conduction band conductivity, electrical dielectric dielectric constant dielectric displacement dielectric strength diode dipole, electric donor state (level) doping electron energy band energy band gap extrinsic semiconductor Fermi energy ferroelectric forward bias free electron Hall effect hole insulator integrated circuit intrinsic semiconductor ionic conduction junction transistor Matthiessen’s rule metal mobility MOSFET Ohm’s law permittivity piezoelectric polarization polarization, electronic polarization, ionic polarization, orientation rectifying junction relaxation frequency resistivity, electrical reverse bias semiconductor valence band
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Characteristics of Selected Element
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With WileyPLUS: This online teachin
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E IGHTH E DITION Materials Science
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Dedicated to our wives, Nancy and E
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viii • Preface FEATURES THAT ARE
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x • Preface 2. Answers to Concept
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Appreciation is expressed to those
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xiv • Contents 3. The Structure o
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xvi • Contents 9.12 Development o
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xviii • Contents 15.14 Factors Th
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xx • Contents 21.14 Optical Fiber
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xxii • List of Symbols HK Knoop
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Chapter 1 Introduction A familiar i
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1.2 Materials Science and Engineeri
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1.4 Classification of Materials •
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1.5 Advanced Materials • 11 aeros
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1.6 Modern Materials’ Needs • 1
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STEELS Processing Diffusion ➣ Rec
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Question • 17 REFERENCES Ashby, M
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WHY STUDY Atomic Structure and Inte
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2.3 Electrons in Atoms • 21 Orbit
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2.3 Electrons in Atoms • 23 Table
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2.3 Electrons in Atoms • 25 Table
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2.4 The Periodic Table • 27 Metal
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2.5 Bonding Forces and Energies •
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2.6 Primary Interatomic Bonds • 3
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2.6 Primary Interatomic Bonds • 3
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2.7 Secondary Bonding or van der Wa
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2.7 Secondary Bonding or van der Wa
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Summary • 39 Primary Interatomic
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Questions and Problems • 41 QUEST
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Questions and Problems • 43 Sprea
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WHY STUDY The Structure of Crystall
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lattice 3.4 Metallic Crystal Struct
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3.4 Metallic Crystal Structures •
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3.5 Density Computations • 51 EXA
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3.7 Crystal Systems • 53 Another
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3.8 Point Coordinates • 55 Concep
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3.9 Crystallographic Directions •
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3.10 Crystallographic Planes • 63
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3.12 Close-Packed Crystal Structure
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3.12 Close-Packed Crystal Structure
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3.15 Anisotropy • 73 (a) (b) grai
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3.16 X-Ray Diffraction: Determinati
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0° 3.16 X-Ray Diffraction: Determi
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3.17 Noncrystalline Solids • 79 (
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Summary • 81 Point Coordinates Cr
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Processing/Structure/Properties/Per
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Questions and Problems • 85 118.7
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Questions and Problems • 89 Inten
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WHY STUDY Imperfections in Solids?
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self-interstitial increases exponen
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2. Crystal structure. For appreciab
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4.4 Specification of Composition
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4.5 Dislocations—Linear Defects
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4.5 Dislocations—Linear Defects
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4.6 Interfacial Defects • 103 Ang
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4.6 Interfacial Defects • 105 MAT
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the order of 10 13 vibrations per s
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4.10 Microscopic Techniques • 109
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4.10 Microscopic Techniques • 111
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4.11 GRAIN SIZE DETERMINATION grain
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Summary • 115 Specification of Co
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Summary • 117 List of Symbols Sym
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Questions and Problems • 119 (a)
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Design Problems • 121 (a) at a ma
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WHY Study Diffusion? Materials of a
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5.2 Diffusion Mechanisms • 125 se
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5.3 Steady-State Diffusion • 127
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5.4 Nonsteady-State Diffusion • 1
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5.4 Nonsteady-State Diffusion • 1
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5.5 Factors That Influence Diffusio
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5.5 Factors That Influence Diffusio
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5.6 Diffusion in Semiconducting Mat
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is only an approximation), then the
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5.6 Diffusion in Semiconducting Mat
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Summary • 143 Diffusion in Semico
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Questions and Problems • 145 QUES
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Diffusion coefficient (m 2 /s) 10 -
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Design Problems • 149 the process
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WHY STUDY The Mechanical Properties
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6.2 Concepts of Stress and Strain
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6.2 Concepts of Stress and Strain
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6.3 Stress-Strain Behavior • 157
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6.4 Anelasticity • 159 Figure 6.8
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6.5 Elastic Properties Of Materials
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6.6 Tensile Properties • 163 Figu
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6.6 Tensile Properties • 165 in F
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6.6 Tensile Properties • 167 Brit
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6.6 Tensile Properties • 169 y F
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6.7 True Stress and Strain • 171
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6.9 Compressive, Shear, and Torsion
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Table 6.5 Hardness-Testing Techniqu
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Brinell Hardness Tests 15 6.10 Hard
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6.10 Hardness • 179 are contained
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6.11 Variability Of Material Proper
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6.12 Design/Safety Factors • 183
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Summary • 185 • For an isotropi
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Summary • 187 6.15 s T F True st
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Questions and Problems • 189 a lo
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Questions and Problems • 191 tens
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Questions and Problems • 193 modu
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Design Problems • 195 (a) Determi
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Chapter 7 Dislocations and Strength
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Dislocations and Plastic Deformatio
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7.3 Characteristics of Dislocations
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7.4 Slip Systems • 203 D B A (a)
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7.5 Slip in Single Crystals • 205
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7.5 Slip in Single Crystals • 207
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7.6 Plastic Deformation of Polycrys
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7.7 Deformation by Twinning • 211
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7.9 Solid-Solution Strengthening
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7.10 Strain Hardening • 215 (a) (
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7.10 Strain Hardening • 217 600 2
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7.11 RECOVERY recovery 7.12 RECRYST
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7.12 Recrystallization • 221 (e)
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7.12 Recrystallization • 223 DESI
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Summary • 225 Figure 7.25 The log
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Summary • 227 Strain Hardening
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Questions and Problems • 229 Iron
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Questions and Problems • 231 and
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Design Problems • 233 Spreadsheet
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WHY STUDY Failure? The design of a
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8.3 Ductile Fracture • 237 Figure
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8.4 Brittle Fracture • 239 8.4 BR
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8.4 Brittle Fracture • 241 SEM Mi
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8.5 Principles of Fracture Mechanic
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8.6 Fracture Toughness Testing •
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8.6 Fracture Toughness Testing •
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8.7 Cyclic Stresses • 255 Most ce
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8.8 The S-N Curve • 257 fatigue l
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8.9 Crack Initiation and Propagatio
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8.9 Crack Initiation and Propagatio
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8.10 Factors that Affect Fatigue Li
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8.12 Generalized Creep Behavior •
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8.13 Stress and Temperature Effects
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8.15 Alloys For High-Temperature Us
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Summary • 271 Ductile Fracture
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Summary • 273 • The presence of
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fatigue limit fatigue strength frac
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Questions and Problems • 277 Cycl
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Design Problems • 279 8.31 A cyli
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Chapter 9 Phase Diagrams The graph
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Definitions and Basic Concepts 9.2
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9.5 PHASE EQUILIBRIA equilibrium fr
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phases is along curve aO—likewise
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9.8 Interpretation of Phase Diagram
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9.9 Development of Microstructure i
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9.10 Mechanical Properties of Isomo
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9.11 Binary Eutectic Systems • 29
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9.12 Development of Microstructure
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9.13 Equilibrium Diagrams Having In
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9.14 Eutectoid and Peritectic React
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9.15 Congruent Phase Transformation
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9.17 The Gibbs Phase Rule • 317 F
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The Iron-Carbon System 9.18 The Iro
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9.18 The Iron-Iron Carbide (Fe-Fe 3
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Summary • 331 SUMMARY Introductio
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Summary • 333 Development of Micr
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Questions and Problems • 335 Impo
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Questions and Problems • 337 (b)
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Questions and Problems • 339 Figu
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WHY STUDY Phase Transformations? Th
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10.3 The Kinetics of Phase Transfor
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10.4 Metastable versus Equilibrium
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10.5 Isothermal Transformation Diag
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10.6 Continuous Cooling Transformat
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10.6 Continuous Cooling Transformat
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10.7 Mechanical Behavior of Iron-Ca
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10.7 Mechanical Behavior of Iron-Ca
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10.8 TEMPERED MARTENSITE In the as-
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10.8 Tempered Martensite • 377 (b
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10.9 Review of Phase Transformation
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Summary • 381 Figure 10.37. Of co
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Summary • 383 Spheroidite—is co
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Questions and Problems • 385 Stee
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Questions and Problems • 389 (c)
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Chapter 11 Applications and Process
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11.2 Ferrous Alloys • 393 Types o
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11.2 Ferrous Alloys • 395 Table 1
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11.2 Ferrous Alloys • 397 Table 1
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11.2 Ferrous Alloys • 399 is exte
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11.2 Ferrous Alloys • 401 (c) 20
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Table 11.5 Designations, Minimum Me
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11.2 Ferrous Alloys • 405 is pres
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11.3 Nonferrous Alloys • 407 Tabl
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Table 11.9 Compositions, Mechanical
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11.3 Nonferrous Alloys • 415 or n
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11.4 Forming Operations • 417 Met
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11.5 Casting • 419 that have rath
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11.6 Miscellaneous Techniques • 4
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11.7 Annealing Processes • 423 ox
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modification of mechanical properti
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11.8 Heat Treatment of Steels • 4
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11.9 Precipitation Hardening • 43
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Summary • 443 Forming Operations
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Summary • 445 PROCESSING Recrysta
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Questions and Problems • 447 REFE
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Design Problems • 449 and temperi
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Chapter 12 Structures and Propertie
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12.2 Crystal Structures • 453 Con
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12.2 Crystal Structures • 455 Tab
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12.2 Crystal Structures • 457 Fur
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12.2 Crystal Structures • 459 VMS
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12.2 Crystal Structures • 461 Tet
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12.2 Crystal Structures • 463 EXA
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12.3 Silicate Ceramics • 465 Si 4
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12.3 Silicate Ceramics • 467 Figu
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12.4 Carbon • 469 Figure 12.16 Sc
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Another molecular form of carbon ha
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12.5 Imperfections in Ceramics •
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12.5 Imperfections in Ceramics •
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12.7 Ceramic Phase Diagrams • 477
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12.7 Ceramic Phase Diagrams • 479
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12.8 Brittle Fracture of Ceramics
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12.8 Brittle Fracture of Ceramics
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flexural strength Flexural strength
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12.10 Mechanisms of Plastic Deforma
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viscosities at ambient temperatures
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Summary • 491 Table 12.6 Vickers
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Summary • 493 • Diagrams for Al
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Questions and Problems • 495 visc
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Questions and Problems • 497 does
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Questions and Problems • 499 Stre
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Chapter 13 Applications and Process
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13.3 Glass-Ceramics • 503 Ceramic
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13.5 Refractories • 505 Glass-cer
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13.6 Abrasives • 507 (2910F). Thu
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13.8 Advanced Ceramics • 509 Seve
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13.8 Advanced Ceramics • 511 opti
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13.9 Fabrication and Processing of
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13.11 Powder Pressing • 523 a sca
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13.12 Tape Casting • 525 Figure 1
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Summary • 527 • Requirements fo
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Summary • 529 This chapter also d
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13.12 Compare the softening points
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WHY STUDY Polymer Structures? A rel
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14.3 Polymer Molecules • 535 Tabl
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14.4 The Chemistry of Polymer Molec
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14.4 The Chemistry of Polymer Molec
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Figure 14.3 Hypothetical polymer mo
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14.5 Molecular Weight • 543 Table
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14.7 Molecular Structure • 545 Fi
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14.8 Molecular Configurations • 5
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14.8 Molecular Configurations • 5
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14.10 Copolymers • 551 adjacent c
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14.11 Polymer Crystallinity • 553
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For copolymers, as a general rule,
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14.12 Polymer Crystals • 557 ~ 10
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14.14 Diffusion in Polymeric Materi
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Summary • 561 PET is permeable to
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Equation Summary Summary • 563 Po
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Important Terms and Concepts Questi
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Questions and Problems • 567 age
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Chapter 15 Characteristics, Applica
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15.2 Stress-Strain Behavior • 571
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15.3 Macroscopic Deformation • 57
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15.4 Viscoelastic Deformation • 5
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15.4 Viscoelastic Deformation • 5
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15.5 Fracture of Polymers • 579 F
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15.7 Deformation of Semicrystalline
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t 0 t t 0 t 0 Stage 1 Stage 2 (a) (
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15.8 Factors That Influence the Mec
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15.8 Factors That Influence the Mec
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15.9 Deformation of Elastomers •
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15.10 Crystallization • 591 Norma
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15.13 Melting and Glass Transition
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15.14 Factors That Influence Meltin
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15.15 Plastics • 597 Table 15.3 (
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15.16 Elastomers • 599 ing phenol
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15.18 Miscellaneous Applications
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15.19 Advanced Polymeric Materials
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15.19 Advanced Polymeric Materials
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The tensile modulus of this TPE mat
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15.20 Polymerization • 609 Additi
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15.22 Forming Techniques for Plasti
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15.22 Forming Techniques for Plasti
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15.24 Fabrication of Fibers and Fil
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Factors That Influence the Mechanic
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Summary • 619 Equation Summary Eq
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Questions and Problems • 621 McCr
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Questions and Problems • 623 Tens
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Design Questions • 625 Elastomers
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3.1 Hardness • 627 WHY STUDY Comp
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16.1 Introduction • 629 Dispersed
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16.2 Large-Particle Composites •
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16.2 Large-Particle Composites •
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Critical fiber length—dependence
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16.5 Influence of Fiber Orientation
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ut, because s/E, 16.5 Influence o
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16.6 The Fiber Phase • 645 Applic
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eactions with the environment. Such
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16.8 Polymer-Matrix Composites •
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16.8 Polymer-Matrix Composites •
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16.9 Metal-Matrix Composites • 65
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The high-temperature creep and rupt
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16.12 HYBRID COMPOSITES hybrid comp
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16.13 Processing of Fiber-Reinforce
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16.15 Sandwich Panels • 661 Figur
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Summary • 663 they remain separat
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Summary • 665 When l l c , Equat
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References • 667 List of Symbols
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Design Problems • 671 to be align
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Chapter 17 Corrosion and Degradatio
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Corrosion of Metals 17.2 Electroche
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17.2 Electrochemical Considerations
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17.4 Prediction of Corrosion Rates
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17.5 Passivity • 691 to further c
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17.7 Forms of Corrosion • 693 sur
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17.7 Forms of Corrosion • 695 Fig
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sodium chloride. Dilute sulfuric ac
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17.10 Oxidation • 703 Zinc coatin
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17.10 Oxidation • 705 Table 17.3
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Ceramic materials are frequently us
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17.12 Bond Rupture • 709 17.12 BO
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Summary • 711 marily a result of
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Summary • 713 Corrosion Preventio
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Questions and Problems • 715 REFE
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Chapter 18 Electrical Properties (b
Page 749 and 750: 18.3 Electrical Conductivity • 72
Page 751 and 752: 18.5 Energy Band Structures in Soli
Page 753 and 754: valence band conduction band energy
Page 755 and 756: covalent) and relatively weak, whic
Page 757 and 758: 18.8 Electrical Resistivity of Meta
Page 759 and 760: 18.9 Electrical Characteristics of
Page 761 and 762: 18.10 Intrinsic Semiconduction •
Page 763 and 764: 18.10 Intrinsic Semiconduction •
Page 765 and 766: 18.11 Extrinsic Semiconduction •
Page 767 and 768: 18.11 Extrinsic Semiconduction •
Page 769 and 770: 18.12 The Temperature Dependence of
Page 771 and 772: 18.13 Factors That Affect Carrier M
Page 773 and 774: DESIGN EXAMPLE 18.1 Acceptor Impuri
Page 775 and 776: 18.14 The Hall Effect • 747 Depen
Page 777 and 778: 18.15 Semiconductor Devices • 749
Page 783 and 784: 18.16 Conduction in Ionic Materials
Page 785 and 786: ands that overlap the valence and c
Page 787 and 788: 18.19 Field Vectors and Polarizatio
Page 789 and 790: 18.19 Field Vectors and Polarizatio
Page 791 and 792: ionic polarization Electric dipole
Page 793 and 794: 18.23 Dielectric Materials • 765
Page 795 and 796: Summary • 767 + + + + + + + + +
Page 797 and 798: Summary • 769 • With these mate
Page 799: Summary • 771 18.11 r i Ac i 11
Page 803 and 804: Questions and Problems • 775 Elec
Page 805 and 806: Questions and Problems • 777 The
Page 807 and 808: Design Problems • 779 DESIGN PROB
Page 809 and 810: Chapter 19 Thermal Properties (a) (
Page 811 and 812: 19.2 Heat Capacity • 783 Figure 1
Page 813 and 814: 19.3 Thermal Expansion • 785 Tabl
Page 815 and 816: 19.3 Thermal Expansion • 787 For
Page 817 and 818: 19.4 THERMAL CONDUCTIVITY Thermal c
Page 819 and 820: 19.4 Thermal Conductivity • 791 F
Page 821 and 822: 19.5 Thermal Stresses • 793 speci
Page 823 and 824: Summary • 795 • Coefficient-of-
Page 825 and 826: Questions and Problems • 797 19.8
Page 827 and 828: Design Problems • 799 rod be fabr
Page 829 and 830: WHY STUDY the Magnetic Properties o
Page 831 and 832: 20.2 Basic Concepts • 803 I B 0 =
Page 833 and 834: 20.3 Diamagnetism and Paramagnetism
Page 835 and 836: 20.4 Ferromagnetism • 807 Table 2
Page 837 and 838: 20.5 Antiferromagnetism and Ferrima
Page 839 and 840: 20.5 Antiferromagnetism and Ferrima
Page 841 and 842: 20.6 The Influence of Temperature o
Page 843 and 844: 20.7 Domains and Hysteresis • 815
Page 845 and 846: 20.7 Domains and Hysteresis • 817
Page 847 and 848: 20.9 Soft Magnetic Materials • 81
Page 849 and 850: 20.9 Soft Magnetic Materials • 82
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20.10 Hard Magnetic Materials • 8
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20.11 Magnetic Storage • 825 requ
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20.11 Magnetic Storage • 827 Figu
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20.12 Superconductivity • 829 Ele
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20.12 Superconductivity • 831 Tab
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Summary • 833 • For cubic ferri
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Questions and Problems • 835 List
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Questions and Problems • 837 with
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Design Problems • 839 H C 1T 2 H
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WHY STUDY the Optical Properties of
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21.3 Light Interactions with Solids
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21.4 Atomic and Electronic Interact
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21.5 Refraction • 847 Velocity of
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21.7 ABSORPTION Nonmetallic materia
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21.7 Absorption • 851 Reaction de
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21.9 Color • 853 21.9 COLOR color
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21.11 Luminescence • 855 Figure 2
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21.11 Luminescence • 857 n- and p
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21.13 Lasers • 859 Ruby Flash lam
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21.13 Lasers • 861 Partially refl
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21.4 Optical Fibers in Communicatio
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Summary • 865 Input impulse Outpu
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Summary • 867 Transparent nonmeta
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Questions and Problems • 869 Impo
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Design Problem • 871 fiber glass
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WHY STUDY Economic, Environmental,
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Environmental and Societal Consider
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Environmental and Societal Consider
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22.5 Recycling Issues in Materials
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Page 911 and 912:
Page 913:
Design Questions • 885 Environmen
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A2 • Appendix A / The Internation
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A4 • Appendix B / Properties of S
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Page 922 and 923:
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A10 • Appendix B / Properties of
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A32 • Appendix C / Costs and Rela
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A34 • Appendix C / Costs and Rela
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Appendix D Repeat Unit Structures f
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A38 • Appendix D / Repeat Unit St
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Appendix E Glass Transition and Mel
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G2 • Glossary atomic mass units (
Page 958 and 959:
G4 • Glossary according to unit c
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G6 • Glossary Fick’s first law.
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G8 • Glossary J Jominy end-quench
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G10 • Glossary alternating layers
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G12 • Glossary stock; also, elong
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G14 • Glossary tempered martensit
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Answers to Selected Problems Chapte
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S2 • Answers to Selected Problems
Page 974:
S4 • Answers to Selected Problems
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plane strain fracture toughness, 24
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Clay, characteristics, 518-519 Clay
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Die casting, 419 Dielectric breakdo
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Fatigue life, 258, G4 factors that
Page 985 and 986:
Heat treatable, definition of, 406
Page 987 and 988:
modulus of elasticity, 486 thermal
Page 989 and 990:
Nanotubes, carbon, 13, 471 Natural
Page 991 and 992:
fatigue behavior (PET), 580 magneti
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single crystal, 451 structure of, 4
Page 995 and 996:
Stabilized zirconia, 478, 655 Stabi
Page 997 and 998:
Transparency, 844, G13 Transverse b
Page 999 and 1000:
Power 1 W 0.239 cal/s 1 cal/s 4.1
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Callister - An introduction - 8th edition

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