Callister - An introduction - 8th edition

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724 • Chapter 18 / Electrical Properties Energy band Energy Energy band gap Energy band Energy Equilibrium interatomic spacing Interatomic separation (a) Figure 18.3 (a) The conventional representation of the electron energy band structure for a solid material at the equilibrium interatomic separation. (b) Electron energy versus interatomic separation for an aggregate of atoms, illustrating how the energy band structure at the equilibrium separation in (a) is generated. (From Z. D. Jastrzebski, The Nature and Properties of Engineering Materials, 3rd <strong>edition</strong>. Copyright © 1987 by John Wiley & Sons, Inc. Reprinted by permission of John Wiley & Sons, Inc.) (b) Fermi energy to the highest filled state at 0 K is called the Fermi energy E f , as indicated. This energy band structure is typified by some metals, in particular those that have a single s valence electron (e.g., copper). Each copper atom has one 4s electron; however, for a solid composed of N atoms, the 4s band is capable of accommodating 2N electrons. Thus only half the available electron positions within this 4s band are filled. For the second band structure, also found in metals (Figure 18.4b), there is an overlap of an empty band and a filled band. Magnesium has this band structure. Empty band Empty band Empty conduction band Empty conduction band Band gap E f Band gap Band gap Empty states Filled states E f Filled band Filled valence band Filled valence band (a) (b) Figure 18.4 The various possible electron band structures in solids at 0 K. (a) The electron band structure found in metals such as copper, in which there are available electron states above and adjacent to filled states, in the same band. (b) The electron band structure of metals such as magnesium, wherein there is an overlap of filled and empty outer bands. (c) The electron band structure characteristic of insulators; the filled valence band is separated from the empty conduction band by a relatively large band gap (2 eV). (d) The electron band structure found in the semiconductors, which is the same as for insulators except that the band gap is relatively narrow (2 eV). (c) (d)
valence band conduction band energy band gap 18.6 Conduction in Terms of Band and Atomic Bonding Models • 725 Each isolated Mg atom has two 3s electrons. However, when a solid is formed, the 3s and 3p bands overlap. In this instance and at 0 K, the Fermi energy is taken as that energy below which, for N atoms, N states are filled, two electrons per state. The final two band structures are similar; one band (the valence band) that is completely filled with electrons is separated from an empty conduction band, and an energy band gap lies between them. For very pure materials, electrons may not have energies within this gap. The difference between the two band structures lies in the magnitude of the energy gap; for materials that are insulators, the band gap is relatively wide (Figure 18.4c), whereas for semiconductors it is narrow (Figure 18.4d). The Fermi energy for these two band structures lies within the band gap—near its center. 18.6 CONDUCTION IN TERMS OF BAND AND ATOMIC BONDING MODELS At this point in the discussion, it is vital that another concept be understood— namely, that only electrons with energies greater than the Fermi energy may be free electron hole acted on and accelerated in the presence of an electric field. These are the electrons that participate in the conduction process, which are termed free electrons. <strong>An</strong>other charged electronic entity called a hole is found in semiconductors and insulators. Holes have energies less than E f and also participate in electronic conduction. As the ensuing discussion reveals, the electrical conductivity is a direct function of the numbers of free electrons and holes. In addition, the distinction between conductors and nonconductors (insulators and semiconductors) lies in the numbers of these free electron and hole charge carriers. Metals For an electron to become free, it must be excited or promoted into one of the empty and available energy states above E f . For metals having either of the band structures shown in Figures 18.4a and 18.4b, there are vacant energy states adjacent to the highest filled state at E f . Thus, very little energy is required to promote electrons into the low-lying empty states, as shown in Figure 18.5. Generally, the energy provided by an electric field is sufficient to excite large numbers of electrons into these conducting states. For the metallic bonding model discussed in Section 2.6, it was assumed that all the valence electrons have freedom of motion and form an electron gas, which is uniformly distributed throughout the lattice of ion cores. Although these electrons are not locally bound to any particular atom, nevertheless, they must experience some excitation to become conducting electrons that are truly free. Thus, Figure 18.5 For a metal, occupancy of electron states (a) before and (b) after an electron excitation. Energy Empty states Filled states E f E f Electron excitation (a) (b)
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Characteristics of Selected Element
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E IGHTH E DITION Materials Science
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viii • Preface FEATURES THAT ARE
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x • Preface 2. Answers to Concept
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Appreciation is expressed to those
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xiv • Contents 3. The Structure o
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xvi • Contents 9.12 Development o
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xviii • Contents 15.14 Factors Th
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xx • Contents 21.14 Optical Fiber
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xxii • List of Symbols HK Knoop
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Chapter 1 Introduction A familiar i
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1.2 Materials Science and Engineeri
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1.4 Classification of Materials •
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1.5 Advanced Materials • 11 aeros
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1.6 Modern Materials’ Needs • 1
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STEELS Processing Diffusion ➣ Rec
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Question • 17 REFERENCES Ashby, M
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WHY STUDY Atomic Structure and Inte
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2.3 Electrons in Atoms • 21 Orbit
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2.3 Electrons in Atoms • 23 Table
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2.3 Electrons in Atoms • 25 Table
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2.4 The Periodic Table • 27 Metal
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2.5 Bonding Forces and Energies •
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2.6 Primary Interatomic Bonds • 3
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2.6 Primary Interatomic Bonds • 3
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2.7 Secondary Bonding or van der Wa
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2.7 Secondary Bonding or van der Wa
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Summary • 39 Primary Interatomic
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Questions and Problems • 41 QUEST
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Questions and Problems • 43 Sprea
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WHY STUDY The Structure of Crystall
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lattice 3.4 Metallic Crystal Struct
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3.4 Metallic Crystal Structures •
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3.5 Density Computations • 51 EXA
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3.7 Crystal Systems • 53 Another
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3.8 Point Coordinates • 55 Concep
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3.9 Crystallographic Directions •
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3.10 Crystallographic Planes • 63
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3.12 Close-Packed Crystal Structure
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3.12 Close-Packed Crystal Structure
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3.15 Anisotropy • 73 (a) (b) grai
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3.16 X-Ray Diffraction: Determinati
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0° 3.16 X-Ray Diffraction: Determi
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3.17 Noncrystalline Solids • 79 (
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Summary • 81 Point Coordinates Cr
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Processing/Structure/Properties/Per
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Questions and Problems • 85 118.7
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Questions and Problems • 89 Inten
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WHY STUDY Imperfections in Solids?
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self-interstitial increases exponen
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2. Crystal structure. For appreciab
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4.4 Specification of Composition
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4.5 Dislocations—Linear Defects
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4.5 Dislocations—Linear Defects
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4.6 Interfacial Defects • 103 Ang
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4.6 Interfacial Defects • 105 MAT
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the order of 10 13 vibrations per s
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4.10 Microscopic Techniques • 109
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4.10 Microscopic Techniques • 111
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4.11 GRAIN SIZE DETERMINATION grain
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Summary • 115 Specification of Co
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Summary • 117 List of Symbols Sym
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Questions and Problems • 119 (a)
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Design Problems • 121 (a) at a ma
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WHY Study Diffusion? Materials of a
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5.2 Diffusion Mechanisms • 125 se
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5.3 Steady-State Diffusion • 127
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5.4 Nonsteady-State Diffusion • 1
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5.4 Nonsteady-State Diffusion • 1
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5.5 Factors That Influence Diffusio
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5.5 Factors That Influence Diffusio
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5.6 Diffusion in Semiconducting Mat
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is only an approximation), then the
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5.6 Diffusion in Semiconducting Mat
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Summary • 143 Diffusion in Semico
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Questions and Problems • 145 QUES
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Diffusion coefficient (m 2 /s) 10 -
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Design Problems • 149 the process
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WHY STUDY The Mechanical Properties
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6.2 Concepts of Stress and Strain
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6.2 Concepts of Stress and Strain
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6.3 Stress-Strain Behavior • 157
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6.4 Anelasticity • 159 Figure 6.8
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6.5 Elastic Properties Of Materials
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6.6 Tensile Properties • 163 Figu
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6.6 Tensile Properties • 165 in F
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6.6 Tensile Properties • 167 Brit
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6.6 Tensile Properties • 169 y F
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6.7 True Stress and Strain • 171
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6.9 Compressive, Shear, and Torsion
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Table 6.5 Hardness-Testing Techniqu
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Brinell Hardness Tests 15 6.10 Hard
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6.10 Hardness • 179 are contained
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6.11 Variability Of Material Proper
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6.12 Design/Safety Factors • 183
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Summary • 185 • For an isotropi
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Summary • 187 6.15 s T F True st
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Questions and Problems • 189 a lo
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Questions and Problems • 191 tens
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Questions and Problems • 193 modu
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Design Problems • 195 (a) Determi
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Chapter 7 Dislocations and Strength
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Dislocations and Plastic Deformatio
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7.3 Characteristics of Dislocations
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7.4 Slip Systems • 203 D B A (a)
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7.5 Slip in Single Crystals • 205
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7.5 Slip in Single Crystals • 207
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7.6 Plastic Deformation of Polycrys
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7.7 Deformation by Twinning • 211
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7.9 Solid-Solution Strengthening
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7.10 Strain Hardening • 215 (a) (
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7.10 Strain Hardening • 217 600 2
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7.11 RECOVERY recovery 7.12 RECRYST
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7.12 Recrystallization • 221 (e)
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7.12 Recrystallization • 223 DESI
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Summary • 225 Figure 7.25 The log
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Summary • 227 Strain Hardening
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Questions and Problems • 229 Iron
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Questions and Problems • 231 and
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Design Problems • 233 Spreadsheet
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WHY STUDY Failure? The design of a
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8.3 Ductile Fracture • 237 Figure
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8.4 Brittle Fracture • 239 8.4 BR
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8.4 Brittle Fracture • 241 SEM Mi
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8.5 Principles of Fracture Mechanic
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8.6 Fracture Toughness Testing •
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8.6 Fracture Toughness Testing •
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8.7 Cyclic Stresses • 255 Most ce
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8.8 The S-N Curve • 257 fatigue l
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8.9 Crack Initiation and Propagatio
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8.9 Crack Initiation and Propagatio
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8.10 Factors that Affect Fatigue Li
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8.12 Generalized Creep Behavior •
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8.13 Stress and Temperature Effects
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8.15 Alloys For High-Temperature Us
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Summary • 271 Ductile Fracture
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Summary • 273 • The presence of
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fatigue limit fatigue strength frac
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Questions and Problems • 277 Cycl
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Design Problems • 279 8.31 A cyli
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Chapter 9 Phase Diagrams The graph
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Definitions and Basic Concepts 9.2
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9.5 PHASE EQUILIBRIA equilibrium fr
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phases is along curve aO—likewise
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9.8 Interpretation of Phase Diagram
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9.9 Development of Microstructure i
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9.10 Mechanical Properties of Isomo
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9.11 Binary Eutectic Systems • 29
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9.12 Development of Microstructure
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9.13 Equilibrium Diagrams Having In
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9.14 Eutectoid and Peritectic React
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9.15 Congruent Phase Transformation
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9.17 The Gibbs Phase Rule • 317 F
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The Iron-Carbon System 9.18 The Iro
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9.18 The Iron-Iron Carbide (Fe-Fe 3
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Summary • 331 SUMMARY Introductio
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Summary • 333 Development of Micr
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Questions and Problems • 335 Impo
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Questions and Problems • 337 (b)
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Questions and Problems • 339 Figu
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WHY STUDY Phase Transformations? Th
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10.3 The Kinetics of Phase Transfor
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10.4 Metastable versus Equilibrium
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10.5 Isothermal Transformation Diag
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10.6 Continuous Cooling Transformat
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10.6 Continuous Cooling Transformat
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10.7 Mechanical Behavior of Iron-Ca
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10.7 Mechanical Behavior of Iron-Ca
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10.8 TEMPERED MARTENSITE In the as-
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10.8 Tempered Martensite • 377 (b
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10.9 Review of Phase Transformation
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Summary • 381 Figure 10.37. Of co
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Summary • 383 Spheroidite—is co
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Questions and Problems • 385 Stee
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Questions and Problems • 389 (c)
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Chapter 11 Applications and Process
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11.2 Ferrous Alloys • 393 Types o
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11.2 Ferrous Alloys • 395 Table 1
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11.2 Ferrous Alloys • 397 Table 1
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11.2 Ferrous Alloys • 399 is exte
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11.2 Ferrous Alloys • 401 (c) 20
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Table 11.5 Designations, Minimum Me
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11.2 Ferrous Alloys • 405 is pres
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11.3 Nonferrous Alloys • 407 Tabl
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Table 11.9 Compositions, Mechanical
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11.3 Nonferrous Alloys • 415 or n
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11.4 Forming Operations • 417 Met
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11.5 Casting • 419 that have rath
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11.6 Miscellaneous Techniques • 4
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11.7 Annealing Processes • 423 ox
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modification of mechanical properti
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11.8 Heat Treatment of Steels • 4
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11.9 Precipitation Hardening • 43
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Summary • 443 Forming Operations
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Summary • 445 PROCESSING Recrysta
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Questions and Problems • 447 REFE
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Design Problems • 449 and temperi
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Chapter 12 Structures and Propertie
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12.2 Crystal Structures • 453 Con
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12.2 Crystal Structures • 455 Tab
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12.2 Crystal Structures • 457 Fur
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12.2 Crystal Structures • 459 VMS
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12.2 Crystal Structures • 461 Tet
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12.2 Crystal Structures • 463 EXA
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12.3 Silicate Ceramics • 465 Si 4
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12.3 Silicate Ceramics • 467 Figu
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12.4 Carbon • 469 Figure 12.16 Sc
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Another molecular form of carbon ha
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12.5 Imperfections in Ceramics •
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12.5 Imperfections in Ceramics •
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12.7 Ceramic Phase Diagrams • 477
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12.7 Ceramic Phase Diagrams • 479
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12.8 Brittle Fracture of Ceramics
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12.8 Brittle Fracture of Ceramics
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flexural strength Flexural strength
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12.10 Mechanisms of Plastic Deforma
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viscosities at ambient temperatures
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Summary • 491 Table 12.6 Vickers
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Summary • 493 • Diagrams for Al
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Questions and Problems • 495 visc
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Questions and Problems • 497 does
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Questions and Problems • 499 Stre
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Chapter 13 Applications and Process
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13.3 Glass-Ceramics • 503 Ceramic
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13.5 Refractories • 505 Glass-cer
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13.6 Abrasives • 507 (2910F). Thu
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13.8 Advanced Ceramics • 509 Seve
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13.8 Advanced Ceramics • 511 opti
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13.9 Fabrication and Processing of
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13.11 Powder Pressing • 523 a sca
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13.12 Tape Casting • 525 Figure 1
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Summary • 527 • Requirements fo
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Summary • 529 This chapter also d
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13.12 Compare the softening points
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WHY STUDY Polymer Structures? A rel
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14.3 Polymer Molecules • 535 Tabl
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14.4 The Chemistry of Polymer Molec
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14.4 The Chemistry of Polymer Molec
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Figure 14.3 Hypothetical polymer mo
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14.5 Molecular Weight • 543 Table
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14.7 Molecular Structure • 545 Fi
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14.8 Molecular Configurations • 5
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14.8 Molecular Configurations • 5
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14.10 Copolymers • 551 adjacent c
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14.11 Polymer Crystallinity • 553
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For copolymers, as a general rule,
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14.12 Polymer Crystals • 557 ~ 10
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14.14 Diffusion in Polymeric Materi
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Summary • 561 PET is permeable to
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Equation Summary Summary • 563 Po
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Important Terms and Concepts Questi
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Questions and Problems • 567 age
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Chapter 15 Characteristics, Applica
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15.2 Stress-Strain Behavior • 571
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15.3 Macroscopic Deformation • 57
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15.4 Viscoelastic Deformation • 5
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15.4 Viscoelastic Deformation • 5
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15.5 Fracture of Polymers • 579 F
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15.7 Deformation of Semicrystalline
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t 0 t t 0 t 0 Stage 1 Stage 2 (a) (
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15.8 Factors That Influence the Mec
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15.8 Factors That Influence the Mec
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15.9 Deformation of Elastomers •
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15.10 Crystallization • 591 Norma
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15.13 Melting and Glass Transition
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15.14 Factors That Influence Meltin
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15.15 Plastics • 597 Table 15.3 (
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15.16 Elastomers • 599 ing phenol
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15.18 Miscellaneous Applications
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15.19 Advanced Polymeric Materials
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15.19 Advanced Polymeric Materials
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The tensile modulus of this TPE mat
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15.20 Polymerization • 609 Additi
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15.22 Forming Techniques for Plasti
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15.22 Forming Techniques for Plasti
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15.24 Fabrication of Fibers and Fil
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Factors That Influence the Mechanic
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Summary • 619 Equation Summary Eq
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Questions and Problems • 621 McCr
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Questions and Problems • 623 Tens
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Design Questions • 625 Elastomers
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3.1 Hardness • 627 WHY STUDY Comp
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16.1 Introduction • 629 Dispersed
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16.2 Large-Particle Composites •
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16.2 Large-Particle Composites •
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Critical fiber length—dependence
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16.5 Influence of Fiber Orientation
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ut, because s/E, 16.5 Influence o
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16.6 The Fiber Phase • 645 Applic
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eactions with the environment. Such
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16.8 Polymer-Matrix Composites •
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16.8 Polymer-Matrix Composites •
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16.9 Metal-Matrix Composites • 65
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The high-temperature creep and rupt
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16.12 HYBRID COMPOSITES hybrid comp
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16.13 Processing of Fiber-Reinforce
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16.15 Sandwich Panels • 661 Figur
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Summary • 663 they remain separat
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Summary • 665 When l l c , Equat
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References • 667 List of Symbols
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Design Problems • 671 to be align
Page 701 and 702: Chapter 17 Corrosion and Degradatio
Page 703 and 704: Corrosion of Metals 17.2 Electroche
Page 705 and 706: 17.2 Electrochemical Considerations
Page 711 and 712: 17.4 Prediction of Corrosion Rates
Page 719 and 720: 17.5 Passivity • 691 to further c
Page 721 and 722: 17.7 Forms of Corrosion • 693 sur
Page 723 and 724: 17.7 Forms of Corrosion • 695 Fig
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Page 731 and 732: 17.10 Oxidation • 703 Zinc coatin
Page 733 and 734: 17.10 Oxidation • 705 Table 17.3
Page 735 and 736: Ceramic materials are frequently us
Page 737 and 738: 17.12 Bond Rupture • 709 17.12 BO
Page 739 and 740: Summary • 711 marily a result of
Page 741 and 742: Summary • 713 Corrosion Preventio
Page 743 and 744: Questions and Problems • 715 REFE
Page 745 and 746: Questions and Problems • 717 17.1
Page 747 and 748: Chapter 18 Electrical Properties (b
Page 749 and 750: 18.3 Electrical Conductivity • 72
Page 751: 18.5 Energy Band Structures in Soli
Page 755 and 756: covalent) and relatively weak, whic
Page 757 and 758: 18.8 Electrical Resistivity of Meta
Page 759 and 760: 18.9 Electrical Characteristics of
Page 761 and 762: 18.10 Intrinsic Semiconduction •
Page 763 and 764: 18.10 Intrinsic Semiconduction •
Page 765 and 766: 18.11 Extrinsic Semiconduction •
Page 767 and 768: 18.11 Extrinsic Semiconduction •
Page 769 and 770: 18.12 The Temperature Dependence of
Page 771 and 772: 18.13 Factors That Affect Carrier M
Page 773 and 774: DESIGN EXAMPLE 18.1 Acceptor Impuri
Page 775 and 776: 18.14 The Hall Effect • 747 Depen
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Page 783 and 784: 18.16 Conduction in Ionic Materials
Page 785 and 786: ands that overlap the valence and c
Page 787 and 788: 18.19 Field Vectors and Polarizatio
Page 789 and 790: 18.19 Field Vectors and Polarizatio
Page 791 and 792: ionic polarization Electric dipole
Page 793 and 794: 18.23 Dielectric Materials • 765
Page 795 and 796: Summary • 767 + + + + + + + + +
Page 797 and 798: Summary • 769 • With these mate
Page 799 and 800: Summary • 771 18.11 r i Ac i 11
Page 801 and 802: Summary • 773 One common use for
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Questions and Problems • 775 Elec
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Questions and Problems • 777 The
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Design Problems • 779 DESIGN PROB
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Chapter 19 Thermal Properties (a) (
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19.2 Heat Capacity • 783 Figure 1
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19.3 Thermal Expansion • 785 Tabl
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19.3 Thermal Expansion • 787 For
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19.4 THERMAL CONDUCTIVITY Thermal c
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19.4 Thermal Conductivity • 791 F
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19.5 Thermal Stresses • 793 speci
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Summary • 795 • Coefficient-of-
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Design Problems • 799 rod be fabr
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WHY STUDY the Magnetic Properties o
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20.2 Basic Concepts • 803 I B 0 =
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20.3 Diamagnetism and Paramagnetism
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20.4 Ferromagnetism • 807 Table 2
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20.5 Antiferromagnetism and Ferrima
Page 839 and 840:
20.5 Antiferromagnetism and Ferrima
Page 841 and 842:
20.6 The Influence of Temperature o
Page 843 and 844:
20.7 Domains and Hysteresis • 815
Page 845 and 846:
20.7 Domains and Hysteresis • 817
Page 847 and 848:
20.9 Soft Magnetic Materials • 81
Page 849 and 850:
20.9 Soft Magnetic Materials • 82
Page 851 and 852:
20.10 Hard Magnetic Materials • 8
Page 853 and 854:
20.11 Magnetic Storage • 825 requ
Page 855 and 856:
20.11 Magnetic Storage • 827 Figu
Page 857 and 858:
20.12 Superconductivity • 829 Ele
Page 859 and 860:
20.12 Superconductivity • 831 Tab
Page 861 and 862:
Summary • 833 • For cubic ferri
Page 863 and 864:
Questions and Problems • 835 List
Page 865 and 866:
Questions and Problems • 837 with
Page 867 and 868:
Design Problems • 839 H C 1T 2 H
Page 869 and 870:
WHY STUDY the Optical Properties of
Page 871 and 872:
21.3 Light Interactions with Solids
Page 873 and 874:
21.4 Atomic and Electronic Interact
Page 875 and 876:
21.5 Refraction • 847 Velocity of
Page 877 and 878:
21.7 ABSORPTION Nonmetallic materia
Page 879 and 880:
21.7 Absorption • 851 Reaction de
Page 881 and 882:
21.9 Color • 853 21.9 COLOR color
Page 883 and 884:
21.11 Luminescence • 855 Figure 2
Page 885 and 886:
21.11 Luminescence • 857 n- and p
Page 887 and 888:
21.13 Lasers • 859 Ruby Flash lam
Page 889 and 890:
21.13 Lasers • 861 Partially refl
Page 891 and 892:
21.4 Optical Fibers in Communicatio
Page 893 and 894:
Summary • 865 Input impulse Outpu
Page 895 and 896:
Summary • 867 Transparent nonmeta
Page 897 and 898:
Questions and Problems • 869 Impo
Page 899 and 900:
Design Problem • 871 fiber glass
Page 901 and 902:
WHY STUDY Economic, Environmental,
Page 903 and 904:
Environmental and Societal Consider
Page 905 and 906:
Environmental and Societal Consider
Page 907 and 908:
22.5 Recycling Issues in Materials
Page 909 and 910:
Page 911 and 912:
Page 913:
Design Questions • 885 Environmen
Page 916 and 917:
A2 • Appendix A / The Internation
Page 918 and 919:
A4 • Appendix B / Properties of S
Page 920 and 921:
Page 922 and 923:
Page 924 and 925:
A10 • Appendix B / Properties of
Page 926 and 927:
Page 928 and 929:
Page 930 and 931:
Page 932 and 933:
Page 934 and 935:
Page 936 and 937:
Page 938 and 939:
Page 940 and 941:
Page 942 and 943:
Page 944 and 945:
Page 946 and 947:
A32 • Appendix C / Costs and Rela
Page 948 and 949:
A34 • Appendix C / Costs and Rela
Page 950 and 951:
Appendix D Repeat Unit Structures f
Page 952 and 953:
A38 • Appendix D / Repeat Unit St
Page 954 and 955:
Appendix E Glass Transition and Mel
Page 956 and 957:
G2 • Glossary atomic mass units (
Page 958 and 959:
G4 • Glossary according to unit c
Page 960 and 961:
G6 • Glossary Fick’s first law.
Page 962 and 963:
G8 • Glossary J Jominy end-quench
Page 964 and 965:
G10 • Glossary alternating layers
Page 966 and 967:
G12 • Glossary stock; also, elong
Page 968 and 969:
G14 • Glossary tempered martensit
Page 970 and 971:
Answers to Selected Problems Chapte
Page 972 and 973:
S2 • Answers to Selected Problems
Page 974:
S4 • Answers to Selected Problems
Page 977 and 978:
plane strain fracture toughness, 24
Page 979 and 980:
Clay, characteristics, 518-519 Clay
Page 981 and 982:
Die casting, 419 Dielectric breakdo
Page 983 and 984:
Fatigue life, 258, G4 factors that
Page 985 and 986:
Heat treatable, definition of, 406
Page 987 and 988:
modulus of elasticity, 486 thermal
Page 989 and 990:
Nanotubes, carbon, 13, 471 Natural
Page 991 and 992:
fatigue behavior (PET), 580 magneti
Page 993 and 994:
single crystal, 451 structure of, 4
Page 995 and 996:
Stabilized zirconia, 478, 655 Stabi
Page 997 and 998:
Transparency, 844, G13 Transverse b
Page 999 and 1000:
Power 1 W 0.239 cal/s 1 cal/s 4.1
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Callister - An introduction - 8th edition

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