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Callister - An introduction - 8th edition

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A22 • Appendix B / Properties of Selected Engineering Materials<br />

Table B.7<br />

(Continued)<br />

Thermal Conductivity<br />

Material W/m K Btu/ft h F<br />

Refractory Metals<br />

Molybdenum (commercially pure) 142 82<br />

Tantalum (commercially pure) 54.4 31.4<br />

Tungsten (commercially pure) 155 89.4<br />

Miscellaneous Nonferrous Alloys<br />

Nickel 200 70 40.5<br />

Inconel 625 9.8 5.7<br />

Monel 400 21.8 12.6<br />

Haynes alloy 25 9.8 5.7<br />

Invar 10 5.8<br />

Super invar 10 5.8<br />

Kovar 17 9.8<br />

Chemical lead 35 20.2<br />

<strong>An</strong>timonial lead (6%) 29 16.8<br />

Tin (commercially pure) 60.7 35.1<br />

Lead–tin solder (60Sn–40Pb) 50 28.9<br />

Zinc (commercially pure) 108 62<br />

Zirconium, reactor grade 702 22 12.7<br />

GRAPHITE, CERAMICS, AND SEMICONDUCTING MATERIALS<br />

Aluminum oxide<br />

• 99.9% pure 39 22.5<br />

• 96% pure 35 20<br />

• 90% pure 16 9.2<br />

Concrete 1.25–1.75 0.72–1.0<br />

Diamond<br />

• Natural 1450–4650 840–2700<br />

• Synthetic 3150 1820<br />

Gallium arsenide 45.5 26.3<br />

Glass, borosilicate (Pyrex) 1.4 0.81<br />

Glass, soda–lime 1.7 1.0<br />

Glass-ceramic (Pyroceram) 3.3 1.9<br />

Graphite<br />

• Extruded 130–190 75–110<br />

• Isostatically molded 104–130 60–75<br />

Silica, fused 1.4 0.81<br />

Silicon 141 82<br />

Silicon carbide<br />

• Hot pressed 80 46.2<br />

• Sintered 71 41<br />

Silicon nitride<br />

• Hot pressed 29 17<br />

• Reaction bonded 10 6<br />

• Sintered 33 19.1<br />

Zirconia, 3 mol% Y 2 O 3 2.0–3.3 1.2–1.9<br />

POLYMERS<br />

Elastomers<br />

• Butadiene-acrylonitrile (nitrile) 0.25 0.14<br />

• Styrene-butadiene (SBR) 0.25 0.14<br />

• Silicone 0.23 0.13<br />

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